公开(公告)号：US5436503A

公开(公告)日：1995-07-25

申请号：US153108

申请日：1993-11-17

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  H01L23/48 ,  H01L29/41 ,  H01L29/47

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5622590A

公开(公告)日：1997-04-22

申请号：US430484

申请日：1995-04-28

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  B32B7/12 ,  B29C65/54 ,  H01L21/58 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5550408A

公开(公告)日：1996-08-27

申请号：US408965

申请日：1995-03-23

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  H01L23/28

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2224/92125 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in a matrix. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成矩阵的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US6045897A

公开(公告)日：2000-04-04

申请号：US178852

申请日：1998-10-26

申请人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

发明人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

IPC分类号： B32B15/14 ,  C08J5/04 ,  C09D5/25 ,  D04H1/00 ,  D04H1/42 ,  D04H1/58 ,  D21H13/26 ,  D21H17/52 ,  H05K1/02 ,  H05K1/03 ,  D21H13/02

CPC分类号： H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

摘要翻译： 一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基板的预浸料坯和印刷线路板。

公开(公告)号：US5960538A

公开(公告)日：1999-10-05

申请号：US31082

申请日：1998-02-26

申请人： Kouji Kawakita ,  Seiichi Nakatani ,  Masahide Tsukamoto

发明人： Kouji Kawakita ,  Seiichi Nakatani ,  Masahide Tsukamoto

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/02 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K3/02

CPC分类号： H05K3/4069 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5384 ,  H05K1/0206 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The present invention provides a printed circuit board in which electrode layers can electrically be connected by an inner-through-hole connection, the coefficient of thermal expansion of the board is equal to that of a semiconductor, high thermal conductivity can be obtained and wiring can be formed at a high density. A cover film is laminated on both surfaces of a resin impregnated fabric sheet, holes are formed by laser beams in the direction of the thickness of the sheet and cover film, an electrically conductive paste that contains the electrically conductive particles and a thermosetting resin is filled in the holes. The cover film is removed, a copper foil is placed on both sides of the sheet, and pressed and heated, and the resin component of the sheet and that of the electrically conductive paste are hardened. The copper foil is etched to form circuit patterns, and further etching removes the electrically conductive particles present at a surface layer portion so that an electrical insulating layer is thus formed.

摘要翻译： 本发明提供一种印刷电路板，其中电极层可以通过内部通孔连接而电连接，板的热膨胀系数等于半导体的热膨胀系数，可以获得高导热性，并且布线可以 以高密度形成。 在树脂浸渍织物片的两个表面上层压覆盖膜，在片材和覆盖膜的厚度方向上通过激光束形成孔，填充含有导电性粒子和热固性树脂的导电性糊剂 在洞里 除去覆盖膜，将铜箔放置在片材的两侧，并被加压和加热，并且片材的树脂成分和导电膏的树脂成分硬化。 蚀刻铜箔以形成电路图案，并且进一步蚀刻除去存在于表面层部分的导电颗粒，从而形成电绝缘层。

公开(公告)号：US5407511A

公开(公告)日：1995-04-18

申请号：US214267

申请日：1994-03-17

申请人： Seiichi Nakatani ,  Masahide Tsukamoto ,  Mikinari Shimada

发明人： Seiichi Nakatani ,  Masahide Tsukamoto ,  Mikinari Shimada

IPC分类号： H05K1/09 ,  C04B35/583 ,  H01L21/48 ,  H05K1/03 ,  H05K1/11 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  B44C1/165 ,  B32B31/00

CPC分类号： C04B35/583 ,  H01L21/4857 ,  H01L21/4867 ,  H05K3/207 ,  H05K3/4069 ,  H05K1/0313 ,  H05K1/092 ,  H05K1/095 ,  H05K2201/0394 ,  H05K2203/016 ,  H05K2203/1453 ,  H05K2203/1461 ,  H05K3/4614 ,  H05K3/462

摘要： A circuit board that is made compact or highly dense and can be prepared using no chemical etching is obtained by patternwise printing a sinterable conductor on a releasing substrate, sintering the conductor by heating at a given temperature, and transferring the sintered conductor to a resin support. A plurality of sintered conductors each prepared by the above process may be laminated to give a multi-layered circuit board.

