公开(公告)号：US5436503A

公开(公告)日：1995-07-25

申请号：US153108

申请日：1993-11-17

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  H01L23/48 ,  H01L29/41 ,  H01L29/47

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5622590A

公开(公告)日：1997-04-22

申请号：US430484

申请日：1995-04-28

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  B32B7/12 ,  B29C65/54 ,  H01L21/58 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5550408A

公开(公告)日：1996-08-27

申请号：US408965

申请日：1995-03-23

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  H01L23/28

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2224/92125 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in a matrix. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成矩阵的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5744382A

公开(公告)日：1998-04-28

申请号：US703879

申请日：1996-08-27

申请人： Yoshifumi Kitayama ,  Kazuhiro Mori ,  Keiji Saeki ,  Takashi Akiguchi

发明人： Yoshifumi Kitayama ,  Kazuhiro Mori ,  Keiji Saeki ,  Takashi Akiguchi

IPC分类号： H01L21/603 ,  H01L21/607 ,  H01L23/31 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L23/3171 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/85 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/3025

摘要： An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the water, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. Such component is packed in a package including a carrier tape having therethrough a space for receiving the component with one end of such space open. A cover is applied to close the open end of the space after the component is inserted therein.

摘要翻译： 电子芯片部件包括形成在晶片上的电极，形成在水上的钝化膜，以及覆盖电极和钝化膜的暴露部分的整个表面的有机保护膜。 这种组件被包装在一个包装中，该包装带有一个带有一个空间的载带，用于接收一个这样的空间开口的部件。 在将组件插入其中之后，应用盖子封闭空间的开口端。

公开(公告)号：US5646439A

公开(公告)日：1997-07-08

申请号：US703876

申请日：1996-08-27

申请人： Yoshifumi Kitayama ,  Kazuhiro Mori ,  Keiji Saeki ,  Takashi Akiguchi

发明人： Yoshifumi Kitayama ,  Kazuhiro Mori ,  Keiji Saeki ,  Takashi Akiguchi

IPC分类号： H01L21/603 ,  H01L21/607 ,  H01L23/31 ,  H01L23/485 ,  H01L23/58

CPC分类号： H01L23/3171 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/85 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/3025

摘要： An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the wafer, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. A package for packing the component includes a carrier tape having therethrough a space for receiving the component with one end or side of the space opened, and a cover tape for closing the open end of the space after the component is stored in the space. A method for packing the component includes the steps of storing the component in the space of the carrier tape with one end of the space opened, and closing the open end of the space with the cover tape.

摘要翻译： 电子芯片部件包括形成在晶片上的电极，形成在晶片上的钝化膜和覆盖电极和钝化膜的暴露部分的整个表面的有机保护膜。 一种用于包装该组件的包装件，具有一穿过其中一个空间的载体带，该空间用于在该空间的一端或侧面打开的状态下接收该部件;以及盖带，用于在该部件被储存在该空间中之后封闭该空间的开口端。 用于包装部件的方法包括以下步骤：将部件存放在承载带的空间中，其一端敞开，并用盖带封闭空间的开口端。

公开(公告)号：US5240170A

公开(公告)日：1993-08-31

申请号：US894650

申请日：1992-06-05

申请人： Kazuto Nishida ,  Kazuhiro Nobori ,  Yoshifumi Kitayama ,  Keiji Saeki

发明人： Kazuto Nishida ,  Kazuhiro Nobori ,  Yoshifumi Kitayama ,  Keiji Saeki

IPC分类号： H01L23/495 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L23/49555 ,  H05K3/3421 ,  H01L2924/0002 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K2203/107 ,  H05K2203/306 ,  H05K3/303 ,  H05K3/3494 ,  Y02P70/613

摘要： A method for bonding leads of an IC component with electrodes of a circuit board includes the steps of using a mounting device to hold the IC component with flat portions of the leads inclined downward, mounting the IC component on the circuit board at a predetermined position thereof with the IC component held by the mounting device, moving the mounting device toward the circuit board to compress the IC component against the circuit board at the predetermined position while allowing the leads to flex to accommodate for nonuniformity in the heights of metal pieces to be bonded with the electrodes and bending of the circuit board. In this manner, the flat portions of the leads are brought into close contact with the electrodes. The leads are then irradiated with an optical beam so as to melt the metal pieces of the electrodes for bonding of the leads to the circuit board.

