公开(公告)号：US4194162A

公开(公告)日：1980-03-18

申请号：US889115

申请日：1978-03-22

申请人： Yutaka Uematsu ,  Yoichi Unno

发明人： Yutaka Uematsu ,  Yoichi Unno

IPC分类号： G02B6/30 ,  G02B5/18 ,  G02B6/293 ,  G02F1/35 ,  H01L31/14 ,  H01S5/00 ,  H01S5/042 ,  H01S5/187 ,  H01S3/19

CPC分类号： H01L31/143 ,  H01S5/187

摘要： A semiconductor device includes a semiconductor layer on one side of a semiconductor body to define a pn-junction therebetween, diffraction gratings formed at a distance from each other on the top of said semiconductor layer, and electrodes formed between the diffraction gratings on the top of said semiconductor and formed on the other side of the semiconductor body.

摘要翻译： 半导体器件包括在半导体本体的一侧上限定其间的pn结的半导体层，在所述半导体层顶部彼此间隔形成的衍射光栅和形成在所述半导体层顶部的衍射光栅之间的电极 所述半导体形成在半导体本体的另一侧。

公开(公告)号：US20130307582A1

公开(公告)日：2013-11-21

申请号：US13512465

申请日：2012-05-16

申请人： Yasuhiro Ikeda ,  Yutaka Uematsu ,  Satoshi Muraoka

发明人： Yasuhiro Ikeda ,  Yutaka Uematsu ,  Satoshi Muraoka

IPC分类号： H03K17/16

CPC分类号： G11C7/10 ,  G11C7/1057 ,  G11C7/1084

摘要： To suppress power consumption and enhance signal quality as compared with the case where first and second semiconductor elements are terminated only by on-chip input termination resistor circuits. A first semiconductor element with a switching function and a second semiconductor element with a switching function are connected to each other with a substrate interconnection, and a resistor element is connected in parallel with the substrate interconnection. The resistor element is placed at an arbitrary position or a branch point on the signal interconnection.

摘要翻译： 与第一和第二半导体元件仅由片上输入终端电阻电路端接的情况相比，抑制功耗和提高信号质量。 具有开关功能的第一半导体元件和具有开关功能的第二半导体元件通过衬底互连彼此连接，并且电阻元件与衬底互连并联连接。 电阻元件放置在信号互连的任意位置或分支点处。

公开(公告)号：US20130112390A1

公开(公告)日：2013-05-09

申请号：US13810673

申请日：2011-08-01

申请人： Fujio Arai ,  Yutaka Uematsu ,  Takayoshi Matsuoka

发明人： Fujio Arai ,  Yutaka Uematsu ,  Takayoshi Matsuoka

IPC分类号： B60H1/00

CPC分类号： B60H1/00764 ,  B60H1/00771 ,  B60H1/00785 ,  B60H1/00849

摘要： A vehicle heating and air conditioning system basically includes an interior/exterior air introducing structure, a heating device, a driving end time acquiring section and an interior/exterior air switching control section. The interior/exterior air introducing structure switches the flow of cabin intake air between an interior air recirculation mode and an exterior air introducing mode. The heating device heats the cabin intake air being introduced by the interior/exterior air introducing structure. The driving end time acquiring section estimates a driving end time corresponding to a point in time at which driving of a vehicle is predicted to end. The interior/exterior air switching control section switches the interior/exterior air introducing structure from the exterior air introducing mode to the interior air recirculation mode during a period of time from a prescribed point in time until the driving end time to restrict windshield fogging while in the interior air recirculation mode.

