公开(公告)号：WO2012116157A2

公开(公告)日：2012-08-30

申请号：PCT/US2012/026284

申请日：2012-02-23

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS DEUTSCHLAND GMBH ,  TEXAS INSTRUMENTS JAPAN LIMITED ,  LANGE, Bernhard ,  PUCHERT, Thies

Inventor： LANGE, Bernhard ,  PUCHERT, Thies

IPC: H01L23/12 ,  H01L21/60 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L23/3677 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/2105 ,  H01L2224/221 ,  H01L2224/2518 ,  H01L2224/9202 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/10253 ,  H05K1/0206 ,  H05K1/185 ,  H05K2201/066 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: A semiconductor device is described comprising a semiconductor die 2 that is embedded in a package, wherein the die has a front side 28 comprising a plurality of pads to be bonded to terminals of the package, and wherein a backside 16 of the die is coupled to a backside surface 29 of the package by a thermal bridge.

Abstract translation: 描述半导体器件，其包括嵌入在封装中的半导体管芯2，其中管芯具有包括多个待焊接到封装的端子的焊盘的正面28，并且其中a 芯片的背面16通过热桥与封装的背面29相连。

公开(公告)号：WO2008039717A2

公开(公告)日：2008-04-03

申请号：PCT/US2007079301

申请日：2007-09-24

Applicant: TEXAS INSTRUMENTS INC ,  KUMMERL STEVEN ALFRED ,  LANGE BERNHARD PETER ,  HOLLOWAY JEFFREY GAIL

Inventor： KUMMERL STEVEN ALFRED ,  LANGE BERNHARD PETER ,  HOLLOWAY JEFFREY GAIL

IPC: H01L23/495 ,  H01L21/00

CPC classification number: H01L23/3107 ,  H01L21/568 ,  H01L2224/48247 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Semiconductor dies and methods to mold lock a semiconductor die are disclosed. A disclosed example semiconductor die includes a top surface (12), a bottom surface (14), and a plurality of sides joining the top surface and the bottom surface. At least one of the sides includes an interference structure to mold lock the die in a package.

Abstract translation: 公开了半导体管芯和模具锁定半导体管芯的方法。 公开的示例半导体管芯包括顶面（12），底面（14）以及连接顶面和底面的多个侧面。 至少一个侧面包括干涉结构以将模具锁定在包装中。

公开(公告)号：WO2008005911A2

公开(公告)日：2008-01-10

申请号：PCT/US2007072627

申请日：2007-07-02

Applicant: TEXAS INSTRUMENTS INC ,  LANGE BERNHARD P

Inventor： LANGE BERNHARD P

IPC: H01L23/495

CPC classification number: H01L23/49582 ,  H01L21/4842 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48664 ,  H01L2224/48764 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85464 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In a method and system for fabricating a leadframe (100), a thickness of bondable areas (150, 154) of the leadframe is reduced. A plating finish (160) is applied to a surface of the leadframe, including the surface of the bondable areas to provide a smooth texture. A selective portion (102) of the surface is removed by grinding off the plating finish on the selective portion to provide a rough texture while substantially preserving the smooth texture on the bondable areas. Removal of the plating finish on the selective portion causes the selective portion to form the rough texture, compared to the smooth texture of the plating finish. The rough texture provides increased adhesion to a polymeric compound compared to an adhesion provided by the smooth texture. Bondability of the bondable areas is maintained by preserving the smooth texture of the plating finish.

Abstract translation: 在用于制造引线框架（100）的方法和系统中，引线框架的可粘合区域（150,154）的厚度减小。 将电镀处理（160）施加到引线框架的表面，包括可粘合区域的表面以提供光滑的纹理。 通过研磨选择部分上的镀层去除表面的选择部分（102）以提供粗糙的质地，同时基本上保持可粘合区域上的光滑质地。 与镀层的光滑质地相比，在选择部分上除去电镀光泽使得选择部分形成粗糙的纹理。 与由光滑纹理提供的粘合相比，粗糙纹理提供对聚合物的增加的粘合性。 可焊接区域的粘合性通过保持电镀光洁度的光滑质感来维持。

公开(公告)号：WO2007002689A2

公开(公告)日：2007-01-04

申请号：PCT/US2006025023

申请日：2006-06-26

Applicant: TEXAS INSTRUMENTS INC ,  LANGE BERNHARD P ,  KUMMERL STEVEN A

Inventor： LANGE BERNHARD P ,  KUMMERL STEVEN A

IPC: H01L23/495

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device comprising a leadframe (903), which has first (903a) and second (903b) surfaces, a planar pad (910) of a certain size, and a plurality of non-coplanar members (913) adjoining the pad. The device further has a heat spreader (920) with first (920a) and second (920b) surfaces, a planar pad of a size matching the leadframe pad size, and contours (922), into which the leadframe members are inserted so that the first spreader pad surface touches the second leadframe pad surface across the pad size. A semiconductor chip (904) is mounted on the first leadframe pad surface. Encapsulation material (930), preferably molding compound, covers the chip, but leaves the second spreader surface uncovered.

