-
公开(公告)号：US20240006723A1
公开(公告)日：2024-01-04
申请号：US18252679
申请日：2021-10-20
发明人： Masakazu HATTORI , Yuko KIMURA
IPC分类号： H01M50/483 , H01M50/477
CPC分类号： H01M50/483 , H01M50/477
摘要： A silicone laminate 1 includes layers of a silicone rubber layer (A) 2 and a silicone layer (B) 3 with a lower hardness than the silicone rubber layer (A) 2. The silicone layer (B) 3 is at least one layer selected from the group consisting of a silicone sponge layer (B1) and a silicone gel layer (B2). Both the silicone rubber layer (A) 2 and the silicone layer (B) 3 are made of a material that is converted to ceramic and forms a sintered body when burned, so that the material retains its shape. The silicone laminate 1 is fire resistant. It is preferable that the silicone rubber layer (A) 2 and the silicone layer (B) 3 are alternately stacked, and that the number of layers is two or more for each of the layers (A) and (B), and four or more in total. Thus, the silicone laminate has high fire resistance and high compressive resistance as a cushioning material for batteries.
-
公开(公告)号：US20240002619A1
公开(公告)日：2024-01-04
申请号：US18254077
申请日：2022-01-13
发明人： Tomoki MATSUMURA , Keisuke KAWAHAMA , Makoto IWAI
IPC分类号： C08J7/044
CPC分类号： C08J7/044 , C08J2383/04
摘要： Provided is a silicone rubber molded body (1) including a conductive ink coating layer (3) that is disposed on a portion of the surface of the silicone rubber molded body (1). The conductive ink coating layer (3) contains a hydrolyzable organosilicon compound. Using the silicone rubber molded body with a saturated water absorption of 0.10 to 1.50% by mass and/or using a conductive ink containing water improves the affinity between the surface of the silicone rubber molded body (1) and the conductive ink coating layer (3). A residual ink area is an average of 20% or more and 100% or less after the conductive ink coating layer (3) is subjected to an abrasion test. With this configuration, the silicone rubber molded body has a high affinity between the silicone rubber and the conductive ink, good durability under continuous stress, and stability in long-term use. Further provided is a method for producing the silicone rubber molded body.
-
公开(公告)号：US20230374235A1
公开(公告)日：2023-11-23
申请号：US18246972
申请日：2021-07-01
发明人： Katsuyuki SUZUMURA
CPC分类号： C08J5/18 , C08K7/18 , C08J2383/04 , C08J2391/00 , C08K2201/001 , C08K2201/005
摘要： The present invention relates to a thermally conductive sheet 12 containing a matrix resin (A) and thermally conductive inorganic particles (B). The matrix resin (A) contains an addition-curable silicone polymer (A1) and a non-reactive silicone oil (A2), the addition-curable silicone polymer (A1) accounting for 20% by mass or more and less than 100% by mass and the non-reactive silicone oil (A2) accounting for more than 0% by mass and 80% by mass or less relative to 100% by mass of the matrix resin (A). The thermally conductive sheet contains the thermally conductive inorganic particles (B) in an amount of 1000 to 3000 parts by mass relative to 100 parts by mass of the matrix resin (A). The thermally conductive sheet 12 is a cured sheet. 16 indicates an oil bleeding region. The present invention provides a thermally conductive sheet with reduced oil bleeding, and a method for producing the same.
-
公开(公告)号：US11785752B2
公开(公告)日：2023-10-10
申请号：US17263062
申请日：2020-02-19
发明人： Shingo Ito
CPC分类号： H05K9/0083 , C08J5/18 , C08K3/08 , C08K9/06 , C09K5/14 , H01Q17/004 , H05K7/20 , C08J2383/04 , C08K2201/001 , C08K2201/005 , C08K2201/01
摘要： An electromagnetic wave absorbing thermally conductive composition contains a matrix resin component, metal soft magnetic particles, and thermally conductive particles. The metal soft magnetic particles are carbonyl iron particles and are present in an amount of 30% by volume or more when the electromagnetic wave absorbing thermally conductive composition is a population parameter. A value of an imaginary part (μ″) of relative permeability of the electromagnetic wave absorbing thermally conductive composition is 0.9 or more in at least some bands in a frequency range of 18 to 26.5 GHz. The electromagnetic wave absorbing thermally conductive composition in the form of a sheet has a thermal conductivity of 2.0 W/m·K or more in the thickness direction. A sheet of the present invention incudes the above composition in the form of a sheet. Thus, the present invention provides the electromagnetic wave absorbing thermally conductive composition and its sheet that can increase the value of the imaginary part (μ″) of relative permeability in a frequency band of 18 to 26.5 GHz, efficiently absorb electromagnetic wave noise in this frequency band, and also have a high thermal conductivity.
