公开(公告)号：EP3045508A1

公开(公告)日：2016-07-20

申请号：EP14844800.4

申请日：2014-09-09

申请人： Dexerials Corporation

发明人： AOKI Masaharu ,  KANISAWA Shiyuki ,  NAMIKI Hidetsugu ,  KOYAMA Taichi ,  ISHIGAMI Akira

IPC分类号： C09J163/00 ,  C09J7/00 ,  C09J11/04 ,  C09J133/00 ,  H01B1/20 ,  H01R11/01

CPC分类号： C09J133/20 ,  C08F220/18 ,  C08L33/066 ,  C08L33/068 ,  C08L2205/22 ,  C09J9/02 ,  C09J133/066 ,  C09J163/00 ,  H01B1/22 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/81424 ,  H01L2224/81487 ,  H01L2224/81903 ,  H01L2224/83424 ,  H01L2224/83487 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/01006 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  C08F2220/1825 ,  C08F2220/1808 ,  C08F220/44 ,  C08F220/06 ,  C08F220/20 ,  C08K5/151

摘要： This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.

公开(公告)号：EP3057123A4

公开(公告)日：2017-09-13

申请号：EP14851457

申请日：2014-10-03

申请人： FURUKAWA ELECTRIC CO LTD

发明人： KOJIMA NAOYUKI ,  HIKASA KAZUHITO ,  SATO SHUNICHIRO ,  FUJIWARA HIDEMICHI ,  WATANABE MASATO

IPC分类号： H01L23/488 ,  B22F7/04 ,  H01L21/48 ,  H01L21/58 ,  H01L23/373 ,  H01L23/495

CPC分类号： H01L24/83 ,  B22F7/004 ,  H01L21/4846 ,  H01L21/4871 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29387 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75986 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2924/0544 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0541 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/05432 ,  H01L2924/054 ,  H01L2924/01028 ,  H01L2924/01069 ,  H01L2924/0105 ,  H01L2924/053 ,  H01L2924/01051 ,  H01L2924/01046 ,  H01L2924/01022 ,  H01L2924/00012

公开(公告)号：EP2957366A1

公开(公告)日：2015-12-23

申请号：EP14172993.9

申请日：2014-06-18

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Schäfer, Michael ,  Schmitt, Wolfgang ,  Heilmann, Albert ,  Nachreiner, Jens

IPC分类号： B22F1/00 ,  B23K35/34 ,  B23K35/36 ,  B23K35/365 ,  B23K35/02 ,  H01L23/00

CPC分类号： B22F1/0062 ,  B22F7/064 ,  B22F2001/0066 ,  B23K35/025 ,  B23K35/34 ,  B23K35/3602 ,  B23K35/3618 ,  B23K35/365 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27422 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83211 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83464 ,  H01L2224/83469 ,  H01L2224/8384 ,  H01L2924/0541 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01108 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0549 ,  H01L2924/0544 ,  H01L2924/01006 ,  H01L2924/00012

摘要： Metallpaste, die (A) 75 bis 90 Gew.-% wenigstens eines Metalls, das in Form von Partikeln vorliegt, die ein Coating aufweisen, das wenigstens eine organische Verbindung enthält, und (B) 6 bis 20 Gew.-% organisches Lösemittel umfasst, dadurch gekennzeichnet, dass die Metallpaste ferner (C) 2 bis 10 Gew.-% mindestens eines Ammoniumtetrafluoroborats der Formel (NHR1R2R3) + (BF 4 ) - umfasst, wobei die Reste R1, R2 und R3 gleiche oder verschiedene Reste ausgewählt aus H und Kohlenwasserstoffresten mit jeweils ≤ 12 C-Atomen bedeuten.

摘要翻译： 金属浆料（A）75〜90重量％的至少一种金属存在于具有含有至少一种有机化合物，和（B）的涂层的颗粒的形式的6％至20重量有机溶剂的％ 其特征在于，所述金属糊料还包含（C）2〜10重量式中的至少一个Ammoniumtetrafluoroborats的％（NHR1R2R3）+（BF 4） - ，其中基团R1，R2和R3是选自H相同或不同的基团和 烃基各自具有‰¤平均12个碳原子。

公开(公告)号：EP3051580A4

公开(公告)日：2017-07-05

申请号：EP14848144

申请日：2014-09-10

申请人： DEXERIALS CORP

发明人： MORIYAMA HIRONOBU

IPC分类号： H01L21/60 ,  C08G59/18 ,  C08G59/24 ,  C08G59/42 ,  C08G59/68 ,  C08L63/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08G59/18 ,  C08G59/24 ,  C08G59/4207 ,  C08G59/686 ,  C08K5/14 ,  C08L33/10 ,  C08L63/00 ,  H01L21/563 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/75702 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/9205 ,  H01L2224/921 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/186 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/05442 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/05341 ,  H01L2924/0102 ,  H01L2924/0544 ,  H01L2924/01006 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/78 ,  H01L2924/00

摘要： An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240°C calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.

