公开(公告)号：US07705784B2

公开(公告)日：2010-04-27

申请号：US11853020

申请日：2007-09-11

申请人： Ying-Jiunn Lai ,  Jiunn-Ming Huang ,  Kuan-Hsueh Tseng

发明人： Ying-Jiunn Lai ,  Jiunn-Ming Huang ,  Kuan-Hsueh Tseng

IPC分类号： H01Q9/04

CPC分类号： H01Q1/243 ,  H01Q5/371 ,  H01Q5/392

摘要： A multi-frequency antenna for receiving a first frequency and second frequency signals comprises a grounding element, a first conductive member, a first radiation member, and a second radiation member. The first conductive member connects to the grounding element. The first radiation member and the second radiation member connect to the first conductive member separately. The multi-frequency antenna further comprises a parasitic structure. The parasitic structure structurally encircles the second radiation member and the encirclement is a partial encirclement. Moreover, the parasitic structure connects to the grounding element.

摘要翻译： 用于接收第一频率和第二频率信号的多频天线包括接地元件，第一导电构件，第一辐射构件和第二辐射构件。 第一导电构件连接到接地元件。 第一辐射构件和第二辐射构件分别连接到第一导电构件。 多频天线还包括寄生结构。 寄生结构结构地围绕第二辐射构件，并且环绕是部分环绕。 此外，寄生结构连接到接地元件。

公开(公告)号：US20080136711A1

公开(公告)日：2008-06-12

申请号：US11853020

申请日：2007-09-11

申请人： Ying-Jiunn Lai ,  Jiunn-Ming Huang ,  Kuan-Hsueh Tseng

发明人： Ying-Jiunn Lai ,  Jiunn-Ming Huang ,  Kuan-Hsueh Tseng

IPC分类号： H01Q9/04

CPC分类号： H01Q1/243 ,  H01Q5/371 ,  H01Q5/392

摘要： A multi-frequency antenna for receiving a first frequency and second frequency signals comprises a grounding element, a first conductive member, a first radiation member, and a second radiation member. The first conductive member connects to the grounding element. The first radiation member and the second radiation member connect to the first conductive member separately. The multi-frequency antenna further comprises a parasitic structure. The parasitic structure structurally encircles the second radiation member and the encirclement is a partial encirclement. Moreover, the parasitic structure connects to the grounding element.

摘要翻译： 用于接收第一频率和第二频率信号的多频天线包括接地元件，第一导电构件，第一辐射构件和第二辐射构件。 第一导电构件连接到接地元件。 第一辐射构件和第二辐射构件分别连接到第一导电构件。 多频天线还包括寄生结构。 寄生结构结构地围绕第二辐射构件，并且环绕是部分环绕。 此外，寄生结构连接到接地元件。

公开(公告)号：US07830241B2

公开(公告)日：2010-11-09

申请号：US11485785

申请日：2006-07-12

申请人： Ying-Jiunn Lai ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Uei-Ming Jow

发明人： Ying-Jiunn Lai ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Uei-Ming Jow

IPC分类号： H01C1/012

CPC分类号： H05K1/167 ,  H01C1/14 ,  H01C7/003 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/1453

摘要： A resistor structure embedded in a multi-layer circuit board and manufacturing method thereof are provided. Resistive material is coated on any layer among the multi-layer circuit board, and two symmetric electrodes are formed in the geometric center of the resistive material area. The two electrodes are disposed in the resistive material layer and are covered by the resistive material. And the two electrodes are led out from respective bores at the central position of the resistive electrodes, for connecting to any other metal layer. This resistor structure can avoid the unstable resistance when the coated resistor is operated at high frequency, and also avoid the formation untrimmed edges during coating that affects the precision of resistance.

摘要翻译： 提供一种嵌入多层电路板的电阻结构及其制造方法。 电阻材料涂覆在多层电路板中的任何层上，并且在电阻材料区域的几何中心形成两个对称电极。 两个电极设置在电阻材料层中并被电阻材料覆盖。 并且两个电极从电阻电极的中心位置处的各个孔引出，用于连接到任何其它金属层。 这种电阻结构可以避免涂层电阻器在高频率下运行时的不稳定电阻，并且避免了在涂层期间形成未经修整的边缘，影响电阻精度。

公开(公告)号：US20090051469A1

公开(公告)日：2009-02-26

申请号：US12260254

申请日：2008-10-29

申请人： Uei-Ming Jow ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Ying-Jiunn Lai

发明人： Uei-Ming Jow ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Ying-Jiunn Lai

IPC分类号： H01P1/00

CPC分类号： H01L23/14 ,  H01F17/0006 ,  H01F41/046 ,  H01F2017/0066 ,  H01G4/30 ,  H01G4/40 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09672 ,  H01L2924/00

摘要： A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be formed above each substrate, so that one or more inductors may be fabricated thereon. One or more capacitors may be fabricated on the first substrate. Also, one or more signal transmission traces of the system impedance are formed on the second substrate of the outside layer. Therefore, the inductance of the inductor(s) is effectively enhanced. Moreover, the area of built-in components is reduced. Furthermore, it has shorter delay time, smaller dielectric loss, and better return loss for the transmission of high speed and high frequency signal.