摘要翻译： 通过在剥离基板上图案化印刷可烧结导体，通过在给定温度下加热烧结导体，并将烧结导体转印到树脂载体上，获得致密或高密度且不经化学蚀刻制备的电路板 。 可以将通过上述方法制备的多个烧结导体层叠以形成多层电路板。

公开(公告)号：US5858884A

公开(公告)日：1999-01-12

申请号：US856548

申请日：1997-05-15

申请人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

发明人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

IPC分类号： B32B15/14 ,  C08J5/04 ,  C09D5/25 ,  D04H1/00 ,  D04H1/42 ,  D04H1/58 ,  D21H13/26 ,  D21H17/52 ,  H05K1/02 ,  H05K1/03 ,  C08J5/24

CPC分类号： H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

摘要翻译： 一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基材的预浸料坯和印刷线路板。

公开(公告)号：US5406459A

公开(公告)日：1995-04-11

申请号：US939000

申请日：1992-09-02

申请人： Masahide Tsukamoto ,  Seiichi Nakatani ,  Toru Ishida

发明人： Masahide Tsukamoto ,  Seiichi Nakatani ,  Toru Ishida

IPC分类号： H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/16

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K1/181 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10977 ,  H05K2201/10984 ,  H05K2203/0191 ,  H05K3/28 ,  H05K3/305 ,  H05K3/32 ,  H05K3/3484 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623

摘要： An electric circuit board module includes a substrate with electric components mounted on one side thereof and electrodes provided on the other side thereof for the electric connection with the mounted electrical components. The electric circuit board module further includes conductor columns adhered to the electrodes and an adhesion layer provided on the other side of the substrate and around the conductor columns such that the conductor columns extrude from the adhesion layer by a predetermined length. By pressing the electric circuit board module against a separate circuit board to mount thereon, the electric components are electrically connected with electrodes of the sperate circuit board through conductor columns. Since conductor columns are made of a resinous paste with metallic powders dispersed therein, no heating operation as required in conventional module using a solder flow is necessary, resulting in that electric components are kept from the degradation caused by the heat.

摘要翻译： 一种电路板模块，包括其一侧安装有电气部件的基板和设置在其另一侧上的电极，用于与所安装的电气部件的电连接。 电路板模块还包括粘附到电极的导体柱和设置在基板的另一侧上并围绕导体柱的粘合层，使得导体列从粘合层挤出预定长度。 通过将电路板模块压靠在单独的电路板上以安装在其上，电气部件通过导体柱与工作电路板的电极电连接。 由于导体柱由分散有金属粉末的树脂浆料制成，因此不需要使用焊料流动的常规模块中的加热操作，导致电子部件不受热引起的劣化。

公开(公告)号：US5588207A

公开(公告)日：1996-12-31

申请号：US437085

申请日：1995-05-05

申请人： Kouji Kawakita ,  Masahide Tsukamoto ,  Yasukiho Horio ,  Seiichi Nakatani ,  Akihito Hatakeyama

发明人： Kouji Kawakita ,  Masahide Tsukamoto ,  Yasukiho Horio ,  Seiichi Nakatani ,  Akihito Hatakeyama

IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10 ,  H05K3/20

CPC分类号： H05K3/4046 ,  H01L2224/16237 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165

摘要： A two-sided printed circuit board including a base having a first surface, a second surface substantially parallel to the first surface, and a plurality of through-holes formed in the base; a first conductive layer provided on the first surface of the base; a second conductive layer provided on the second surface of the base; and a conductive particle buried in each of the through-holes in a pressurized state for electrically connecting the first conductive layer and the second conductive layer.

摘要翻译： 一种双面印刷电路板，包括具有第一表面，基本上平行于第一表面的第二表面和形成在基底中的多个通孔的基底; 设置在所述基座的第一表面上的第一导电层; 设置在所述基座的第二表面上的第二导电层; 以及以加压状态掩埋在每个通孔中的导电颗粒，用于电连接第一导电层和第二导电层。

公开(公告)号：US5817404A

公开(公告)日：1998-10-06

申请号：US585508

申请日：1996-01-16

申请人： Kouji Kawakita ,  Seiichi Nakatani ,  Masahide Tsukamoto

发明人： Kouji Kawakita ,  Seiichi Nakatani ,  Masahide Tsukamoto

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/02 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4069 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5384 ,  H05K1/0206 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The present invention provides a printed circuit board in which electrode layers can electrically be connected by an inner-through-hole connection, the coefficient of thermal expansion of the board is equal to that of a semiconductor, high thermal conductivity can be obtained and wiring can be formed at a high density. A cover film is laminated on both surfaces of a resin impregnated fabric sheet, holes are formed by laser beams in the direction of the thickness of the sheet and cover film, an electrically conductive paste that contains the electrically conductive particles and a thermosetting resin is filled in the holes. The cover film is removed, a copper foil is placed on both sides of the sheet, and pressed and heated, and the resin component of the sheet and that of the electrically conductive paste are hardened. The copper foil is etched to form circuit patterns, and further etching removes the electrically conductive particles present at a surface layer portion so that an electrical insulating layer is thus formed.