摘要翻译： 车辆加热和空调系统基本上包括内部/外部空气引入结构，加热装置，行驶结束时间获取部分和内部/外部空气切换控制部分。 内部/外部空气引入结构在室内空气再循环模式和外部空气引入模式之间切换机舱进气的流动。 加热装置加热由内部/外部空气引入结构引入的舱室进气。 驾驶结束时间获取部估计对应于预测车辆行驶结束的时间点的驾驶结束时间。 内/外部空气切换控制部分在内部/外部空气引入结构从外部空气引入模式切换到内部空气再循环模式期间，从规定的时间点到驱动结束时间，以限制挡风玻璃起雾，同时在 内部空气再循环模式。

公开(公告)号：US20120262885A1

公开(公告)日：2012-10-18

申请号：US13358540

申请日：2012-01-26

申请人： Yasuhiro IKEDA ,  Yutaka Uematsu ,  Satoshi Muraoka

发明人： Yasuhiro IKEDA ,  Yutaka Uematsu ,  Satoshi Muraoka

IPC分类号： H05K1/18

CPC分类号： H05K1/0243 ,  H05K1/0251 ,  H05K1/115 ,  H05K2201/09227 ,  H05K2201/09772 ,  H05K2201/10545 ,  H05K2201/10689

摘要： Provided is a signal transfer circuit which uses a low cost circuit board with a high packing density but is capable of reducing a crosstalk noise between signal lines and also reducing a reflection noise due to a stub. A signal transfer circuit of the present invention is configured such that lead terminals of electronic components and through-hole vias are connected to each other by surface wirings, respectively, to allow no branching from the middle of the through-hole vias. Further, first wirings connecting a first electronic component are each arranged between a corresponding pair of second wirings connecting a second electronic component, and signals are transmitted through the first wirings and the second wirings by interleaved transmission.

摘要翻译： 提供了一种使用具有高包装密度的低成本电路板的信号传输电路，但是能够减少信号线之间的串扰噪声并且还减少由于短截线引起的反射噪声。 本发明的信号传输电路被配置为使得电子部件和通孔过孔的引线端子分别通过表面布线彼此连接，以便不允许从通孔过孔的中间分支。 此外，连接第一电子部件的第一布线分别布置在连接第二电子部件的相应的一对第二布线之间，并且信号通过交错传输通过第一布线和第二布线传输。

公开(公告)号：US07319267B2

公开(公告)日：2008-01-15

申请号：US11712440

申请日：2007-03-01

申请人： Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Yukitoshi Hirose

发明人： Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Yukitoshi Hirose

IPC分类号： H01L23/02 ,  H01L23/34

CPC分类号： H01L23/642 ,  H01L23/5223 ,  H01L23/5228 ,  H01L23/5286 ,  H01L23/647 ,  H01L25/105 ,  H01L2224/73204 ,  H01L2924/19105 ,  H01L2924/3011

摘要： In a prior art, there has been a method in which a power supply line of an output buffer and that of a control circuit are independently provided so that the power supply noise occurring in the control circuit will not affect the output buffer. However, this method has had the problems that it increases both the number of power supply/grounding pins and power feed line inductance.The present invention provides a technique which, without causing the above two problems, i.e., (1) increased number of power supply/grounding pins and (2) increased power feed line inductance, prevents the noise causing a problem in a control circuit, from becoming routed around and induced into an output buffer. More specifically, the above can be realized by using either of two methods: (A) providing an on-chip bypass capacitor for the control circuit and isolating a power feed route of the control circuit from that of the output buffer in an AC-like manner, or (B) designing electrical parameters (inserting resistors) such that the oscillation mode of any electrical parameter noise induced into the power feed routes will change to overdamping.

摘要翻译： 在现有技术中，存在一种方法，其中独立地提供输出缓冲器的电源线和控制电路的电源线，使得控制电路中出现的电源噪声不会影响输出缓冲器。 然而，该方法存在增加电源/接地引脚数和馈电线电感的问题。 本发明提供一种技术，其不会引起上述两个问题，即（1）增加电源/接地引脚数量和（2）增加的馈电线电感，防止在控制电路中引起问题的噪声 变成路由并感应到输出缓冲区。 更具体地，可以通过以下两种方法之一来实现上述：（A）为控制电路提供片上旁路电容器，并将控制电路的馈电路径与AC类似的输出缓冲器的馈电路径隔离 方式或（B）设计电参数（插入电阻），使得引入馈电路径的任何电参数噪声的振荡模式将变为过阻尼。

