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    WIRING MEMBER AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    WIRING MEMBER AND MANUFACTURING METHOD THEREOF 审中-公开
    接线构件及其制造方法

    公开(公告)号：WO2015123864A1

    公开(公告)日：2015-08-27

    申请号：PCT/CN2014/072382

    申请日：2014-02-21

    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

    Inventor： YAMAZAKI, Nobuyuki ,  KOINUMA, Takayoshi

    IPC: H01B11/20 ,  H01R9/05 ,  H01R12/59 ,  H01B7/08 ,  H01R43/02

    CPC classification number: H01R4/023 ,  H01R9/0515 ,  H01R12/598 ,  H01R43/0256 ,  H01R43/28 ,  H05K1/117 ,  H05K3/281 ,  H05K3/305 ,  H05K3/3405 ,  H05K2201/09409 ,  H05K2201/10356 ,  Y02P70/613

    Abstract: A high-quality wiring member in which center conductors (31) are positioned accurately with respect to respective terminal members (22) of a board (20) and connected to them reliably, and a manufacturing method thereof. In an end portion of each of coaxial cables (30) connected to a connection board (20), an outer conductor (33), an inner insulator (32), and a center conductor (31) are exposed in sequence. The connection board (20) has signal terminal members (22) to which the center conductors (31) of the coaxial cables (30) are soldered, respectively, and a pad portion (25) to which the outer conductors (33) of the coaxial cables (30) are connected electrically. Exposed portions of the center conductors (31) are bent to the same side as a whole in the arrangement direction of the coaxial cables (30).

    Abstract translation: 一种高质量的布线构件，其中心导体（31）相对于板（20）的各个端子构件（22）准确地定位并可靠地与其连接，以及其制造方法。 在连接到连接板（20）的每个同轴电缆（30）的端部中，外部导体（33），内部绝缘体（32）和中心导体（31）依次露出。 连接板（20）具有分别焊接同轴电缆（30）的中心导体（31）的信号端子部件（22），以及焊接部分（25），其中，外部导体 同轴电缆（30）电连接。 中心导体（31）的露出部分沿同轴电缆（30）的布置方向整体弯曲到同一侧。

    WIRING MEMBER AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    WIRING MEMBER AND MANUFACTURING METHOD THEREOF 审中-公开
    接线构件及其制造方法

    公开(公告)号：WO2015123863A1

    公开(公告)日：2015-08-27

    申请号：PCT/CN2014/072381

    申请日：2014-02-21

    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

    Inventor： YAMAZAKI, Nobuyuki ,  SEMBA, Hiroyuki ,  KOINUMA, Takayoshi

    IPC: H01R9/05 ,  H01B11/20

    CPC classification number: H01R43/28 ,  B23K1/0016 ,  B23K2201/38 ,  H01R4/023 ,  H01R9/0515 ,  H01R12/598 ,  H01R43/0256 ,  H05K1/117 ,  H05K3/281 ,  H05K3/305 ,  H05K3/3405 ,  H05K3/3463 ,  H05K2201/09409 ,  H05K2201/10356 ,  Y02P70/613

    Abstract: A wiring member and a manufacturing method thereof which enable cost reduction while preventing pitch deviation of coaxial cables (30) and damaging of inner insulators (32). In an end portion of each of coaxial cables (30) connected to a connection board (20), an outer conductor (33), an inner insulator (32), and a center conductor (31) are exposed in sequence. The connection board (20) has signal terminal members (22) to which the center conductors (31) of the coaxial cables (30) are soldered, respectively, and a pad portion (25) to which the outer conductors (33) of the coaxial cables (30) are soldered directly with low-melting-temperature solder (62).

    Abstract translation: 一种布线构件及其制造方法，其能够在防止同轴电缆（30）的间距偏移和内绝缘体（32）的损坏的同时降低成本。 在连接到连接板（20）的每个同轴电缆（30）的端部中，外部导体（33），内部绝缘体（32）和中心导体（31）依次露出。 连接板（20）具有分别焊接同轴电缆（30）的中心导体（31）的信号端子部件（22）和焊接部分（25），其中，外部导体 同轴电缆（30）直接焊接低熔点焊料（62）。

    BOTTOM OR TOP JUMPERED FOLDABLE ELECTRONIC ASSEMBLY, AND METHOD FOR MANUFACTURE
    7.
    发明申请
    BOTTOM OR TOP JUMPERED FOLDABLE ELECTRONIC ASSEMBLY, AND METHOD FOR MANUFACTURE 审中-公开
    底部或顶部可折叠电子组件及其制造方法

