公开(公告)号：US20130269879A1

公开(公告)日：2013-10-17

申请号：US13977134

申请日：2011-12-16

申请人： Osamu Hirakawa ,  Naoto Yoshitaka ,  Masaru Honda

发明人： Osamu Hirakawa ,  Naoto Yoshitaka ,  Masaru Honda

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B37/06 ,  B32B38/10 ,  B32B41/00 ,  B32B2309/68 ,  B32B2310/0472 ,  B32B2457/14 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67103 ,  H01L21/68728 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1939 ,  Y10T156/1972

摘要： A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.

摘要翻译： 一种用于从重叠的基板剥离待处理的基板和支撑基板的剥离装置，所述重叠的基板通过粘合剂将待处理的基板和所述支撑基板接合而形成，所述粘合剂包括：第一保持单元， 被处理并被构造成保持待处理的基板的基板; 第二保持单元，被配置为加热所述支撑基板并且构造成保持所述支撑基板; 移动机构，被配置为相对于彼此水平移动所述第一保持单元和所述第二保持单元中的至少一个; 以及惰性气体供给机构，其构造成将惰性气体供给到被处理基板的接合面或支撑基板的接合面。

公开(公告)号：US4370187A

公开(公告)日：1983-01-25

申请号：US217577

申请日：1980-12-18

申请人： Mikio Katagiri ,  Yukio Sakota ,  Kunie Hiroshige ,  Yukio Adachi

发明人： Mikio Katagiri ,  Yukio Sakota ,  Kunie Hiroshige ,  Yukio Adachi

IPC分类号： B05D1/26 ,  B05D3/04 ,  B29C47/00 ,  B29C47/02 ,  B29C47/04 ,  B29C47/06 ,  B29C47/14 ,  B29C47/56 ,  B29C47/80 ,  B29C47/86 ,  B29C47/88 ,  B29C51/00 ,  B29C61/00 ,  B29C63/00 ,  B29C63/02 ,  B29L9/00 ,  B32B37/15 ,  B32B38/00 ,  B32B31/30

CPC分类号： B32B37/153 ,  B05D1/265 ,  B05D3/044 ,  B29C47/0021 ,  B29C47/065 ,  B29C47/145 ,  B29C47/86 ,  B29C47/8845 ,  B29C47/886 ,  B29C47/888 ,  B05D2252/00 ,  B05D3/0446 ,  B32B2309/62 ,  B32B2309/66 ,  B32B2310/0445 ,  B32B2310/0472 ,  B32B2553/00

摘要： A laminated structure composed of a substrate web and a thermoplastic resin web extrusion-coated thereon, which is substantially free from an offensive odor, is produced by extrusion-coating the thermoplastic resin web in the molten state through a T-die on the substrate while applying an oxidizing gas to one surface of the as-extruded molten web of the thermoplastic resin and an inert gas to its other surface in a specified space.

摘要翻译： 通过在基材上通过T型模头将处于熔融状态的热塑性树脂纤维网挤出涂覆在其上，由基材网和其上挤压涂覆的热塑性树脂网构成的层压结构，其基本上没有异味， 在特定的空间中将氧化气体施加到热塑性树脂的被挤出的熔融纤维网的一个表面和惰性气体到其另一个表面。

公开(公告)号：US09919509B2

公开(公告)日：2018-03-20

申请号：US13977134

申请日：2011-12-16

申请人： Osamu Hirakawa ,  Naoto Yoshitaka ,  Masaru Honda ,  Xavier Francois Brun ,  Charles Wayne Singleton, Jr.

发明人： Osamu Hirakawa ,  Naoto Yoshitaka ,  Masaru Honda ,  Xavier Francois Brun ,  Charles Wayne Singleton, Jr.

IPC分类号： B32B43/00 ,  H01L21/67 ,  H01L21/687 ,  B32B38/10 ,  B32B37/06 ,  B32B41/00

CPC分类号： B32B43/006 ,  B32B37/06 ,  B32B38/10 ,  B32B41/00 ,  B32B2309/68 ,  B32B2310/0472 ,  B32B2457/14 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67103 ,  H01L21/68728 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1939 ,  Y10T156/1972

摘要： A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.

公开(公告)号：US20090317617A1

公开(公告)日：2009-12-24

申请号：US12484316

申请日：2009-06-15

申请人： Mitsuru SATO ,  Takatoshi YAMAMOTO

发明人： Mitsuru SATO ,  Takatoshi YAMAMOTO

IPC分类号： C09J7/02 ,  B32B37/00

CPC分类号： H05K3/321 ,  B32B37/12 ,  B32B2309/02 ,  B32B2310/0472 ,  B32B2310/0831 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  C09J7/20 ,  H05K3/4015 ,  H05K2203/1105 ,  H05K2203/121 ,  Y10T428/28 ,  Y10T428/2804

摘要： A bonding film-formed base member includes a base member and a bonding film formed by supplying a liquid material containing a metal complex on a surface of the base member and then drying and burning the liquid material. The bonding film includes a metal atom and a leaving group made of an organic component. In the bonding-film formed base member, energy is applied to at least a partial region of a surface of the bonding film to eliminate the leaving group present near the surface of the bonding film from the bonding film so as to allow the at least a partial region of the surface to have adhesion to an object intended to be bonded to the bonding film-formed base member.