摘要翻译： 提供了多功能复合基板结构。 具有高介电常数的第一衬底和具有低介电常数和低损耗角正切的第二衬底交错在第三衬底之上。 可以在每个衬底上方形成一个或多个磁导块，从而可以在其上制造一个或多个电感器。 可以在第一基板上制造一个或多个电容器。 此外，系统阻抗的一个或多个信号传输迹线形成在外层的第二基板上。 因此，有效地提高了电感器的电感。 此外，内置组件的面积减少。 此外，它具有更短的延迟时间，更小的介电损耗和更高的传输高速和高频信号的回波损耗。

公开(公告)号：US20080093113A1

公开(公告)日：2008-04-24

申请号：US11861297

申请日：2007-09-26

申请人： Uei-Ming Jow ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Ying-Jiunn Lai

发明人： Uei-Ming Jow ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Ying-Jiunn Lai

IPC分类号： H05K1/16

CPC分类号： H05K1/167 ,  H05K1/0224 ,  H05K1/025 ,  H05K1/0298 ,  H05K2201/0792 ,  H05K2201/09681 ,  H05K2201/0969

摘要： A complementary mirror image embedded planar resistor architecture is provided. In the architecture, a complementary hollow structure is formed on a ground plane or an electrode plane to minimize the parasitic resistance, so as to efficiently enhance the application frequency. In addition, in some cases, some signal transmission lines pass through the position below the embedded planar resistor, and if there is no shield at all, serious interference or cross talk phenomenon occurs. Therefore, the complementary hollow structure of the ground plane, the electrode plane, or a power layer adjacent to the embedded planar resistor is designed to be a mesh structure, so as to reduce the interference or cross talk phenomenon. In this manner, the whole resistor structure has preferable high frequency electrical characteristic in the circuit.

摘要翻译： 提供了一种互补镜像嵌入式平面电阻架构。 在该结构中，在接地平面或电极平面上形成互补的中空结构以最小化寄生电阻，从而有效地提高施加频率。 此外，在某些情况下，一些信号传输线通过嵌入式平面电阻器下方的位置，如果根本没有屏蔽，则会发生严重的干扰或串扰现象。 因此，将接地平面，电极平面或与嵌入式平面电阻器相邻的功率层的互补空心结构设计为网格结构，以减少干扰或串扰现象。 以这种方式，整个电阻器结构在电路中具有优选的高频电特性。

公开(公告)号：US20050168913A1

公开(公告)日：2005-08-04

申请号：US10895116

申请日：2004-07-21

申请人： Uei-Ming Jow ,  Ying-Jiunn Lai ,  Chun-Kun Wu ,  Pel-Shen Wei ,  Chang-Sheng Chen ,  Ching-Liang Weng

发明人： Uei-Ming Jow ,  Ying-Jiunn Lai ,  Chun-Kun Wu ,  Pel-Shen Wei ,  Chang-Sheng Chen ,  Ching-Liang Weng

IPC分类号： H01G4/005 ,  H01G4/012 ,  H05K1/00 ,  H05K1/16

CPC分类号： H01G4/012 ,  H05K1/0298 ,  H05K1/162 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09672

摘要： The present invention describes an intermediate for use in a capacitive printed circuit board (PCB), which relates to a capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode used to reduce inaccuracy of the error compression alignment on laminates. The invention employs a plurality of different sized metal laminates stacked for a built-in capacitor to achieve a high-precise capacitor PCB. More particularly, the invention can raise the capability of noise-immunity of a capacitive PCB applied to high frequency/speed modules and systems, and also provides precise capacitance to regular circuit design for the need of compact package and high-precise capacitance in the future.

摘要翻译： 本发明描述了一种用于电容式印刷电路板（PCB）的中间体，其涉及一种用于具有非对称电极的内置电容器的电容性装置和制造方法，所述非对称电极用于减少层压板上的误差压缩对准的不准确性 。 本发明采用多个不同尺寸的金属层压板，其堆叠用于内置电容器以实现高精度电容器PCB。 更具体地，本发明可以提高应用于高频/速度模块和系统的电容PCB的抗噪声能力，并且为将来需要紧凑封装和高精度电容的​​常规电路设计提供精确的电容 。

公开(公告)号：US08174840B2

公开(公告)日：2012-05-08

申请号：US12260254

申请日：2008-10-29

申请人： Uei-Ming Jow ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Ying-Jiunn Lai

发明人： Uei-Ming Jow ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Ying-Jiunn Lai

IPC分类号： H05K1/16

CPC分类号： H01L23/14 ,  H01F17/0006 ,  H01F41/046 ,  H01F2017/0066 ,  H01G4/30 ,  H01G4/40 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09672 ,  H01L2924/00

摘要： A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be formed above each substrate, so that one or more inductors may be fabricated thereon. One or more capacitors may be fabricated on the first substrate. Also, one or more signal transmission traces of the system impedance are formed on the second substrate of the outside layer. Therefore, the inductance of the inductor(s) is effectively enhanced. Moreover, the area of built-in components is reduced. Furthermore, it has shorter delay time, smaller dielectric loss, and better return loss for the transmission of high speed and high frequency signal.

