公开(公告)号：EP2614521B1

公开(公告)日：2018-01-24

申请号：EP11757730.4

申请日：2011-09-09

申请人： Advanced Micro Devices, Inc. ,  ATI Technologies ULC

发明人： SU, Michael, Z. ,  FU, Lei ,  REFAI-AHMED, Gamal ,  BLACK, Bryan

IPC分类号： H01L21/56 ,  H01L25/065

CPC分类号： H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/81

摘要： A method of manufacturing is provided that includes placing a removable cover on a surface of a substrate. The substrate includes a first semiconductor chip positioned on the surface. The first semiconductor chip includes a first sidewall. The removable cover includes a second sidewall positioned opposite the first sidewall. A first underfill is placed between the first semiconductor chip and the surface wherein the second sidewall provides a barrier to flow of the first underfill. Various apparatus are also disclosed.

公开(公告)号：EP2482311A3

公开(公告)日：2016-06-08

申请号：EP12150102.7

申请日：2012-01-03

申请人： Fujitsu Limited

发明人： Akamatsu, Toshiya

IPC分类号： H01L23/498 ,  H01L21/98 ,  H01L25/065 ,  H01L23/14 ,  H01L23/48 ,  H01L21/60

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11002 ,  H01L2224/1147 ,  H01L2224/13006 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13027 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16141 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/1624 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/83102 ,  H01L2224/9201 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15159 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10674 ,  H01L2224/13099 ,  H01L2224/11 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/48624 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor element (2) and an electronic element (3). The semiconductor element has a first protruding electrode (2a), and the electronic element has a second protruding electrode (3a). A substrate (4) is disposed between the semiconductor element (2) and the electronic element (3). The substrate has a through-hole (4a) in which the first and second protruding electrodes (2a, 3a) are fitted. The first and second protruding electrodes are connected together inside the through-hole (4a) of the substrate.

公开(公告)号：EP2975637A4

公开(公告)日：2016-04-06

申请号：EP13877939

申请日：2013-03-13

申请人： TOYOTA MOTOR CO LTD

发明人： ORIMOTO NORIMUNE ,  IMAI MAKOTO

IPC分类号： H01L23/13 ,  H01L21/52 ,  H01L21/58

CPC分类号： H01L23/3675 ,  H01L23/13 ,  H01L23/36 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/29036 ,  H01L2224/291 ,  H01L2224/32014 ,  H01L2224/32113 ,  H01L2224/32245 ,  H01L2224/83129 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83815 ,  H01L2924/10161 ,  H01L2924/10272 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15159 ,  H01L2924/15165 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00

公开(公告)号：EP2779226A1

公开(公告)日：2014-09-17

申请号：EP14158359.1

申请日：2014-03-07

申请人： Altera Corporation

发明人： Liu, Hui ,  Shi, Hong ,  Xie, Yuanlin ,  Jiang, Xiaohong

IPC分类号： H01L23/13 ,  H01L23/498 ,  H01L23/552

CPC分类号： H01L23/552 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45012 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45624 ,  H01L2224/45647 ,  H01L2224/45686 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73257 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/014 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An apparatus includes a substrate that includes electronic circuitry. The apparatus further includes a first die that includes electronic circuitry, and at least one shielded interconnect. The shielded interconnect(s) couple(s) electronic circuitry in the substrate to electronic circuitry in the first die.

摘要翻译： 一种装置包括衬底做了包括电子电路。 该装置包括第一此外，电子电路包括没有，和至少一个屏蔽互连。 所述屏蔽互连（多个）对（多个）电子电路基板向电子电路在所述第一的。

公开(公告)号：EP2614521A1

公开(公告)日：2013-07-17

申请号：EP11757730.4

申请日：2011-09-09

申请人： Advanced Micro Devices, Inc. ,  ATI Technologies ULC

发明人： SU, Michael, Z. ,  FU, Lei ,  REFAI-AHMED, Gamal ,  BLACK, Bryan

IPC分类号： H01L21/56

CPC分类号： H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/81

摘要： A method of manufacturing is provided that includes placing a removable cover on a surface of a substrate. The substrate includes a first semiconductor chip positioned on the surface. The first semiconductor chip includes a first sidewall. The removable cover includes a second sidewall positioned opposite the first sidewall. A first underfill is placed between the first semiconductor chip and the surface wherein the second sidewall provides a barrier to flow of the first underfill. Various apparatus are also disclosed.

摘要翻译： 提供了一种制造方法，其包括将可移除的盖放置在基板的表面上。 衬底包括位于表面上的第一半导体芯片。 第一半导体芯片包括第一侧壁。 可移除的盖包括与第一侧壁相对设置的第二侧壁。 第一底部填充物放置在第一半导体芯片和表面之间，其中第二侧壁为第一底部填充物的流动提供阻挡。 还公开了各种装置。

公开(公告)号：EP2482311A2

公开(公告)日：2012-08-01

申请号：EP12150102.7

申请日：2012-01-03

申请人： Fujitsu Limited

发明人： Akamatsu, Toshiya

IPC分类号： H01L23/498 ,  H01L21/98 ,  H01L25/065 ,  H01L23/14 ,  H01L23/48 ,  H01L21/60

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11002 ,  H01L2224/1147 ,  H01L2224/13006 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13027 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16141 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/1624 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/83102 ,  H01L2224/9201 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15159 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10674 ,  H01L2224/13099 ,  H01L2224/11 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/48624 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor element (2) and an electronic element (3). The semiconductor element has a first protruding electrode (2a), and the electronic element has a second protruding electrode (3a). A substrate (4) is disposed between the semiconductor element (2) and the electronic element (3). The substrate has a through-hole (4a) in which the first and second protruding electrodes (2a, 3a) are fitted. The first and second protruding electrodes are connected together inside the through-hole (4a) of the substrate.