摘要翻译： 接合膜形成的基底构件包括基底构件和通过在基底构件的表面上供给含有金属络合物的液体材料，然后干燥和燃烧液体材料而形成的接合膜。 接合膜包括金属原子和由有机组分制成的离去基团。 在接合膜形成的基底部件中，能量被施加到接合膜的表面的至少一部分区域，以消除接合膜表面附近存在的离开基团，从而允许至少一个 表面的局部区域具有与要接合到接合膜形成的基底构件的物体的粘合性。

公开(公告)号：US20170305069A1

公开(公告)日：2017-10-26

申请号：US15518364

申请日：2015-10-09

申请人： USHIO DENKI KABUSHIKI KAISHA

发明人： Makoto WASAMOTO ,  Fumitoshi TAKEMOTO ,  Shinji SUZUKI

IPC分类号： B29C65/14 ,  B29C65/00 ,  B81C3/00 ,  B29C65/78 ,  C08J5/12 ,  G01N35/00

CPC分类号： B29C65/1406 ,  B29C65/02 ,  B29C65/7847 ,  B29C65/8215 ,  B29C65/8223 ,  B29C66/0222 ,  B29C66/0242 ,  B29C66/026 ,  B29C66/028 ,  B29C66/11 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/54 ,  B29C66/712 ,  B29C66/7465 ,  B29L2031/756 ,  B32B38/0008 ,  B32B38/164 ,  B32B2037/0092 ,  B32B2038/166 ,  B32B2309/68 ,  B32B2310/0472 ,  B32B2310/0831 ,  B32B2310/14 ,  B81C3/001 ,  B81C2201/019 ,  C08J5/121 ,  G01N2035/00455 ,  H01L21/48

摘要： Provided is a workpiece bonding method that makes it possible to achieve a joining state with a high strength and to obtain a good repeatability of the joining state.A workpiece bonding method according to the present invention is a workpiece bonding method for bonding two workpieces to each other, each of the two workpieces being composed of a material selected from the group consisting of synthetic resin, glass, silicon wafer, crystal and sapphire, the workpiece bonding method including: a surface activation step of activating a bonded surface of at least one of the workpieces; and a laminating step of laminating the two workpieces such that respective bonded surfaces contact with each other, and a pretreatment step of removing moisture from the bonded surface of the workpiece that is to be subjected to the surface activation step is performed before the surface activation step is performed.

公开(公告)号：US20110165403A1

公开(公告)日：2011-07-07

申请号：US13055484

申请日：2009-07-21

申请人： Patrice Lefebure

发明人： Patrice Lefebure

IPC分类号： B32B15/08 ,  B32B5/28 ,  B32B27/06 ,  B32B27/04 ,  B32B37/02

CPC分类号： B29C70/088 ,  B29C70/025 ,  B29C70/028 ,  B29C70/16 ,  B29C70/22 ,  B29C70/386 ,  B29C70/58 ,  B29C70/78 ,  B29C70/885 ,  B29K2071/00 ,  B29K2079/085 ,  B29K2081/04 ,  B29K2705/02 ,  B29K2705/10 ,  B32B5/024 ,  B32B15/08 ,  B32B15/20 ,  B32B17/04 ,  B32B27/20 ,  B32B27/281 ,  B32B27/285 ,  B32B37/06 ,  B32B37/1207 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/10 ,  B32B2307/202 ,  B32B2307/714 ,  B32B2307/718 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2310/0472 ,  B32B2310/0825 ,  B32B2310/0843 ,  B32B2311/00 ,  B32B2398/20 ,  B32B2419/00 ,  B32B2605/08 ,  B32B2605/18 ,  B64D45/02 ,  Y10T156/10 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31688

摘要： A metallization ply (1) for the metallization of a thermoplastic composite material part (3), includes in the body thereof at least one substantially continuous metal layer (10) and at least one binding layer (11) secured to the metal layer and realized with a thermoplastic resin. A manufacturing method for a metallized thermoplastic composite material part (3) includes i) a step in which a structural ply or plies (20) are deposited forming a structural layer (2) of the part, ii) a step in which the metallization ply (1) is deposited on an outer face (2a) of the structural layer (2) with the binding layer (11) on the side of the outer face (2a) of the structural layer (2), and iii) a step in which the metallization ply (1) is consolidated with the structural layer (2). A metallized thermoplastic composite material part (3) is also described.

摘要翻译： 用于金属化热塑性复合材料部分（3）的金属化层（1）在其主体中包括至少一个基本上连续的金属层（10）和至少一个固定到金属层上的粘合层（11），并且实现 与热塑性树脂。 金属化热塑性复合材料部件（3）的制造方法包括i）沉积形成该部件的结构层（2）的结构层或层（20）的步骤，ii）其中金属化层 （1）在结构层（2）的外表面（2a）上沉积有结合层（2）的外表面（2a）侧上的粘结层（11），以及iii） 金属层（1）与结构层（2）固结。 还描述了金属化热塑性复合材料部件（3）。