公开(公告)号：US12106935B2

公开(公告)日：2024-10-01

申请号：US18139184

申请日：2023-04-25

申请人： Applied Materials, Inc.

发明人： Joseph C. Olson ,  Morgan Evans ,  Rutger Meyer Timmerman Thijssen

IPC分类号： H01J37/305 ,  G02B6/136 ,  H01J37/12 ,  H01J37/147 ,  H01J37/20 ,  G02B6/12

CPC分类号： H01J37/3053 ,  G02B6/136 ,  H01J37/12 ,  H01J37/1478 ,  H01J37/20 ,  H01J37/3056 ,  G02B2006/12107 ,  H01J2237/1507 ,  H01J2237/3174

摘要： Embodiments described herein relate to methods and apparatus for forming gratings having a plurality of fins with different slant angles on a substrate and forming fins with different slant angles on successive substrates using angled etch systems and/or an optical device. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle ϑ relative to a surface normal of the substrates and form gratings in the grating material.

公开(公告)号：US20240321548A1

公开(公告)日：2024-09-26

申请号：US18187700

申请日：2023-03-22

申请人： NUVOTON TECHNOLOGY CORPORATION

发明人： Yuval Kirschner

IPC分类号： H01J37/305 ,  H01J37/30 ,  H01J37/304

CPC分类号： H01J37/3056 ,  H01J37/3005 ,  H01J37/304 ,  H01J2237/31745 ,  H01J2237/31749

摘要： An Integrated Circuit (IC), designed for debugging by Focused Ion Beam (FIB) editing, includes functional circuitry, a network of Basic FIB elements (BFEs), and routing circuitry. The functional circuitry includes functional nodes. Each of the BFEs includes a respective metal pad configured to be connected to one of the functional nodes using FIB editing. The routing circuitry is configured to route one or more selected BFEs for analysis.

公开(公告)号：US20240274397A1

公开(公告)日：2024-08-15

申请号：US18509372

申请日：2023-11-15

申请人： Carl Zeiss Microscopy GmbH

发明人： Sebastian Schaedler

IPC分类号： H01J37/147 ,  H01J37/302 ,  H01J37/305

CPC分类号： H01J37/1474 ,  H01J37/3023 ,  H01J37/3053

摘要： Operating a particle beam apparatus includes processing, imaging, and/or analyzing an object. When guiding the particle beam along first dwell regions of a first scan line, the particle beam remains at each of the first dwell regions for a first dwell time. When guiding the particle beam along second dwell regions of a second scan line, the particle beam remains at each of the second dwell regions for a second dwell time. The first dwell time is shorter than the second dwell time. Alternatively, a first region of the first dwell regions has a first spacing with respect to a closest arranged adjacent second region of the first dwell regions. A first region of the second dwell regions has a second spacing with respect to a closest arranged adjacent second region of the second dwell regions. The second spacing is smaller than the first spacing.

公开(公告)号：US20240249909A1

公开(公告)日：2024-07-25

申请号：US18099169

申请日：2023-01-19

申请人： Applied Materials Israel Ltd.

发明人： Yehuda Zur ,  Konstantin Chirko

IPC分类号： H01J37/28 ,  H01J37/20 ,  H01J37/22 ,  H01J37/305

CPC分类号： H01J37/28 ,  H01J37/20 ,  H01J37/222 ,  H01J37/3056 ,  H01J2237/31749

摘要： A method of evaluating, with an evaluation tool that includes a first charged particle column, a region of interest on a sample that includes an array of holes separated by solid portions, the method comprising: positioning the sample such that the region of interest is under a field of view of the first charged particle column; and locally depositing material within the array of holes in the region of interest by: pulsing a flow of deposition gas to the region of interest by turning the flow of the deposition gas ON and then OFF; thereafter, scanning a charged particle beam generated by the first charged particle column across the region of interest; and iteratively repeating the pulsing and scanning steps a plurality of times to locally deposit material within the array of holes in the region of interest.

公开(公告)号：US12040196B2

公开(公告)日：2024-07-16

申请号：US17578903

申请日：2022-01-19

申请人： FEI Company

发明人： James Clarke ,  Micah LeDoux ,  Jason Lee Monfort ,  Brett Avedisian

IPC分类号： G01N1/32 ,  G11C5/02 ,  G11C5/06 ,  H01J37/305 ,  H01L21/3213 ,  H01L21/67 ,  H10B41/27 ,  H10B43/27

CPC分类号： H01L21/32131 ,  G01N1/32 ,  G11C5/025 ,  G11C5/06 ,  H01J37/3056 ,  H01L21/67069 ,  H10B41/27 ,  H10B43/27

摘要： Apparatus and methods are disclosed for sample preparation, suitable for online or offline use with multilayer samples. Ion beam technology is leveraged to provide rapid, accurate delayering with etch stops at a succession of target layers. In one aspect, a trench is milled around a region of interest (ROI), and a conductive coating is developed on an inner sidewall. Thereby, reliable conducting paths are formed between intermediate layers within the ROI and a base layer, and stray current paths extending outside the ROI are eliminated, providing better quality etch progress monitoring, during subsequent etching, from body or scattered currents. Ion beam assisted gas etching provides rapid delayering with etch stops at target polysilicon layers. Uniform etching at deep layers can be achieved. Variations and results are disclosed.