摘要翻译： 一种半导体器件，包括：半导体元件（2）和电子元件（3）。 该半导体元件具有第一突出电极（2a）中，所述电子元件具有第二突出电极（3a）的。 A底（4）的半导体元件（2）和（3）电子元件之间设置。 基板具有其中第一和第二突出电极（2A，3A）嵌合的通孔（4a）中。 第一和第二突出电极连接在一起的内部通孔（4a）的基板。

公开(公告)号：EP2122681A1

公开(公告)日：2009-11-25

申请号：EP08712597.7

申请日：2008-02-08

申请人： Nederlandse Organisatie voor Toegepast- Natuurwetenschappelijk Onderzoek TNO

发明人： VENINGA, Erik, Peter

IPC分类号： H01L23/498 ,  H01L23/66 ,  H05K1/14 ,  H01L25/065 ,  H01L23/055

CPC分类号： H01L25/0657 ,  B81B7/007 ,  H01L23/055 ,  H01L23/10 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/0652 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/144 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： According to an aspect of the invention, there is provided an electrical package device comprising: a first substrate (2) and a second substrate (3) enclosing a first electric component (4), a second electric component (7) supported by said second substrate; a plurality of connectors (5) for mechanically connecting said first and second substrates in a stacked arrangement; and a seal (6) provided between said first and second substrates at a distance from said first electric component; wherein said first electric component is electrically connected to said second electric component by connecting circuitry comprising said connectors; and wherein said connectors are provided in said seal. Preferably, said seal comprises a no flow resin material.

公开(公告)号：EP1956652A1

公开(公告)日：2008-08-13

申请号：EP07102001.0

申请日：2007-02-08

申请人： Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO

发明人： Veninga, Erik Peter

IPC分类号： H01L23/498 ,  H01L23/66 ,  H05K1/14 ,  H01L25/10 ,  H01L23/055

CPC分类号： H01L25/0657 ,  B81B7/007 ,  H01L23/055 ,  H01L23/10 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/0652 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/144 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： According to an aspect of the invention, there is provided an electrical package device comprising: a first substrate (2) and a second substrate (3) enclosing a first electric component (4), a second electric component (7) supported by said second substrate; a plurality of connectors (5) for mechanically connecting said first and second substrates in a stacked arrangement; and a seal (6) provided between said first and second substrates at a distance from said first electric component; wherein said first electric component is electrically connected to said second electric component by connecting circuitry comprising said connectors; and wherein said connectors are provided in said seal. Preferably, said seal comprises a no flow resin material.

摘要翻译： 根据本发明的一个方面，提供了一种电气封装装置，包括：第一基板（2）和封闭第一电气部件（4）的第二基板（3），由所述第二电气部件支撑的第二电气部件 基质; 多个连接器（5），用于以叠置的方式机械地连接所述第一和第二基板; 以及设置在所述第一和第二基板之间距离所述第一电气部件一定距离的密封件（6） 其中所述第一电气部件通过包括所述连接器的连接电路电连接到所述第二电气部件; 并且其中所述连接器设置在所述密封件中。 优选地，所述密封件包括无流动树脂材料。

公开(公告)号：EP1793421A3

公开(公告)日：2007-08-01

申请号：EP06123023.1

申请日：1997-10-08

申请人： Hitachi Chemical Co., Ltd.

发明人： Yamamoto, Kazunori, ,  Shimada, Yasushi, ,  Kumashiro, Yasushi, c/o Hitachi Chemical Co.,Ltd.,Res. & Dev. Div. ,  Inada, Teiichi c/o Hitachi Chemical Co., Ltd.,Res. & Dev. Div. ,  Kuriya, Hiroyuki, ,  Kaneda, Aizou, ,  Tomiyama, Takeo, c/o Hitachi Chemical Co., Ltd., Res. & Dev. Div. ,  Nomura, Yoshihiro, ,  Hosokawa, Yoichi, ,  Kirihara, Hiroshi, ,  Kageyama, Akira,

IPC分类号： H01L23/12 ,  C09J163/00 ,  H01L21/58 ,  C09J133/00 ,  C09J7/02

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25°C of from 10 to 2,000 MPa and a storage elastic modulus at 260°C of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

公开(公告)号：EP1793421A2

公开(公告)日：2007-06-06

申请号：EP06123023.1

申请日：1997-10-08

申请人： Hitachi Chemical Co., Ltd.

发明人： Yamamoto, Kazunori, ,  Shimada, Yasushi, ,  Kumashiro, Yasushi, ,  Inada, Teiichi, ,  Kuriya, Hiroyuki, ,  Kaneda, Aizou, ,  Tomiyama, Takeo, ,  Nomura, Yoshihiro, ,  Hosokawa, Yoichi, ,  Kirihara, Hiroshi, ,  Kageyama, Akira,

IPC分类号： H01L23/12 ,  C09J163/00 ,  H01L21/58 ,  C09J133/00 ,  C09J7/02

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25°C of from 10 to 2,000 MPa and a storage elastic modulus at 260°C of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明的目的在于改善在耐温度循环中的半导体器件，从而在吸湿回流性的提高包装后，并提供了关于粘合剂具有在25℃下的储存弹性模量为10〜2000兆帕和存储的 为3〜50MPa的测得在260℃下的弹性模量与动态粘弹性测定，因此双面粘合片，半导体装置和半导体芯片的安装基板，这使得使用的粘合剂的，并且它们的生产工艺。