-
公开(公告)号：US11643554B2
公开(公告)日：2023-05-09
申请号：US16863526
申请日：2020-04-30
申请人： National Institute of Advanced Industrial Science and Technology , Fuji Polymer Industries Co., Ltd.
发明人： Yuichi Tominaga , Yoshiki Sugimoto , Yusuke Imai , Yuji Hotta , Setsuo Kikuchi , Makoto Iwai , Takumi Kataishi
CPC分类号： C08L83/04 , C08K3/042 , C08K3/14 , C08K7/04 , C08K2003/222 , C08K2003/282 , C08K2003/382 , C08K2201/001 , C08L2203/20 , C08L83/04 , C08K3/38 , C08K5/56 , C08L83/00
摘要： Composite resin granules 5 contain a binder resin 2 and a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive filler 3 and an anisotropic thermally conductive filler 4. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive filler 4 are oriented in random directions. A thermally conductive rein molded body 6 of the present invention is obtained by compressing the composite resin granules 5. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.
-
公开(公告)号：US20220380653A1
公开(公告)日：2022-12-01
申请号：US17772073
申请日：2021-03-26
发明人： Takumi KATAISHI , Mai SUGIE , Yuko KIMURA
摘要： A thermally-conductive silicone gel composition of the present invention contains A to D components below. A: a linear organopolysiloxane having one vinyl group at each terminal end of a molecular chain and a kinematic viscosity of 1 to 600 mm2/s, B: a linear organopolysiloxane having three or more Si—H groups in one molecule and an Si—H group content of 0.05 to 6 mol/kg, in an amount such that a ratio of the number of Si—H groups in B component to the number of vinyl groups in A component is 0.2 to 0.5, C: a platinum catalyst in a catalytic amount, and D: a thermally-conductive filler in an amount of 300 to 1000 parts by mass when a total amount of A and B is taken as 100 parts by mass.
-
7.发明申请公开(公告)号：US20220204831A1
公开(公告)日：2022-06-30
申请号：US17695201
申请日：2022-03-15
发明人： Tomoyuki OKUMURA , Keisuke KAWAHAMA , Kunio MORI
摘要： A composition of the present invention contains the following components A to C: A. a linear terminal-reactive polydimethylsiloxane; B. a thermally conductive filler including the following B1, B2, and B3 in an amount of 800 to 2500 parts by mass with respect to 100 parts by mass of the component A; and C. a curing catalyst in a catalytic amount. The component B includes the following: B1. a thermally conductive filler that has an average particle size of 0.1 to 1.0 μm and is surface treated with a surface treatment agent containing a reactive group having no unsaturated bond; B2. a thermally conductive filler that has an average particle size of 1.0 to 10 μm and is surface treated with a surface treatment agent containing a reactive group having an unsaturated bond; and B3. a thermally conductive filler that has an average particle size of 10 to 100 μm and is surface treated with the surface treatment agent containing a reactive group having no unsaturated bond or the surface treatment agent containing a reactive group having an unsaturated bond. Thus, the thermally conductive silicone composition and the sheet formed by using this composition have a high strength.
-
公开(公告)号：US20210210814A1
公开(公告)日：2021-07-08
申请号：US17210054
申请日：2021-03-23
发明人： Masakazu HATTORI
IPC分类号： H01M50/198 , C09K5/14 , C08G77/50 , C08K3/22 , H01M50/195 , H01M50/184 , H01M10/613 , H01M10/625 , H01M10/6556 , H01M10/6567 , H01M10/0525
摘要： A thermally conductive sheet 10 for a sealing product is configured to be disposed between a heat generating electrical or electronic component and a heat-dissipating case. The sheet has a Shore 00 hardness of 5 or more and 55 or less. The sheet is in the form of a frame having a space 11 in the frame. The space is configured to be filled with a thermally conductive liquid composition. In the heat generating electrical or electronic component of the present invention, the thermally conductive sheet 11 is attached between the component and the case. The space 11 being defined by the component, the case, and the thermally conductive sheet 10 is filled with the thermally conductive liquid composition. Thus, provided is a thermally conductive sheet for a sealing product that can prevent a thermally conductive liquid from leaking out even when the liquid is directly injected into a space between a heat generating electrical or electronic component such as a battery module and a case, that has a level of flexibility that puts no load on the heat generating electrical or electronic component, and that provides high adhesion between the component and the case. Also provided is a heat generating electrical or electronic component including the sheet.