摘要翻译： 提供了多功能复合基板结构。 具有高介电常数的第一衬底和具有低介电常数和低损耗角正切的第二衬底交错在第三衬底之上。 一个或多个导磁块可以形成在每个衬底之上，使得可以在其上制造一个或多个电感器。 可以在第一基板上制造一个或多个电容器。 此外，系统阻抗的一个或多个信号传输迹线形成在外层的第二基板上。 因此，有效地提高了电感器的电感。 此外，内置组件的面积减少。 此外，它具有更短的延迟时间，更小的介电损耗和更高的传输高速和高频信号的回波损耗。

公开(公告)号：US20080035371A1

公开(公告)日：2008-02-14

申请号：US11882814

申请日：2007-08-06

申请人： Uei-Ming Jow ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Ying-Jiunn Lai

发明人： Uei-Ming Jow ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Ying-Jiunn Lai

IPC分类号： H05K1/16 ,  G01R31/28

CPC分类号： G01R31/2818 ,  G01R31/2813 ,  G01R31/2839 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/16 ,  H05K3/46 ,  H05K2203/162 ,  Y10T29/49004

摘要： A circuit board with embedded components includes a plurality of embedded components and at least one transmission line electrically connected to at least one of the embedded components and having a terminal circuit. Therefore, a measuring device is used to be electrically connected to the transmission line and send out a signal, so as to receive a corresponding reflected signal, and then, compare the received reflected signal with a signal pattern in the database to obtain an electrical parameter of the embedded component.

摘要翻译： 具有嵌入式组件的电路板包括多个嵌入式组件和至少一个电连接到至少一个嵌入式组件并具有终端电路的传输线。 因此，使用测量装置电连接到传输线并发出信号以接收对应的反射信号，然后将接收的反射信号与数据库中的信号模式进行比较，以获得电参数 的嵌入式组件。

公开(公告)号：US20070222551A1

公开(公告)日：2007-09-27

申请号：US11485785

申请日：2006-07-12

申请人： Ying-Jiunn Lai ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Uei-Ming Jow

发明人： Ying-Jiunn Lai ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Uei-Ming Jow

IPC分类号： H01C1/012

CPC分类号： H05K1/167 ,  H01C1/14 ,  H01C7/003 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/1453

摘要： A resistor structure embedded in a multi-layer circuit board and manufacturing method thereof are provided. Resistive material is coated on any layer among the multi-layer circuit board, and two symmetric electrodes are formed in the geometric center of the resistive material area. The two electrodes are disposed in the resistive material layer and are covered by the resistive material. And the two electrodes are led out from respective bores at the central position of the resistive electrodes, for connecting to any other metal layer. This resistor structure can avoid the unstable resistance when the coated resistor is operated at high frequency, and also avoid the formation untrimmed edges during coating that affects the precision of resistance.

摘要翻译： 提供一种嵌入多层电路板的电阻结构及其制造方法。 电阻材料涂覆在多层电路板中的任何层上，并且在电阻材料区域的几何中心形成两个对称电极。 两个电极设置在电阻材料层中并被电阻材料覆盖。 并且两个电极从电阻电极的中心位置处的各个孔引出，用于连接到任何其它金属层。 这种电阻结构可以避免涂层电阻器在高频率下运行时的不稳定电阻，并且避免了在涂层期间形成未经修整的边缘，影响电阻精度。

公开(公告)号：US20070222031A1

公开(公告)日：2007-09-27

申请号：US11456094

申请日：2006-07-07

申请人： Uei-Ming Jow ,  Chang-Sheng Chen ,  Ying-Jiunn Lai ,  Chin-Sun Shyu

发明人： Uei-Ming Jow ,  Chang-Sheng Chen ,  Ying-Jiunn Lai ,  Chin-Sun Shyu

IPC分类号： H01L29/00

CPC分类号： H05K1/162 ,  H01G4/232 ,  H01G4/306 ,  H01L23/50 ,  H01L23/5223 ,  H01L28/10 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K2201/09236 ,  H05K2201/09672 ,  H01L2924/00

摘要： A capacitor structure with a cross-coupling design is provided. In the capacitor structure, conductive lines or electrode plates are coupled together by cross coupling an electrode above or below or aside the other electrode. By cross coupling and fewer vias, the largest capacitance value can be obtained within a minimum area. The capacitor structure provided can also be applied to a high-frequency high-speed module or system to enhance noise inhibition capability of a capacitive substrate.

摘要翻译： 提供了具有交叉耦合设计的电容器结构。 在电容器结构中，通过在另一电极上方或下方或旁边交叉耦合电极将导线或电极板耦合在一起。 通过交叉耦合和较少的通孔，可以在最小区域内获得最大的电容值。 所提供的电容器结构也可以应用于高频高速模块或系统，以增强电容性基板的噪声抑制能力。