DUAL-GATE DEVICE AND METHOD
    1.
    发明申请

    公开(公告)号:WO2008045589A3

    公开(公告)日:2008-04-17

    申请号:PCT/US2007/068339

    申请日:2007-05-07

    Abstract: A memory circuit having dual-gate memory cells and a method for fabricating such a memory circuit are disclosed. The dual-gate memory cells each include a memory device and an access device sharing a semiconductor layer, with their respective channel regions provided on different surfaces of the semiconductor layer. The semiconductor layer has a thickness such that a sensitivity parameter relating an electrical interaction between the gate electrodes of the access device and the memory device is less than a predetermined value. The dual-gate memory cells can be used as building blocks for a non-volatile memory array, such as a memory array formed by NAND-strings. In such an array, during programming of a nearby memory device in a NAND string, in NAND-strings not to be programmed, if inversion regions are allowed to be formed in the semiconductor layer, or if the semiconductor layer is allowed to electrically float, electrical interaction exists between the access devices and the memory devices to inhibit programming of the memory devices.

    DUAL-GATE SEMICONDUCTOR DEVICES WITH ENHANCE SCALABILITY
    5.
    发明申请
    DUAL-GATE SEMICONDUCTOR DEVICES WITH ENHANCE SCALABILITY 审中-公开
    具有增强可扩展性的双栅极半导体器件

    公开(公告)号:WO2007140081A3

    公开(公告)日:2008-07-24

    申请号:PCT/US2007068345

    申请日:2007-05-07

    Inventor: WALKER ANDREW J

    Abstract: A scalable semiconductor device is formed using control gates formed on opposite sides of a semiconductor layer. A first control gate is formed electrically isolated from a first surface of the semiconductor layer by a first dielectric layer, such that, when a first voltage is applied on the first control gate, a first depletion region is formed in the semiconductor layer opposite the first control gate. A second control gate and a third control gate are also formed, each isolated from the semiconductor region by a second dielectric layer formed on a second surface of the semiconductor layer opposite the first surface. The second and the third control gates are offset from the first control gate such that, when a second voltage is applied to the second and third control gates, depletion regions are formed opposite the second and third control gates, respectively, such that each of the depletion regions opposite the second and third control gates overlaps the first depletion region to serve as source and drain regions, when filled with mobile carriers, of a field-effect transistor to the first depletion region, which serves as a channel region of the field-effect transistor.

    Abstract translation: 使用形成在半导体层的相对侧上的控制栅极形成可伸缩半导体器件。 第一控制栅极通过第一介电层与半导体层的第一表面电隔离,使得当在第一控制栅极上施加第一电压时,在与第一栅极相反的半导体层中形成第一耗尽区 控制门 还形成第二控制栅极和第三控制栅极,每个通过形成在与第一表面相对的半导体层的第二表面上的第二介电层与半导体区域隔离。 第二和第三控制栅极偏离第一控制栅极,使得当第二电压施加到第二和第三控制栅极时,耗尽区分别与第二和第三控制栅极相对形成,使得每个 与第二和第三控制栅极相对的耗尽区域与第一耗尽区域重叠,用作当场效应晶体管充满移动载流子的源极和漏极区域到第一耗尽区域时,其用作场效应晶体管的沟道区域, 效应晶体管。

    NONVOLATILE MEMORY AND METHOD OF PROGRAM INHIBITION

    公开(公告)号:WO2007087097A3

    公开(公告)日:2007-08-02

    申请号:PCT/US2006/061875

    申请日:2006-12-11

    Abstract: A memory circuit and a method is provided for programming a dual-gate memory cell without program disturb in other dual-gate memory cells in the memory circuit coupled by common word lines (see FIG 3) In one embodiment, the method uses a self-boosting technique on unselected memory cells having source and drain regions in the shared semiconductor layer between their memory devic and their access devices brought to a predetermined voltage close to the threshold voltage of their access devices, thereby rendering th source and drain regions substantially floating In some embodiments, the source and drain regions are brought to the predetermined voltage via one or more select gates and intervening access gates In some embodiments, the select gates are overdriven (see FIGs 7- 12).

    DUAL-GATE DEVICE AND METHOD
    7.
    发明申请

    公开(公告)号:WO2007018821A3

    公开(公告)日:2007-02-15

    申请号:PCT/US2006/025438

    申请日:2006-06-29

    Abstract: A memory circuit having dual-gate memory cells and a method for fabricating such a memory circuit are disclosed. The dual-gate memory cells each include a memory device and an access device sharing a semiconductor layer, with their respective channel regions provided on different surfaces of the semiconductor layer. The semiconductor layer has a thickness, such that when a pass voltage is applied to the gate electrode of the access device, the access device and the memory device remains isolated, such that the charge stored in the memory device is unaffected by the pass voltage. The pass voltage is determined from a range of voltages, when applied to the access device, has no effect on the threshold voltage of the memory device. The dual-gate memory cells can be used as building blocks for a non-volatile memory array, such as a memory array formed by NAND-strings. In such an array, during programming of a nearby memory device in a NAND string, in NAND-strings not to be programmed, if inversion regions are allowed to be formed in the semiconductor layer, or if the semiconductor layer is allowed to electrically float, electrical interaction exists between the access devices and the memory devices to inhibit programming of the memory devices.

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