公开(公告)号：US11937381B2

公开(公告)日：2024-03-19

申请号：US17309699

申请日：2019-12-30

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Ankit Mahajan ,  Mikhail L Pekurovsky ,  Saagar A. Shah ,  Kayla C. Niccum ,  Kara A. Meyers ,  Christopher G. Walker

IPC分类号： H05K3/32 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01R12/62 ,  H05K3/12 ,  H05K3/36 ,  H05K3/40 ,  H01R4/04

CPC分类号： H05K3/321 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/32 ,  H01R12/62 ,  H05K3/1258 ,  H05K3/1283 ,  H05K3/361 ,  H05K3/4069 ,  H01L2224/32235 ,  H01R4/04 ,  H05K2203/1545

摘要： A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.

公开(公告)号：US11705646B2

公开(公告)日：2023-07-18

申请号：US17000775

申请日：2020-08-24

申请人： HIRAKAWA HEWTECH CORPORATION

发明人： Hiroyuki Tanaka

IPC分类号： G01J1/44 ,  H01R4/02 ,  H01R4/04

CPC分类号： H01R4/023 ,  G01J1/44 ,  H01R4/029 ,  H01R4/04 ,  G01J2001/448

摘要： A connection structure between sensor and cable includes a cable formed by assembling a plurality of electric wires each including a covering portion covering a core and a core-exposing portion exposing the core at an end of the covering portion, a spacer that is interposed in a space surrounded by the covering portions of the electric wires and holds end portions of the covering portions in the state that the end portions are spaced from each other, and a sensor that detects a physical quantity, and the core-exposing portion of each of the electric wires of the cable is electrically connected to the sensor via a fixing member in the state that each of the electric wires is held by the spacer.

公开(公告)号：US20230198186A1

公开(公告)日：2023-06-22

申请号：US17910987

申请日：2021-03-18

申请人： DEXERIALS CORPORATION

发明人： Ryosuke ODAKA ,  Ryo ITO ,  Hiroyuki KUMAKURA ,  Tomoyuki ABE ,  Daisuke SATO ,  Katsuhisa ORIHARA ,  Kazuhisa AOKI

IPC分类号： H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

CPC分类号： H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

摘要： A connection body capable of achieving fine pitch and miniaturization, and a method of manufacturing the connection body. A connection body includes: a substrate having a first terminal array; a connector having second terminal array; and an adhesive layer formed by curing a thermosetting connection material connecting the first terminal array and the second terminal array, wherein the second terminal array is disposed on the bottom surface of the connector and forms a level difference canceling portion for canceling a level difference in the bottom surface, and wherein the thermosetting connection material contains solder particles and a flux component. Thus, the first terminal array and the second terminal array can be connected, so that the terminal array can be made to have a fine pitch, and the connected body can be miniaturized.

公开(公告)号：US20230163489A1

公开(公告)日：2023-05-25

申请号：US17905415

申请日：2021-03-03

申请人： Showa Denko Materials Co., Ltd.

发明人： Tetsuyuki SHIRAKAWA ,  Katsuhiko TOMISAKA ,  Takahiro FUKUI

IPC分类号： H01R4/04 ,  B65H75/02 ,  C09J9/02 ,  C09J7/10

CPC分类号： H01R4/04 ,  B65H75/02 ,  C09J9/02 ,  C09J7/10 ,  C09J2203/326 ,  C09J2301/408 ,  C09J2461/00

摘要： An adhesive film including a first adhesive layer, wherein the first adhesive layer contains a first adhesive component and a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles that are dendritic conductive particles, and second conductive particles that are conductive particles other than the first conductive particles, each conductive particle containing a non-conductive core and a conductive layer provided on the core, and a part of the plurality of conductive particles is disposed to protrude from one surface of the first adhesive layer.

公开(公告)号：US11575220B1

公开(公告)日：2023-02-07

申请号：US16522832

申请日：2019-07-26

申请人： Bruce R. Crain ,  Eric S. Cramer ,  Michael C. Hofmeister ,  Kevin M. Gallenstein ,  Jessica N. Pearce ,  Sandra J. Stash ,  Daniel E. Suh

发明人： Bruce R. Crain ,  Eric S. Cramer ,  Michael C. Hofmeister ,  Kevin M. Gallenstein ,  Jessica N. Pearce ,  Sandra J. Stash ,  Daniel E. Suh

IPC分类号： F16B11/00 ,  H01R4/64 ,  B29C65/00 ,  B29C65/48 ,  H01R4/04 ,  H01R43/00 ,  B64D45/02 ,  B29L31/30

摘要： A bonded joint for use in bonding composite materials is provided and includes a composite rib having electrically conductive properties and a composite structure having electrically conductive properties. An electrically conductive preform is provided that facilitates a bond between the composite rib and the composite structure. A mesh composition that bonds the composite rib to the preform and that bonds the preform to the composite structure is provided and is electrically conductive to conduct current between the composite rib and the composite structure.

