公开(公告)号：EP1911090A4

公开(公告)日：2009-07-22

申请号：EP06800678

申请日：2006-07-28

Applicant: FOSTER MILLER INC

Inventor： FARRELL BRIAN ,  GANNON JOHN J JR ,  CAMPBELL THOMAS G ,  COPPOLA PAT ANHTONY ,  O'REILLY SEAN GERALD ,  BURKE JOSEPH F

IPC: H01L23/02

CPC classification number: H01Q1/286 ,  B64D43/00 ,  H01Q21/065 ,  H05K1/00 ,  H05K1/038 ,  H05K1/147 ,  H05K3/0058 ,  H05K3/0064 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/4046 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10303

Abstract: A dual function composite system includes a first electronic subsystem, a second electronic subsystem, and a composite member between the first and second electronic subsystems. The composite member includes plies of fabric, and resin impregnating the plies of fabric. At least one ply of the fabric includes signal transmission elements integrated therewith and interconnecting the first electronic subsystem with the second electronic subsystem.

公开(公告)号：EP1707299A4

公开(公告)日：2009-03-18

申请号：EP05704160

申请日：2005-01-20

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KOSUDA YASUHITO ,  OKUDA YASUHIRO ,  MISHIMA HIDEHIKO

IPC: B23K26/38 ,  B01D71/36 ,  B23K26/06 ,  B23K26/40 ,  H05K1/03

CPC classification number: H05K3/0032 ,  B23K26/0624 ,  B23K26/382 ,  B23K2201/40 ,  B23K2203/42 ,  B23K2203/50 ,  H05K2201/0116 ,  H05K2201/015 ,  Y10T428/249955

Abstract: A stretched polytetrafluoroethylene porous article having fine pores formed therein, wherein fine pores having a pore diameter greater than the average pore diameter of said stretched polytetrafluoroethylene porous article are formed by the irradiation with a pulse laser beam having a pulse width of 10 picoseconds or less, and a fine porous structure of the wall surface of said fine pore is not broken and is substantially retained; a method for producing the stretched polytetrafluoroethylene porous article; and a method of ablation machining.

公开(公告)号：EP2026379A1

公开(公告)日：2009-02-18

申请号：EP07743957.8

申请日：2007-05-23

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： NOMIYA, Masato c/o Murata Manufacturing Co., Ltd ,  SAKAI, Norio c/o Murata Manufacturing Co., Ltd ,  NISHIDE, Mitsuyoshi c/o Murata Manufacturing Co., Ltd

IPC: H01L23/15 ,  H01L23/12

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/305 ,  H05K3/4626 ,  H05K3/4629 ,  H05K2201/0116 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A method for manufacturing a multilayer ceramic electronic device, wherein leakage of an underfill resin for fixing a surface mount electronic device does not occur and high-density, high-accuracy mounting of a device can be conducted, and a highly reliable multilayer ceramic electronic device, which is produced by the above-described manufacturing method and which has excellent impact resistance and excellent compatibility with miniaturization, are provided.
A resin introduction portion 11A located outside a vertically projected region R of a surface mount electronic device 13 is disposed on a seat portion 11 which contains a nonmetallic inorganic powder as a primary component and on which the surface mount electronic device, e.g., a semiconductor element, is mounted, and a resin 22 is supplied to the resin introduction portion so as to fill the resin into the seat portion and a gap between the seat portion and a multilayer ceramic element assembly 4.
Unsintered ceramic base material layers (first ceramic layers 1) and shrinkage restriction layers (second ceramic layers 2) for restricting shrinkage of the unsintered ceramic base material layers in a plane direction are laminated and, thereby, an unfired multilayer ceramic element assembly is formed, which does not shrink in a direction orthogonal to a lamination direction in a firing step.

公开(公告)号：EP1976007A2

公开(公告)日：2008-10-01

申请号：EP08005811.8

申请日：2008-03-27

Applicant: Fujifilm Corporation

Inventor： Hotta, Yoshinori ,  Touma, Takashi ,  Hatanaka, Yusuke

IPC: H01L23/532

CPC classification number: H01L23/49827 ,  G01R1/06755 ,  G01R1/07378 ,  H01L21/486 ,  H01L2924/0002 ,  H01L2924/3025 ,  H05K3/4038 ,  H05K2201/0116 ,  H05K2203/0315 ,  H01L2924/00

Abstract: An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mm 2 and the insulating base material is a structure composed of an anodized aluminum film having micropores therein.

Abstract translation: 各向异性导电构件具有绝缘基材，以及由导电材料构成的导电路径，该导电材料通过绝缘基材在其厚度方向上以相互绝缘的状态通过，并且以使得导电材料的第一端 路径暴露在绝缘基材的第一侧上，并且每个导电路径的第二端在绝缘基材的第二侧上露出。 导电路径具有至少200万路径/ mm 2的密度，绝缘基材是由其中具有微孔的阳极氧化铝膜构成的结构。

公开(公告)号：EP1910852A2

公开(公告)日：2008-04-16

申请号：EP06788901.4

申请日：2006-07-28

Applicant: FOSTER MILLER, INC.