公开(公告)号：US07168242B2

公开(公告)日：2007-01-30

申请号：US10774490

申请日：2004-02-10

申请人： Yutaka Uematsu ,  Jin Yokoyama

发明人： Yutaka Uematsu ,  Jin Yokoyama

IPC分类号： F01N3/00

CPC分类号： F02D41/0275 ,  B01D53/9495 ,  F02D2200/0802

摘要： This is a method for regenerating the NOx catalyst in a NOx purifying system provided in the exhaust passage with a direct reduction type NOx catalyst which directly decomposes the NOx during lean-condition operation and is regenerated at rich-condition operation, and the method prohibiting the rich-condition control when the temperature detected by a catalyst temperature detecting means is within the predetermined temperature range.Thus, when the exhaust gas are temporarily made rich-condition for catalyst regeneration which means recovering the NOx purifying ability of the direct reduction type NOx catalyst arranged in the exhaust passage of the engine, the NOx is prohibited from being discharged into the atmospheric air, and also the purifying ability can surely be recovered.

摘要翻译： 这是在排气通路内设置的NOx净化系统中，使用直接还原型NOx催化剂再生NO x催化剂的方法，所述直接还原型NOx催化剂在稀薄状态运行中直接分解NOx并在富氧运行时再生，并且该方法禁止 当由催化剂温度检测装置检测到的温度在预定温度范围内时，进行浓缩状态控制。 因此，当废气临时处于催化剂再生的浓缩状态时，这意味着回收排放在发动机排气通道中的直接还原型NOx催化剂的NOx净化能力，可以禁止NOx排入大气中， 净化能力也可以肯定地恢复。

公开(公告)号：US20060017144A1

公开(公告)日：2006-01-26

申请号：US10981676

申请日：2004-11-05

申请人： Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Yukitoshi Hirose

发明人： Yutaka Uematsu ,  Hideki Osaka ,  Yoji Nishio ,  Yukitoshi Hirose

IPC分类号： H01L23/02

CPC分类号： H01L23/642 ,  H01L23/5223 ,  H01L23/5228 ,  H01L23/5286 ,  H01L23/647 ,  H01L25/105 ,  H01L2224/73204 ,  H01L2924/19105 ,  H01L2924/3011

摘要： The present invention provides a technique which, without causing two problems, i.e., (1) increased number of power supply/grounding pins and (2) increased power feed line inductance, prevents the noise causing a problem in a control circuit, from becoming routed around and induced into an output buffer. More specifically, the above can be realized by using either of two methods: (A) providing an on-chip bypass capacitor for the control circuit and isolating a power feed route of the control circuit from that of the output buffer in an AC-like manner, or (B) designing electrical parameters (inserting resistors) such that the oscillation mode of any electrical parameter noise induced into the power feed routes will change to overdamping.

摘要翻译： 本发明提供一种技术，其不会引起两个问题，即（1）增加电源/接地引脚的数量和（2）增加的馈电线电感，防止在控制电路中引起问题的噪声变为布线 并引入输出缓冲区。 更具体地，可以通过以下两种方法之一来实现上述：（A）为控制电路提供片上旁路电容器，并将控制电路的馈电路径与AC类似的输出缓冲器的馈电路径隔离 方式或（B）设计电参数（插入电阻），使得引入馈电路径的任何电参数噪声的振荡模式将变为过阻尼。

