Abstract:
A memory circuit having dual-gate memory cells and a method for fabricating such a memory circuit are disclosed. The dual-gate memory cells each include a memory device and an access device sharing a semiconductor layer, with their respective channel regions provided on different surfaces of the semiconductor layer. The semiconductor layer has a thickness such that a sensitivity parameter relating an electrical interaction between the gate electrodes of the access device and the memory device is less than a predetermined value. The dual-gate memory cells can be used as building blocks for a non-volatile memory array, such as a memory array formed by NAND-strings. In such an array, during programming of a nearby memory device in a NAND string, in NAND-strings not to be programmed, if inversion regions are allowed to be formed in the semiconductor layer, or if the semiconductor layer is allowed to electrically float, electrical interaction exists between the access devices and the memory devices to inhibit programming of the memory devices.
Abstract:
An exemplary NAND string memory array (300) provides for capacitive boosting of a half-selected memory cell channel to reduce program disturb effects of the half selected cell. To reduce the effect of leakage current degradation of the boosted level, multiple series select devices at one or both ends of each NAND string reduce leakage through such select devices, for both unselected and selected NAND strings. An exemplary memory array may include series-connected NAND strings of memory cell transistors having a charge storage dielectric, and includes more than one plane of memory cells (400) formed above a substrate.
Abstract:
An exemplary NAND string memory array provides for capacitive boosting of a half-selected memory cell channel to reduce program disturb effects of the half selected cell. To reduce the effect of leakage current degradation of the boosted level, multiple series select devices at one or both ends of each NAND string reduce leakage through such select devices, for both unselected and selected NAND strings. An exemplary memory array may include series-connected NAND strings of memory cell transistors having a charge storage dielectric, and includes more than one plane of memory cells formed above a substrate.
Abstract:
A nonvolatile memory array is provided. The array includes an array of nonvolatile memory devices, at least one driver circuit (2), and a substrate (3). The at least one driver circuit (2) is not located in a bulk monocrystalline silicon substrate (7). The at least one driver circuit may be located in a silicon on insulator substrate (3) or in a compound substrate.
Abstract:
A scalable semiconductor device is formed using control gates formed on opposite sides of a semiconductor layer. A first control gate is formed electrically isolated from a first surface of the semiconductor layer by a first dielectric layer, such that, when a first voltage is applied on the first control gate, a first depletion region is formed in the semiconductor layer opposite the first control gate. A second control gate and a third control gate are also formed, each isolated from the semiconductor region by a second dielectric layer formed on a second surface of the semiconductor layer opposite the first surface. The second and the third control gates are offset from the first control gate such that, when a second voltage is applied to the second and third control gates, depletion regions are formed opposite the second and third control gates, respectively, such that each of the depletion regions opposite the second and third control gates overlaps the first depletion region to serve as source and drain regions, when filled with mobile carriers, of a field-effect transistor to the first depletion region, which serves as a channel region of the field-effect transistor.
Abstract:
A memory circuit and a method is provided for programming a dual-gate memory cell without program disturb in other dual-gate memory cells in the memory circuit coupled by common word lines (see FIG 3) In one embodiment, the method uses a self-boosting technique on unselected memory cells having source and drain regions in the shared semiconductor layer between their memory devic and their access devices brought to a predetermined voltage close to the threshold voltage of their access devices, thereby rendering th source and drain regions substantially floating In some embodiments, the source and drain regions are brought to the predetermined voltage via one or more select gates and intervening access gates In some embodiments, the select gates are overdriven (see FIGs 7- 12).
Abstract:
A memory circuit having dual-gate memory cells and a method for fabricating such a memory circuit are disclosed. The dual-gate memory cells each include a memory device and an access device sharing a semiconductor layer, with their respective channel regions provided on different surfaces of the semiconductor layer. The semiconductor layer has a thickness, such that when a pass voltage is applied to the gate electrode of the access device, the access device and the memory device remains isolated, such that the charge stored in the memory device is unaffected by the pass voltage. The pass voltage is determined from a range of voltages, when applied to the access device, has no effect on the threshold voltage of the memory device. The dual-gate memory cells can be used as building blocks for a non-volatile memory array, such as a memory array formed by NAND-strings. In such an array, during programming of a nearby memory device in a NAND string, in NAND-strings not to be programmed, if inversion regions are allowed to be formed in the semiconductor layer, or if the semiconductor layer is allowed to electrically float, electrical interaction exists between the access devices and the memory devices to inhibit programming of the memory devices.
Abstract:
An exemplary NAND string memory array provides for capacitive boosting of a half-selected memory cell channel to reduce program disturb effects of the half selected cell. To reduce the effect of leakage current degradation of the boosted level, multiple programming pulses of a shorter duration are employed to limit the time period during which such leakage currents may degrade the voltage within the unselected NAND strings. In addition, multiple series select devices at one or both ends of each NAND string further ensure reduced leakage through such select devices, for both unselected and selected NAND strings.
Abstract:
An exemplary NAND string memory array provides for capacitive boosting of a half-selected memory cell channel to reduce program disturb effects of the half selected cell. To reduce the effect of leakage current degradation of the boosted level, multiple programming pulses of a shorter duration are employed to limit the time period during which such leakage currents may degrade the voltage within the unselected NAND strings. In addition, multiple series select devices at one or both ends of each NAND string further ensure reduced leakage through such select devices, for both unselected and selected NAND strings.
Abstract:
There is provided a monolithic three dimensional array of charge storage devices which includes a plurality of device levels, wherein at least one surface between two successive device levels is planarized by chemical mechanical polishing.