    公开(公告)号：WO01017324A1

    公开(公告)日：2001-03-08

    申请号：PCT/US1999/020088

    申请日：1999-09-02

    IPC: H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

    CPC classification number: H05K1/148 ,  H05K1/117 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09409

    Abstract: An electronic assembly is made up of a number of rigid circuit boards manufactured on the same or different substrates or panels and with the same materials separated from each other electrically and physically. One of the rigid circuit boards has a comb (7) of printed tabs, or fingers, at the edge, which connects the assembly physically and electrically to a motherboard. Flexible wire jumpers (5) bridge the comb to form electrical connections between the boards. Both boards have printed circuit tabs placed in alignment to each other on both boards across a gap (21) which separates both boards. These tabs facilitate electronic interconnection of both boards via the flexible jumpers, which are groups or clusters of wires (4) separated from each other via a flexible insulator. A method for manufacturing the assembly is also disclosed, in which two boards (1, 2) are created by cutting gaps (21) from a substrate, leaving the two boards separated by a gap and connected by snap-offs (6). Once all the intended electronic components (9) and the flexible jumpers are soldered onto the boards, the boards are rotated, snapping them apart. After a desirable spacing between components of both boards is achieved, both boards are pinned together to maintain achieved proximity.

    Abstract translation: 电子组件由在相同或不同的基板或面板上制造的多个刚性电路板组成，并且具有彼此在电和物理上彼此分开的相同材料。 刚性电路板之一具有在边缘处的印刷突片或指状物的梳子（7），其将组件物理和电连接到母板。 柔性跳线（5）桥接梳子以形成电路板之间的电气连接。 两个板都有印刷电路板，它们跨越两个板对齐，跨越隔开两个板的间隙（21）。 这些标签有助于通过柔性跳线来实现两个电路板的电子互连，这些跳线是通过柔性绝缘体彼此分离的组或电线簇（4）。 还公开了一种用于制造组件的方法，其中通过从衬底切割间隙（21）来产生两个板（1,2），留下两个板由间隙分开并通过剔除（6）连接。 一旦将所有预期的电子部件（9）和柔性跳线焊接到电路板上，则电路板旋转，将它们分开。 在实现两个板的组件之间的期望的间隔之后，两个板被钉扎在一起以保持实现接近。

    IC DIE, PROBE AND ULTRASOUND SYSTEM
    10.
    发明申请
    IC DIE, PROBE AND ULTRASOUND SYSTEM 审中-公开
    IC DIE，探头和超声系统

    公开(公告)号：WO2017036827A1

    公开(公告)日：2017-03-09

    申请号：PCT/EP2016/069752

    申请日：2016-08-19

    Applicant: KONINKLIJKE PHILIPS N.V.

    Inventor： SUDOL, Wojtek

    IPC: B06B1/02 ,  A61B8/12 ,  B81C1/00

    CPC classification number: B06B1/02 ,  A61B8/12 ,  A61B8/4483 ,  B06B1/0292 ,  B81C1/00 ,  H01L24/46 ,  H01L2924/00014 ,  H01R9/0515 ,  H01R12/62 ,  H01R43/205 ,  H05K3/3421 ,  H05K2201/09409 ,  H05K2201/10356 ,  Y02P70/613 ,  H01L2224/45099

    Abstract: An integrated circuit die (1) is disclosed that comprises a substrate (30) defining a plurality of circuit elements; a sensor region (10) on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells (11); and an interposer region (60) on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts (61) for contacting the integrated circuit die to a connection cable (410) and mounting pads (65) for mounting a passive component (320) on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

    Abstract translation: 公开了一种集成电路管芯（1），其包括限定多个电路元件的衬底（30）; 传感器区域（10），所述传感器区域包括限定多个CMUT（电容微机械加工的超声换能器）单元（11）的层堆叠; 以及在所述基板上与所述传感器区域相邻的插入器区域（60）。 插入器区域包括另外的层堆叠，其包括与电路元件和CMUT单元的导电连接，导电连接件连接到插入件区域的上表面上的多个导电接触区域，导电接触区域包括外部触点（61） 用于将集成电路管芯接触到用于将无源部件（320）安装在上表面上的连接电缆（410）和安装焊盘（65）。 还公开了一种包括这种集成电路的探针对包含这种探针的超声系统进行裸片化。

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