公开(公告)号：US20240177967A1

公开(公告)日：2024-05-30

申请号：US18522679

申请日：2023-11-29

申请人： FEI Company

发明人： Matej Dolník ,  Veronika Vrbovská ,  Radim Kríž ,  Jakub Kuba ,  Tilman Franke

IPC分类号： H01J37/305

CPC分类号： H01J37/3056 ,  H01J2237/31749

摘要： The disclosure relates to a method for micromachining a biological sample for creating a lamella for analysis in a Cryo-Charged Particle Microscope (Cryo-CPM). The method comprising the steps of providing a biological sample on a sample carrier; Locating a sample area on the sample carrier, said sample area comprising a region of interest having biological material from which a lamella can be created; and Micromachining at least part of the biological sample so as to remove material in a part of the sample area surrounding the region of interest, in order to increase a visual contrast between the biological material in the region of interest and its surroundings. With the increased visual contrast a location for a potential lamella can be identified.

公开(公告)号：US20240177966A1

公开(公告)日：2024-05-30

申请号：US18432838

申请日：2024-02-05

申请人： FIBICS INCORPORATED

发明人： Michael William PHANEUF ,  Ken Guillaume LAGAREC

IPC分类号： H01J37/26 ,  H01J37/22 ,  H01J37/28 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305

CPC分类号： H01J37/26 ,  H01J37/222 ,  H01J37/28 ,  H01J37/3005 ,  H01J37/304 ,  H01J37/3045 ,  H01J37/3056 ,  G06T2207/10061 ,  H01J2237/226 ,  H01J2237/2811 ,  H01J2237/3174 ,  H01J2237/31749

摘要： Linear fiducials with known angles relative to each other are formed such that their structures appear in a cross-sectional face of the sample as a distinct structure. Therefore, when imaging the cross-section face during the cross-sectioning operation, the distance between the identified structures allows unique identification of the position of the cross-section plane along the Z axis. Then a direct measurement of the actual position of each slice can be calculated, allowing for dynamic repositioning to account for drift in the plane of the sample and also dynamic adjustment of the forward advancement rate of the FIB to account for variations in the sample, microscope, microscope environment, etc. that contributes to drift. An additional result of this approach is the ability to dynamically calculate the actual thickness of each acquired slice as it is acquired.

公开(公告)号：US11972923B2

公开(公告)日：2024-04-30

申请号：US17566904

申请日：2021-12-31

申请人： FEI Company

发明人： Christopher Thompson ,  Dustin Ellis ,  Adam Stokes ,  Ronald Kelley ,  Cedric Bouchet-Marquis

IPC分类号： H01J37/305 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28

CPC分类号： H01J37/3056 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/2007 ,  H01J2237/208 ,  H01J2237/31745 ,  H01J2237/31749

摘要： Methods and systems for creating attachments between a sample manipulator and a sample within a charged particle systems are disclosed herein. Methods include translating a sample manipulator so that it is proximate to a sample, and milling portions of the sample manipulator such that portions are removed. The portion of the sample manipulator proximate to the sample is composed of a high sputter yield material, and the high sputter yield material may be the material milled with the charged particle beam such that it is removed from the sample manipulator. According to the present disclosure, the portions of the sample manipulator are milled such that at least some of the removed high sputter yield material redeposits to form an attachment between the sample manipulator and the sample.

公开(公告)号：US20240120174A1

公开(公告)日：2024-04-11

申请号：US18273325

申请日：2021-01-22

申请人： Hitachi High-Tech Corporation

发明人： Shota AIDA ,  Hisayuki TAKASU ,  Atsushi KAMINO ,  Hitoshi KAMOSHIDA

IPC分类号： H01J37/305 ,  H01J37/08 ,  H01J37/24

CPC分类号： H01J37/3056 ,  H01J37/08 ,  H01J37/243

摘要： In order to improve the processing reproducibility, an ion milling device 100 includes a sample chamber 107, a sample stage 102 that is disposed in the sample chamber on which a sample is placed, an ion source 101 that emits an unfocused ion beam toward the sample, a control unit 112 that controls an output of the ion beam, an oscillator 104 that is disposed in the sample chamber, and an oscillation circuit 111 that oscillates the oscillator and outputs an oscillation signal to the control unit, in which the control unit controls the output of the ion beam such that a vibrational frequency change amount of the oscillator per unit time due to deposition of sputtered particles generated by irradiating the sample with the ion beam on the oscillator is kept within a predetermined range.

公开(公告)号：US11955311B2

公开(公告)日：2024-04-09

申请号：US17835875

申请日：2022-06-08

申请人： NISSIN ION EQUIPMENT CO., LTD.

发明人： Shinya Takemura

IPC分类号： H01J37/08 ,  G06N20/00 ,  H01J37/304 ,  H01J37/305 ,  H01J37/317

CPC分类号： H01J37/3056 ,  G06N20/00 ,  H01J37/08 ,  H01J37/304 ,  H01J37/3171

摘要： An ion beam irradiation apparatus includes modules for generating an ion beam according to a recipe, and a control device. The control device receives the recipe including a processing condition for new processing, reads, from a monitored value storage, a monitored value that indicates a state of a module during a last processing immediately before the new processing, inputs the processing condition and the monitored value to a trained machine learning algorithm and receives, as an output from the trained machine learning algorithm, an initial value for the module, and outputs the initial value to the module to set up the module for generating the ion beam.