公开(公告)号：US5113469A

公开(公告)日：1992-05-12

申请号：US663311

申请日：1991-03-01

申请人： Genichi Hatakoshi ,  Kazutaka Terashima ,  Masaru Kawachi ,  Yutaka Uematsu

发明人： Genichi Hatakoshi ,  Kazutaka Terashima ,  Masaru Kawachi ,  Yutaka Uematsu

IPC分类号： G02F1/37 ,  G02F1/377 ,  G02F1/383

CPC分类号： G02F1/377 ,  G02F1/383 ,  G02F2001/374 ,  G02F2202/20

摘要： An optical wavelength-converting device for generating the second-harmonic wave through Cerenkov radiation has a substrate made from nonlinear optical crystal which acts as a cladding layer. Formed on the top surface of the substrate is a long, narrow optical waveguide layer, whose refractive index is larger than that of the substrate. In the substrate, multi-layered domain-inverted sections are formed. With this arrangement, the nonlinear coefficient is locally changed, thereby compensating for phase mismatching between the fundamental wave and the second-harmonic wave in the direction perpendicular to the substrate's surface. This compensation helps improve the efficiency in converting the laser input light of the fundamental wave into the second-harmonic wave.

公开(公告)号：US5065404A

公开(公告)日：1991-11-12

申请号：US551996

申请日：1990-07-12

申请人： Masaki Okajima ,  Genichi Hatakoshi ,  Masayuki Ishikawa ,  Yutaka Uematsu ,  Nawoto Motegi

发明人： Masaki Okajima ,  Genichi Hatakoshi ,  Masayuki Ishikawa ,  Yutaka Uematsu ,  Nawoto Motegi

IPC分类号： H01S5/20 ,  H01S5/22 ,  H01S5/223 ,  H01S5/32 ,  H01S5/323

CPC分类号： H01S5/2231 ,  H01S5/204 ,  H01S5/221 ,  H01S5/3211 ,  H01S5/32308 ,  H01S5/32325

摘要： A visible-light wavelength continuous oscillation laser is disclosed which has an N type GaAs substrate, an N type GaAlAs cladding layer formed on the substrate, and a non-doped GaAlAs active layer formed on the cladding layer. The laser further includes two N type GaAlAs layers, a P type GaAlAs optical guide layer, a P type cladding layer consisting of upper and lower portions, and a ridge section. The N type GaAlAs layers contact both sides of the ridge section. The optical guide layer is sandwiched between the upper and lower portions of the P type cladding layer, is located within the ridge section, and has a refractive index greater than that of the P type cladding layer. The distance between the active layer and the optical guide layer does not depend on the condition in which etching is performed to form the ridge section, but depends basically on the time required to grow crystal.

公开(公告)号：US20140103542A1

公开(公告)日：2014-04-17

申请号：US14109618

申请日：2013-12-17

申请人： Mitsuaki KATAGIRI ,  Ken Iwakura ,  Yutaka Uematsu

发明人： Mitsuaki KATAGIRI ,  Ken Iwakura ,  Yutaka Uematsu

IPC分类号： H01L23/498

CPC分类号： H01L23/498 ,  G11C5/06 ,  H01L23/525 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05013 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/49431 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15173 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor package includes a semiconductor device including a plurality of signal pads and a plurality of auxiliary pads which are alternatively arranged in a predetermined direction, and a package board including a plurality of signal bond fingers, a plurality of first power supply voltage bond fingers, and a plurality of second power supply voltage bond fingers. The signal pads are connected respectively to the signal bond fingers by first wires. The first power supply voltage bond fingers and the second power supply voltage bond fingers are connected respectively to the auxiliary pads by second wires. The first wires are disposed between those of the second wires which are connected to the first power supply voltage bond fingers and those of the second wires which are connected to the second power supply voltage bond fingers.

摘要翻译： 半导体封装包括：半导体器件，包括多个信号焊盘和沿预定方向交替布置的多个辅助焊盘;以及封装板，包括多个信号键合指，多个第一电源电压键合指， 以及多个第二电源电压接合指。 信号焊盘通过第一线分别连接到信号键指。 第一电源电压键指和第二电源电压键合指通过第二线分别连接到辅助焊盘。 第一导线设置在连接到第一电源电压接合指的第二配线和连接到第二电源电压接合指的第二配线之间。