Abstract translation: 一种半导体器件，包括具有第一（903a）和第二（903b）表面的引线框架（903），一定尺寸的平面焊盘（910）以及与焊盘相邻的多个非共面元件（913）。 该设备还具有具有第一（920a）和第二（920b）表面的散热器（920），尺寸与引线框架衬垫尺寸相匹配的平面衬垫以及引线框架构件插入其中的轮廓（922），使得 第一扩展器焊盘表面在整个焊盘尺寸上接触第二引线框焊盘表面。 半导体芯片（904）安装在第一引线框垫表面上。 封装材料（930）（优选模制化合物）覆盖芯片，但是没有覆盖第二散热器表面。

公开(公告)号：WO2006091940A1

公开(公告)日：2006-08-31

申请号：PCT/US2006/006853

申请日：2006-02-27

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  LANGE, Bernhard ,  BOYD, William, David

Inventor： LANGE, Bernhard ,  BOYD, William, David

IPC: H01L23/495 ,  H01L23/36 ,  H05K1/18 ,  H05K7/06

CPC classification number: H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package (100) comprises an IC (102) and leads (104) coupled to the IC. Each lead has a first end (106) configured to be coupled to the integrated circuit and a second end (108) configured to pass through one of a plurality of mounting holes (110) extending through a mounting board (112). The leads comprise at least one positioning lead (114) comprising a stop (118) being a continuous part of the positioning lead and having a lateral dimension (120) greater than a diameter (122) of a first hole (124) of the plurality of mounting holes. The leads further comprise at least one non-positioning lead (116) having a continuous uniformly shaped body (130) with a lateral dimension (132) less than a diameter (134) of a second hole (136) of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

Abstract translation: 集成电路（IC）封装（100）包括耦合到IC的IC（102）和引线（104）。 每个引线具有被配置为耦合到集成电路的第一端（106）和被配置为穿过延伸穿过安装板（112）的多个安装孔（110）中的一个的第二端（108）。 引线包括至少一个定位引线（114），该定位引线（114）包括作为定位引线的连续部分的止动件（118），并且具有大于多个第一孔（124）的直径（122）的横向尺寸（120） 的安装孔。 引线还包括至少一个具有连续均匀成形的主体（130）的非定位引线（116），其横向尺寸（132）小于多个安装孔中的第二孔（136）的直径（134） 。 停止限制非定位导线通过第二个孔的延伸。

公开(公告)号：WO2006081398A3

公开(公告)日：2006-08-03

申请号：PCT/US2006/002886

申请日：2006-01-26

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  LANGE, Bernhard, P.

Inventor： LANGE, Bernhard, P.

IPC: C04B41/00 ,  B41B11/62 ,  H01L23/12 ,  H01L23/053 ,  H01L23/04 ,  H01L23/544 ,  H01L21/00

Abstract: Small feature identifying markings (24) are provided for tracing completed IC (integrated circuit) packages (20) to individual mold cavities. Preferred embodiments of the invention include IC packages and associated methods for forming indicia in a surface of an integrated circuit package in an arrangement indicative of a particular mold cavity. The indicia may be read to determine the particular mold cavity associated with the manufacture of an individual integrated circuit package. Preferred embodiments of the invention are included using surface dots or indentation indicia configured in a binary code arrangement.

公开(公告)号：WO2012116157A3

公开(公告)日：2012-11-22

申请号：PCT/US2012026284

申请日：2012-02-23

Applicant: TEXAS INSTRUMENTS INC ,  TEXAS INSTRUMENTS DEUTSCHLAND ,  TEXAS INSTRUMENTS JAPAN ,  LANGE BERNHARD ,  PUCHERT THIES

Inventor： LANGE BERNHARD ,  PUCHERT THIES

IPC: H01L23/12 ,  H01L21/60 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L23/3677 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/2105 ,  H01L2224/221 ,  H01L2224/2518 ,  H01L2224/9202 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/10253 ,  H05K1/0206 ,  H05K1/185 ,  H05K2201/066 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: A semiconductor device is described comprising a semiconductor die 2 that is embedded in a package, wherein the die has a front side 28 comprising a plurality of pads to be bonded to terminals of the package, and wherein a backside 16 of the die is coupled to a backside surface 29 of the package by a thermal bridge.