摘要翻译： 用于将IC部件的引线与电路板的电极接合的方法包括以下步骤：使用安装装置将引线的平坦部分保持在IC的下方，将IC部件安装在电路板上的预定位置 通过由安装装置保持的IC部件，将安装装置朝向电路板移动，以在预定位置处将IC部件压靠在电路板上，同时允许引线弯曲以适应待粘合的金属片的高度的不均匀性 与电极和电路板的弯曲。 以这种方式，引线的平坦部分与电极紧密接触。 然后用光束照射引线，以熔化用于将引线接合到电路板的电极的金属片。

公开(公告)号：US4743465A

公开(公告)日：1988-05-10

申请号：US817856

申请日：1986-02-12

申请人： Keiji Saeki ,  Shinichi Kudo ,  Hachiro Nakatsuji

发明人： Keiji Saeki ,  Shinichi Kudo ,  Hachiro Nakatsuji

IPC分类号： H05K3/10 ,  H01L21/70 ,  H05K3/12 ,  B05D5/12

CPC分类号： H05K3/1241 ,  H01L21/705 ,  H05K2203/0126

摘要： A method and apparatus for drawing a thick film circuit on a substrate by discharging a paste from a tank with a discharge hole. A waste drawing is performed by extruding the paste from the tank on a waste drawing section at a predetermined interval of non-drawing duration, thereby preventing paste clogging at the discharge hole and resulting in increase on workability and productivity.

摘要翻译： PCT No.PCT / JP85 / 00198 Sec。 371日期1986年2月12日 102（e）日期1986年2月12日PCT 1985年4月15日PCT。一种通过从具有排出孔的罐排出糊料而在基板上绘制厚膜电路的方法和装置。 通过以预定的非拉伸持续时间从罐中将废料从罐中挤出到废料抽出部上，从而防止浆料在排出孔堵塞并导致加工性和生产率的提高。

公开(公告)号：US4692351A

公开(公告)日：1987-09-08

申请号：US817833

申请日：1985-12-16

申请人： Yukio Maeda ,  Shinichi Kudo ,  Keiji Saeki

发明人： Yukio Maeda ,  Shinichi Kudo ,  Keiji Saeki

IPC分类号： H05K3/10 ,  H05K3/12 ,  B05D1/26 ,  B05C9/02 ,  F04B43/04 ,  G01D15/16

CPC分类号： H05K3/1241 ,  H05K2203/0126

摘要： A method and apparatus for drawing a thick film circuit on a substrate (2) by discharging a paste from a paste discharge hole provided at one end of a drawing nozzle (1), the drawing nozzle (1) being located close to the substrate (2) and relatively moved with respect to the substrate (2). The discharge rate of the paste is controlled in accordance with the relatively moving speed between the drawing nozzle (1) and the substrate (2), thereby preventing variations of film thickness and line width caused by variations in the moving speed and making it possible to form a thick film circuit at a high speed and with high accuracy.