摘要翻译： 提供了能够无空隙封装和优异的焊料结合性能的底部填充材料，以及使用该底部填充材料制造半导体器件的方法。 使用含有环氧树脂和固化剂的底部填充材料，使用差示扫描量热计通过Ozawa法计算出的在240℃下的反应速度达到20％的时间为2.0秒以下，反应时间 达到60％的速率是3.0秒或更多。 这使得无空间封装和优异的焊接连接性能成为可能

公开(公告)号：EP3057123A1

公开(公告)日：2016-08-17

申请号：EP14851457.3

申请日：2014-10-03

申请人： Furukawa Electric Co., Ltd.

发明人： KOJIMA Naoyuki ,  HIKASA Kazuhito ,  SATO Shunichiro ,  FUJIWARA Hidemichi ,  WATANABE Masato

IPC分类号： H01L21/603 ,  B22F7/00 ,  B22F7/04 ,  H01L21/52

CPC分类号： H01L24/83 ,  B22F7/004 ,  H01L21/4846 ,  H01L21/4871 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29387 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75986 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2924/0544 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0541 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/05432 ,  H01L2924/054 ,  H01L2924/01028 ,  H01L2924/01069 ,  H01L2924/0105 ,  H01L2924/053 ,  H01L2924/01051 ,  H01L2924/01046 ,  H01L2924/01022 ,  H01L2924/00012

摘要： Provided is a joining structure that prevents occurrence of a crack at a joining portion between a metal member and a metal porous body, and can achieve a highly reliable joining. The joining structure of the present invention has a metal member 1 and a metal porous body 2 formed on the metal member 1. The metal member 1 includes an outer layer 1b and an inner layer 1c, the outer layer 1b including one of main surfaces 1a and being formed on the metal porous body 2 side, the inner layer 1c being formed at a position farther from the metal porous body 2 than the outer layer 1b in a thickness direction, the outer layer 1b has an average crystal grain size ds that is smaller than an average crystal grain size di of the inner layer 1c, and the metal porous body 2 has an average crystal grain size dp that is smaller than or equal to the average crystal grain size ds of the outer layer 1b.

摘要翻译： 提供一种防止在金属构件和金属多孔体之间的接合部发生裂纹的接合结构，并且可以实现高可靠性的接合。 本发明的接合结构具有形成在金属构件1上的金属构件1和金属多孔体2.金属构件1包括外层1b和内层1c，外层1b包括主表面1a 并且形成在金属多孔体2侧，内层1c形成在厚度方向上比外层1b更远离金属多孔体2的位置，外层1b的平均晶粒尺寸ds为 小于内层1c的平均晶粒尺寸di，并且金属多孔体2的平均晶粒尺寸dp小于或等于外层1b的平均晶粒尺寸ds。

公开(公告)号：EP3052566A1

公开(公告)日：2016-08-10

申请号：EP14847431.5

申请日：2014-09-29

申请人： Henkel IP & Holding GmbH

发明人： ZHU, Pukun ,  HOANG, Gina V. ,  GUPTA, Shashi K. ,  LAIB, Andrew

IPC分类号： C08L63/10 ,  C09J163/10 ,  H01B1/24 ,  B82Y30/00

CPC分类号： H01L24/32 ,  C08G59/34 ,  C08K3/08 ,  C08K3/10 ,  C08K2003/0806 ,  C08K2201/001 ,  C08L63/00 ,  C08L63/10 ,  C08L79/08 ,  C08L79/085 ,  C08L2205/02 ,  C09J163/10 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/2741 ,  H01L2224/27848 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83464 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2924/01051 ,  H01L2924/0132 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0645 ,  H01L2924/0665 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/20103 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/2064 ,  H01L2924/3511 ,  H01L2924/07 ,  H01L2924/095 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/00012

摘要： Provided herein are conductive die attach films having advantageous properties for use in a variety of applications, e.g., for the preparation of large die semiconductor packages. Also provided are formulations useful for the preparation of such films, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In additional aspects, the invention further relates to articles comprising such conductive die attach films adhered to a suitable substrate therefor.

公开(公告)号：EP3051580A1

公开(公告)日：2016-08-03

申请号：EP14848144.3

申请日：2014-09-10

申请人： Dexerials Corporation

发明人： MORIYAMA, Hironobu

IPC分类号： H01L21/60 ,  C08G59/18

CPC分类号： H01L23/293 ,  C08G59/18 ,  C08G59/24 ,  C08G59/4207 ,  C08G59/686 ,  C08K5/14 ,  C08L33/10 ,  C08L63/00 ,  H01L21/563 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/75702 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/9205 ,  H01L2224/921 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/186 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/05442 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/05341 ,  H01L2924/0102 ,  H01L2924/0544 ,  H01L2924/01006 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/78 ,  H01L2924/00

摘要： An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240°C calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.