-
公开(公告)号：US09745498B2
公开(公告)日：2017-08-29
申请号：US14898701
申请日：2014-10-20
IPC分类号： C08K3/36 , C09K5/06 , C08K3/00 , C08L101/00 , C09K5/00 , C08K9/06 , H01L23/427 , C08K3/22 , C08K3/18 , C08K3/28
CPC分类号： C09K5/063 , C08K3/00 , C08K3/01 , C08K3/18 , C08K3/22 , C08K3/28 , C08K9/06 , C08K2003/222 , C08K2003/2227 , C08K2003/2296 , C08K2201/001 , C08K2201/005 , C08L101/00 , C09K5/00 , H01L23/3737 , H01L23/427 , H01L23/4275 , C08L83/04 , C08K3/0008
摘要： A heat storage composition (20) of the present invention includes a matrix resin (21) and heat storage inorganic particles (22). The heat storage inorganic particles (22) are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition. The amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin. The heat conductivity of the heat storage composition is 0.3 W/m·K or more. The heat storage composition may further include heat conductive particles (23, 24). The heat storage inorganic particles are preferably metal oxide particles containing vanadium as the main metal component. The heat storage composition has high heat storage properties and high heat conduction properties, and is used as a heat storage silicone material provided between a heat generating component and a case. Since heat from the heat generating component is temporarily stored in the heat storage composition so that the heat conduction is delayed, the heat is diffused during the delay to eliminate partial heating, thereby resulting in uniform heat dissipation.
-
公开(公告)号：US09160094B2
公开(公告)日：2015-10-13
申请号：US13521369
申请日：2011-11-15
申请人： Shinji Yamada , Takumi Kataishi , Toshiki Ogawa
发明人： Shinji Yamada , Takumi Kataishi , Toshiki Ogawa
IPC分类号： H01R4/58 , H01R13/24 , H01R43/00 , H01R43/24 , H01R13/527
CPC分类号： H01R13/2414 , H01R13/527 , H01R43/005 , H01R43/24
摘要： Disclosed is a wire array rubber connector (10), including: an electrical insulating rubber (2); and a plurality of conductive metal wires (1) that are arrayed in a thickness direction of the electrical insulating rubber so as to pass through front and back surfaces of the electrical insulating rubber, and localized so as to be electrically connectable to electrical terminals that are disposed at predetermined positions on the front and back surfaces of the electrical insulating rubber. The electrical insulating rubber (2) is a flame-resistant rubber achieving V-0 based on the UL-94 standard. This wire array rubber connector (10) is obtained by: mixing a plurality of conductive metal wires having a predetermined length into a liquid thermosetting electrical insulating rubber material; applying a magnetic field from a thickness direction of the rubber material using an electromagnet that is patterned in a predetermined pattern so that the conductive metal wires are arrayed in the thickness direction and localized; and curing the rubber material by heating, thereby providing the wire array rubber connector with high flame resistance and with low transmission loss in a high frequency region.
摘要翻译： 公开了一种线阵列橡胶连接器（10），包括：电绝缘橡胶（2）; 以及多个导电金属线（1），其沿着所述电绝缘橡胶的厚度方向排列以穿过所述电绝缘橡胶的前表面和后表面，并且被定位成可电连接到电绝缘橡胶的电端子 设置在电绝缘橡胶的前表面和后表面上的预定位置处。 电绝缘橡胶（2）是基于UL-94标准的V-0的阻燃橡胶。 该线阵列橡胶连接器（10）通过以下方式获得：将具有预定长度的多根导电金属线混合到液体热固性电绝缘橡胶材料中; 使用以预定图案图案化的电磁体从橡胶材料的厚度方向施加磁场，使得导电金属线沿厚度方向排列并定位; 并通过加热固化橡胶材料，从而在高频区域提供具有高阻燃性和低传输损耗的线阵列橡胶连接器。
-
-
-
-
-
-
-
-
-
搜索结果
67 条记录 (耗时 0.025 秒)