Abstract translation: 描述了一种半导体器件，其包括嵌入在封装中的半导体管芯2，其中管芯具有前侧28，前侧28包括要接合到封装的端子的多个焊盘，并且其中管芯的背面16连接到 通过热桥的封装的背面29。

公开(公告)号：WO2012103203A2

公开(公告)日：2012-08-02

申请号：PCT/US2012/022532

申请日：2012-01-25

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS DEUTSCHLAND GMBH ,  TEXAS INSTRUMENTS JAPAN LIMITED ,  GROSS, Johann ,  LANGE, Bernhard

Inventor： GROSS, Johann ,  LANGE, Bernhard

IPC: G06K19/077 ,  G06K17/00

CPC classification number: G06K19/07754 ,  H01L2224/4813 ,  Y10T29/49016

Abstract: An RFID (radio frequency identification) transponder having a semiconductor die (6) with a solderable contact area (12) and an antenna made from a winding wire (2), wherein the winding wire is soldered to the contact area (12) and the solderable contact area (12) is made from a nickel based alloy.

Abstract translation: 一种具有可焊接接触区域（12）的半导体管芯（6）和由绕组线（2）制成的天线的RFID（射频识别）应答器，其中绕组线被焊接到接触区域（12）和 可焊接接触区域（12）由镍基合金制成。

公开(公告)号：WO2008055105A3

公开(公告)日：2008-06-26

申请号：PCT/US2007082844

申请日：2007-10-29

Applicant: TEXAS INSTRUMENTS INC ,  LANGE BERNHARD P ,  COYLE ANTHONY L ,  HOLLOWAY JEFFREY GAIL

Inventor： LANGE BERNHARD P ,  COYLE ANTHONY L ,  HOLLOWAY JEFFREY GAIL

IPC: H01L21/00 ,  H01L21/48

CPC classification number: H01L21/561 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/10689 ,  H05K2201/10931 ,  H05K2201/10969 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed herein is a method of manufacturing a semiconductor package (101) with a solder standoff (161) on lead pads (103) that reach to the edge of the package (non-pullback leads). It includes encapsulating a plurality of die (104) on a lead frame strip (110). The lead frame strip comprises a plurality of package sites, which further comprises a plurality of lead pads and a die pad (107). The method also includes forming a channel between the lead pads of nearby package sites without singulating the packages. Another step in the method includes disposing solder on the lead pads, the die pad, or the lead pads and the die pads without substantially covering the channel with solder. The manufacturing method further includes singulating the packages.

Abstract translation: 本文公开了一种制造半导体封装（101）的方法，该半导体封装具有在到达封装边缘（非回拉引线）的引线焊盘（103）上的焊料支座（161）。 它包括将多个管芯（104）封装在引线框条（110）上。 引线框条包括多个封装部位，其还包括多个引线焊盘和管芯焊盘（107）。 该方法还包括在邻近封装位置的引线焊盘之间形成沟道而不分割封装。 该方法中的另一个步骤包括将焊料设置在引线焊盘，管芯焊盘或引线焊盘和管芯焊盘上，而基本上不用焊料覆盖通道。 该制造方法还包括分割包装。

公开(公告)号：WO2007022399A3

公开(公告)日：2008-02-14

申请号：PCT/US2006032244

申请日：2006-08-15

Applicant: TEXAS INSTRUMENTS INC ,  LANGE BERNHARD P

Inventor： LANGE BERNHARD P

IPC: H01L23/495

CPC classification number: H01L23/49541 ,  H01L23/49548 ,  H01L23/645 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device comprising a semiconductor chip (110) having a side edge (111) and a plurality of metal bond pads (120, 121) near the edge; the pads are aligned to form rows (130, 131) parallel to the edge. The device further includes a leadframe (100) having leads oriented with one end towards the chip edge and spaced from it by a gap (150); the chip is attached to the leadframe. Ends of selected leads are connected by a metal cross bar (160) parallel to the chip edge. Substantially parallel bond wires (170) are crossing the gap to connect each chip pad either to the crossbar or to a non-selected lead end. In a preferred lead arrangement, the selected leads alternate with non-selected leads.

Abstract translation: 一种装置，包括具有侧边缘（111）和靠近边缘的多个金属接合焊盘（120,121）的半导体芯片（110） 衬垫对齐以形成平行于边缘的行（130,131）。 所述装置还包括引线框架（100），所述引线框架（100）具有一端朝向所述芯片边缘定向的引线，并且通过间隙（150）与所述引线框架间隔开。 芯片连接到引线框。 所选导线的端部通过平行于芯片边缘的金属横杆（160）连接。 基本上平行的接合线（170）正在穿过间隙，以将每个芯片焊盘连接到横杆或未选择的引线端。 在优选的引线装置中，所选择的引线与未选择的引线交替。