公开(公告)号：US20220254540A1

公开(公告)日：2022-08-11

申请号：US17702936

申请日：2022-03-24

申请人： DEXERIALS CORPORATION

发明人： Masahiro IIYAMA ,  Reiji TSUKAO

IPC分类号： H01B1/20 ,  H01R4/04 ,  B32B27/14 ,  B32B27/08

摘要： A conductive tape comprising a conductive particle-containing layer containing at least a binder resin layer and a plurality of conductive particles, In this conductive tape, the plurality of conductive particles are distributedly disposed independently from each other on one surface of the binder resin layer, a surface of the binder resin layer in a vicinity of each of the conductive particles has an inclination or an undulation with respect to a tangent plane of the binder resin layer in a center portion between adjacent conductive particles, in the inclination, the surface of the binder resin layer around the conductive particle is lacked with respect to the tangent plane, and in the undulation, a resin amount of the binder resin layer right above the conductive particle is smaller than that when the surface of the binder resin layer right above the conductive particle is flush with the tangent plane.

公开(公告)号：US20220158366A1

公开(公告)日：2022-05-19

申请号：US17649969

申请日：2022-02-04

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Christian Vockenberger ,  Rainer Frauwallner ,  Thomas Krivec

IPC分类号： H01R4/48 ,  H01R4/04 ,  H01R4/34 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

摘要： An arrangement is illustrated and described. The arrangement includes a component carrier including ia) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ib) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier; ii) the further component carrier connected with the component carrier by the at least one elastic element, wherein the further component carrier includes: iia) a further recess configured such that the component carrier is at least partially placeable into the further recess; iii) the component carrier is a smaller unit than the further component carrier, and iv) the component carrier is at least partially placed into the further recess.

公开(公告)号：US11316286B2

公开(公告)日：2022-04-26

申请号：US16921472

申请日：2020-07-06

申请人： DONGGUAN LUXSHARE PRECISION INDUSTRY CO. LTD.

发明人： Yun Feng ,  ZhiYong Li ,  ZhongYuan Lai

IPC分类号： H01R4/04 ,  H01R13/405 ,  H01R24/60

摘要： The present disclosure provides an electrical connector comprising an electrical connector body, a conductive adhesive layer, and a connecting cable. The electrical connector body comprises a plurality of electrical connecting conductors. The conductive adhesive layer covers the plurality of electrical connecting conductors. The connecting cable comprises a plurality of cables. One end of each of the cables comprises a conductive pin. The conductive pin of each of the cables is disposed on the conductive adhesive layer. The conductive pin of each of the cables forms an electrical connection path with the corresponding electrical connecting conductor. The plurality of electrical connection paths is individually separated. By combining the conductive pins of each cable with the electrical connecting conductors of the electrical connector body through a conductive adhesive layer, an electrical connection path could be formed to bond the connecting cable and the electrical connector body without any existing soldering process.

公开(公告)号：US20220084975A1

公开(公告)日：2022-03-17

申请号：US17536555

申请日：2021-11-29

申请人： DEXERIALS CORPORATION

发明人： Reiji TSUKAO ,  Yasushi AKUTSU

IPC分类号： H01L23/00 ,  B32B5/30 ,  B32B27/06 ,  B32B3/30 ,  B32B7/04 ,  B32B27/28 ,  C09J4/00 ,  B32B7/02 ,  H05K3/32 ,  C09J163/00 ,  C09J201/00 ,  B32B7/00 ,  B32B3/00 ,  B32B27/00 ,  H01R4/04 ,  B32B27/08 ,  C08L63/00 ,  C09J7/10

摘要： An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

公开(公告)号：US11221513B2

公开(公告)日：2022-01-11

申请号：US16439449

申请日：2019-06-12

申请人： Apple Inc.

发明人： Supriya Goyal ,  Yuxi Zhao ,  Xinsheng Chu ,  Chan Hyuk Park ,  Min Tao ,  Wenyong Zhu

IPC分类号： G02F1/13 ,  G02F1/13357 ,  F21V8/00 ,  H05K1/11 ,  G02F1/1345 ,  H05K1/02 ,  H01R12/62 ,  H01R4/04 ,  G02F1/1368 ,  G02F1/133 ,  G09G3/00 ,  G09G3/36

摘要： An electronic device includes display layers such as liquid crystal display layers and a backlight unit that provides illumination for the display layers. The backlight unit includes light-emitting diodes that emit light into the edge of a light guide film. To minimize the inactive area of the display, the light-emitting diodes are tightly spaced to approximate a line light source instead of point light sources. Color and/or luminance compensation layers are incorporated at various locations within the backlight structures to ensure that the backlight provided to the display layers is homogenous. A thin-film transistor layer of the display is coupled to a printed circuit board by a flexible printed circuit. The flexible printed circuit has additional solder mask layers to improve robustness, encapsulation, and traces with a varying pitch.