摘要翻译： 本发明提供一种底部填充材料能够无空隙包装和优良的焊料的粘结性能，以及制造使用其的半导体器件的方法。 用于底部填充材料上的环氧树脂和固化剂，其包含，和用于反应速率的时间以在240℃通过使用差示扫描量热Ozawa法计算达到20％是2.0秒或更小，用于反应的时间 率达到60％是3.0秒以上。 这使得能够无空隙包装和优良的焊料连接属性。

公开(公告)号：EP3166999A4

公开(公告)日：2018-03-07

申请号：EP14897036

申请日：2014-07-07

申请人： HONEYWELL INT INC

发明人： LIU YA QUN ,  ZENG LIANG ,  WANG HUI ,  ZHANG BRIGHT ,  HUANG HONG MIN

IPC分类号： C09K5/14 ,  B32B27/18 ,  C08K3/22 ,  C08K5/25 ,  C08K5/29

CPC分类号： C09K5/14 ,  C08K13/02 ,  C08K2201/001 ,  C08L23/0815 ,  C08L2201/08 ,  C08L2203/20 ,  C09K5/063 ,  C09K15/06 ,  C09K15/22 ,  C09K15/24 ,  C09K15/30 ,  G06F1/20 ,  H01L23/3675 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2924/0002 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/0544 ,  H01L2924/12041 ,  H01L2924/1432 ,  H05K7/2039 ,  H01L2924/00

摘要： A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

公开(公告)号：EP2822033B1

公开(公告)日：2017-11-29

申请号：EP14172469.0

申请日：2014-06-16

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Hamada, Yoshitaka

IPC分类号： H01L25/065 ,  H05K1/03 ,  H05K1/09 ,  H05K3/22 ,  H05K3/36 ,  H01L23/00 ,  H01L25/00

CPC分类号： H05K1/095 ,  H01L24/11 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L24/98 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/11848 ,  H01L2224/119 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13291 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13393 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/75251 ,  H01L2224/75272 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81862 ,  H01L2224/9212 ,  H01L2225/06513 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/225 ,  H05K3/368 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2924/053 ,  H01L2924/01051 ,  H01L2924/0549 ,  H01L2924/04642 ,  H01L2924/00012 ,  H01L2924/014

摘要： A conductive circuit is formed using a substantially solvent-free, liquid, addition curable, conductive circuit-forming ink composition comprising (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups, (B) an organohydrogenpolysiloxane having at least two SiH groups, (C) conductive particles, (D) a thixotropic agent, and (E) a hydrosilylation catalyst. The ink composition is printed on a metal electrode to form a green circuit pattern layer, which is fired and cured for thereby forming a conductive circuit and bonding the conductive circuit to the metal electrode.

公开(公告)号：EP3187299A1

公开(公告)日：2017-07-05

申请号：EP14900789.0

申请日：2014-08-29

申请人： Senju Metal Industry Co., Ltd

发明人： KAWASAKI Hiroyoshi ,  ROPPONGI Takahiro ,  SOMA Daisuke ,  SATO Isamu ,  KAWAMATA Yuji

IPC分类号： B23K35/26 ,  B22F1/00 ,  B22F1/02

CPC分类号： B23K35/0244 ,  B22F1/02 ,  B22F2999/00 ,  B23K35/26 ,  B23K35/262 ,  B23K35/365 ,  C22C13/00 ,  C23C8/10 ,  C23C8/36 ,  C23C28/04 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11318 ,  H01L2224/1182 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13561 ,  H01L2224/13687 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/0544 ,  C22C1/0483

摘要： Provided is a solder material which enables a growth of an oxide film to be inhibited. A solder ball 1A which is a solder material is composed of a solder layer 2 and a covering layer 3 covering the solder layer 2. The solder layer 2 is spherical and is composed of a metal material containing an alloy including Sn content of 40% and more. Otherwise the solder layer 2 is composed of a metal material including Sn content of 100%. In the covering layer 3, a S n O film 3a is formed outside the solder layer 2, and a S n O 2 film 3b is formed outside the S n O film 3a. A thickness of the covering layer 3 is preferably more than 0nm and equal to or less than 4.5nm. Additionally, a yellow chromaticity of the solder ball 1A is preferably equal to or less than 5.7.

摘要翻译： 提供一种能够抑制氧化膜生长的焊料。 作为焊接材料的焊球1A由焊料层2和覆盖焊料层2的覆盖层3构成。焊料层2是球形并且由含有40％的Sn含量的合金和 更多。 另外，焊料层2由包含100％的Sn含量的金属材料构成。 在覆盖层3中，在焊料层2的外侧形成SnO膜3a，在SnO膜3a的外侧形成SnO2膜3b。 覆盖层3的厚度优选大于0nm并且等于或小于4.5nm。 另外，焊球1A的黄色色度优选等于或小于5.7。