Abstract:
Disclosed is a method for joining a device (1) to an object (2) with the aid of a combination of ultrasonic vibration energy and induction heating, wherein the device (1) comprises a portion (1.1) of a thermoplastic polymer and a susceptor additive wherein this portion (1.1) is at least partly liquefied or plasticized through the ultrasonic vibration energy in combination with the induction heating and wherein the joining comprises establishing a connection between the device (1) and the object (2) which connection is at least one of a positive fit connection, a weld, a press fit connection, and an adhesive connection. Therein the induction heating on the one hand is applied for rendering the named device portion (1.1) suitable for absorption of ultrasonic vibration energy or better suitable for such absorption than other device portions by raising its temperature, in particular by raising its temperature above the glass transition temperature of the polymer. The ultrasonic vibration energy on the other hand is used for liquefying or at least plasticizing the thermoplastic polymer of the named device portion (1.1).
Abstract:
Die vorliegende Erfindung offenbart eine Vorrichtung zur Erzeugung einer Verstärkungsstruktur (20), die ein faserverstärktes und thermoplastischen Kunststoff umfassendes Band (30) umfasst, auf einer Formkörperoberfläche (11). Die Vorrichtung ist dadurch gekennzeichnet, dass diese dazu ausgebildet ist, dass das Laserdioden-Array (110, 120) die Aufheizfläche (32) des Bandes (30) und/oder die Aufheizfläche (12) der Formkörperoberfläche (11) oder der bereits gebildeten Verstärkungsstruktur (20) direkt bestrahlt, wobei die Laserdioden (111) des Laserdioden-Arrays (110, 120) als Oberflächenemitter (111) ausgebildet sind.
Abstract:
Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plasticizer.
Abstract:
A laser welding system (10) includes a free-spacing beam delivery laser head (12) having a linear array of laser diodes (14) , each laser diodes (14) generating a laser beam (16) adapted to weld a workpiece (18) having a first component (20) and at least one other component (22) to be welded to component (20). The component (20) is substantially transmissive to the laser beam wavelength, and the component (22) is substantially absorptive of the laser beam wavelength. A lens (17) is spaced from the linear array of laser diodes (14) , and is adapted to direct laser beams (19) to at least one other lens (24) spaced from the lens (17) , the lens (24) adapted to shape laser beams (19) to a predetermined width and length, the lens (24) further adapted to focus laser beams (19) to substantially the same location, thereby forming a continuous line of laser energy (15) being in a plane containing the workpiece (18), the line (15) being substantially orthogonal to a direction (W) of translation of the workpiece (18).
Abstract:
A process for welding thermoplastic resin moldings which comprises bringing a thermoplastic resin molding A3 into contact with a thermoplastic resin molding B4, and irradiating the resulting moldings with infrared rays from the molding A3 side while controlling the temperature Ti of the contact surface between the moldings A3 and B4 and the irradiation-side surface temperature Ts of the molding A3 in such a way as to satisfy the following relationships i and ii: Ts Tm ii [wherein Tm is the lowest softening temperature among those of the resins forming the moldings A3 and B4 and Tma is the softening temperature of the resin forming the molding A3]. According to the invention, welded moldings are provided which exhibit high strength in the weld and have excellent surface profile free from thermal damage.
Abstract translation:一种用于焊接热塑性树脂模制品的方法,其包括使热塑性树脂模制品A3与热塑性树脂模制件B4接触,并且在模制品A3的接触表面的温度Ti的控制下,从模制品A3侧照射所得模制品 和B4以及模制品A3的照射侧表面温度Ts以满足以下关系式i和ii的方式:Ts Tm ii [其中Tm是形成树脂的树脂中的最低软化温度 模制品A3和B4以及Tma是形成模制品A3的树脂的软化温度]。 根据本发明,提供了在焊接中表现出高强度并且具有优异的没有热损伤的表面轮廓的焊接模制件。
Abstract:
There is described an induction sealing device (15) for heat sealing packaging material for producing sealed packages of pourable food products and fed in a first direction (A). The sealing device (15) has induction means (20, 21) interacting with the packaging material by means of a pair of first active surfaces (26) and a pair of second active surfaces (25) interposed between the first active surfaces (26) in the first direction (A) ; and the second active surfaces (25) have, in the first direction (A), a width (L1) greater than the width (L2) of the first active surfaces (26) at least along most of the length of the first and second active surfaces (26, 25) in a second direction (B) perpendicular to the first direction (A).
Abstract:
Verfahren zum Verbinden zweier Fügeelemente (1,2), wobei diese mittels eines thermischen aktivierbaren Klebstoffes (3) und eines darin angeordneten flächigen Heizelementes (5) durch geeignetes Erwärmen des Klebstoffes verbunden werden, das Verfahren umfassend den schritt: Erwärmen des Klebstoffes durch Beaufschlagung des Heizelementes mit elektrischer Leistung unter gleichzeitiger Messung der Temperatur des Klebstoffes, wobei der Umfang der Beaufschlagung des Heizelementes mit elektrischer Leistung abhängig von der gemessenen Temperatur gesteuert wird wobei die Messung der Temperatur des Klebstoffes durch Bestimmung des Widerstandes des Heizelementes erfolgt. Die Beschreibung betrifft auch einen derart hergestellten Verbund aus zwei Fügeelementen sowie eine Anordnung, eingerichtet zur Durchführung eines entsprechenden Verfahrens.
Abstract:
전도성 고분자 복합체를 발열체로 하는 합성수지관 전기융착 이음관의 전력 제어 장치 및 그 방법이 개시된다. 전력제어장치는 전도성 고분자 복합체를 발열체로 사용하는 합성수지관 전기융착 이음관에 전력을 공급하여 전도성 고분자 복합체의 저항 크기 변화를 감지한 후 저항 크기 변화를 기초로 합성수지관 전기융착 이음관에 공급하는 전력을 제어한다.