摘要翻译： PCT No.PCT / JP85 / 00199 Sec。 371日期1985年12月16日第 102（e）日期1985年12月16日PCT提交1985年4月15日PCT公布。 公开号WO85 / 05005 日期：1985年11月7日。一种用于通过从设置在拉丝喷嘴（1）的一端的浆料排出孔排出糊料而将基板（2）上的厚膜电路绘制的方法和装置， 位于靠近基板（2）并且相对于基板（2）相对移动。 根据拉伸喷嘴（1）和基板（2）之间的相对移动速度控制浆料的排出速度，从而防止由移动速度的变化引起的膜厚度和线宽的变化，并且可以 以高速和高精度形成厚膜电路。

公开(公告)号：US5813115A

公开(公告)日：1998-09-29

申请号：US510273

申请日：1995-08-02

申请人： Yoshihiko Misawa ,  Koichi Morita ,  Keiji Saeki ,  Setsuo Horimoto

发明人： Yoshihiko Misawa ,  Koichi Morita ,  Keiji Saeki ,  Setsuo Horimoto

IPC分类号： H01L21/60 ,  H05K3/30 ,  H01R43/16

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/45144 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49204

摘要： When a semiconductor chip is mounted on a wiring substrate, an end of a metallic wire fed through a capillary is first fused to form a ball, which is in turn pressed against and bonded to an electrode pad formed on a semiconductor chip. The metallic wire is then cut at a location in the proximity of the ball so that a portion of the metallic wire remains as a protruding contact on the ball. The protruding contact is pressed against a shaping platform coated with a paste-like electrically-conductive adhesive film to thereby cause the protruding contact to have a given height and transfer a portion of the adhesive film to the protruding contact. The protruding contact is eventually bonded to an electrically-conductive film formed on the wiring substrate via the transferred portion of the adhesive film.

摘要翻译： 当将半导体芯片安装在布线基板上时，首先将馈送通过毛细管的金属线的端部熔合以形成球，该球又被压接并接合到形成在半导体芯片上的电极焊盘。 然后在靠近球的位置处切割金属线，使得金属丝的一部分作为球上的突出接触保持。 将突出的接触部压在涂敷有糊状导电性粘接膜的成形台上，由此使突出接触具有给定的高度，并将粘合膜的一部分转印到突出接触部。 突出的接触件最终通过粘合膜的被转移部分与形成在布线基板上的导电膜结合。

公开(公告)号：US5667129A

公开(公告)日：1997-09-16

申请号：US432579

申请日：1995-05-01

申请人： Koichi Morita ,  Yoshihiko Misawa ,  Keiji Saeki ,  Akira Kabeshita ,  Nobuhisa Watanabe

发明人： Koichi Morita ,  Yoshihiko Misawa ,  Keiji Saeki ,  Akira Kabeshita ,  Nobuhisa Watanabe

IPC分类号： B23P21/00 ,  H01L21/60 ,  H05K13/04 ,  H05K13/08 ,  H01L21/58

CPC分类号： H05K13/0413 ,  H05K13/046 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

摘要： An IC component mounting method includes sucking each of different types of IC components at a supply position to which the IC component having an electrode-provided face thereof to be bonded to a circuit board, recognizing an image of the IC component to detect a sucking position at which a sucking nozzle does not interfere with an electrode of the IC component, detecting a height of the sucking position, positioning the sucking nozzle at the sucking position while the position of the sucking nozzle in a vertical direction is controlled, sucking the IC component by a mounting head, recognizing a position of the IC component sucked by the mounting head, and recognizing a reference position of the circuit board or an IC component-mounting position thereof, and positioning the IC component at the IC component-mounting position of the circuit board and then mounting the IC component on the circuit board.

摘要翻译： 一种IC部件安装方法，其特征在于，将具有电极配置面的IC部件的电源位置与不同类型的IC部件吸附在电路基板上，识别IC部件的图像以检测吸引位置 吸入喷嘴不与IC部件的电极干涉，检测吸引位置的高度，并且在吸嘴的位置在垂直方向上被控制的同时将吸嘴定位在吸引位置，吸引IC部件 通过安装头识别由安装头吸入的IC部件的位置，并且识别电路板的基准位置或其IC部件安装位置，并将IC部件定位在IC部件安装位置 电路板，然后将IC组件安装在电路板上。