Inventor： FARRELL, Brian ,  GANNON, John, J. ,  CAMPBELL, Thomas, G. ,  COPPOLA, Pat, Anthony ,  O'REILLY, Sean, Gerald ,  BURKE, Joseph, F.

IPC: G01R29/10

CPC classification number: H01Q1/286 ,  B64D43/00 ,  H01Q21/065 ,  H05K1/00 ,  H05K1/038 ,  H05K1/147 ,  H05K3/0058 ,  H05K3/0064 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/4046 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10303

Abstract: An electromechanical structure includes a core and a plurality of conductive pins through the core. The pins are configured to form a signal distribution network from a first side of the core to a second side of the core.

公开(公告)号：EP1053214B1

公开(公告)日：2008-03-05

申请号：EP99967873.3

申请日：1999-12-09

Applicant: ROBERT BOSCH GMBH

Inventor： SCHEYING, Gerd ,  KANTERS, Johannes ,  WUEHRL, Ingrid ,  EISELE, Ulrich ,  BOEDER, Horst ,  DORFMUELLER, Lutz ,  GRUENWALD, Werner

IPC: C04B35/634 ,  C04B35/486 ,  C08K3/22

CPC classification number: H05K1/0373 ,  C04B35/46 ,  C04B35/486 ,  C04B35/63404 ,  C08K3/34 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0209

Abstract: The invention relates to a polymer compound comprising a ceramic powder and a polymer, whereby the ceramic powder comprises a specific surface of greater than 1.8.108 m2/m3 and amounts to greater than 5 vol.-% of the polymer compound. The polymer is resistant to shearing force and the pore sizes in the polymer compound range from 3-15 nm. In addition, the invention relates to a method for producing this polymer compound, to the use thereof and to a sintered compact produced therefrom.

公开(公告)号：EP0805722B1

公开(公告)日：2007-10-24

申请号：EP95943952.2

申请日：1995-12-21

Applicant: Turbocombustor Technology, Inc.

Inventor： HINSON, David

IPC: B05D5/02 ,  C23F1/02

CPC classification number: H05K3/383 ,  C23F1/02 ,  C23F1/26 ,  H05K2201/0116 ,  H05K2201/0166 ,  H05K2201/0373 ,  H05K2203/0769

Abstract: A process for roughening a metal surface is provided comprising applying a coating to the metal surface wherein the coating is a temporary barrier to an etchant attacking the metal surface and the coating is susceptible to the etchant gradually removing the coating, and then etching the coated metal surface with an aqueous bath containing the etchant effective to produce a roughened metal surface.

公开(公告)号：EP1707315A4

公开(公告)日：2007-05-30

申请号：EP05703853

申请日：2005-01-13

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HAYASHI FUMIHIRO ,  MASUDA YASUHITO ,  OKUDA YASUHIRO

IPC: B24C1/04 ,  C23C18/22 ,  B24C3/32 ,  B24C11/00 ,  C23C18/16 ,  H05K1/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

CPC classification number: B24C3/322 ,  B24C1/04 ,  B24C11/00 ,  C23C18/1605 ,  C23C18/1644 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/182 ,  H05K3/184 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/025 ,  H05K2203/0565 ,  Y10T428/24479 ,  Y10T428/24496 ,  Y10T428/24612 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T442/674

Abstract: A production method for a porous molding in which complicated and fine penetrated portions and recesses are pattern-worked. A pattern-worked porous molding or non-woven fabric in which a plated layer is selectively formed on the surfaces of penetrated portions and recesses. A mask having pattern-form penetrated portions is disposed on at least one surface of a porous molding or non-woven fabric, and fluid or fluid containing abrasive grains is sprayed over the mask to form penetrated portions or recesses or the both of them, to which the opening shape of the mask’s penetrated portion is transferred, on the porous molding or non-woven fabric. A porous molding or non-woven fabric and an electric circuit components or the like in which a plated layer is selectively formed on the surfaces of penetrated portions or recesses or the both of them.

公开(公告)号：EP1749310A1

公开(公告)日：2007-02-07

申请号：EP05766585.3

申请日：2005-05-26

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： LE BLEVENNEC, Gilles ,  PRENE, Philippe

IPC: H01L21/20 ,  H01L29/786

CPC classification number: H01L21/02362 ,  H01L21/02126 ,  H01L21/02172 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02422 ,  H01L21/02488 ,  H01L21/02513 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/31695 ,  H01L21/76251 ,  H01L27/1214 ,  H01L27/1218 ,  H01L29/78603 ,  H01L51/0097 ,  H01L2251/5338 ,  H05K1/0393 ,  H05K1/053 ,  H05K2201/0116

Abstract: The invention relates to a substrate for electronic application, comprising a flexible support successively covered with a porous oxide layer and a layer of polycrystalline or amorphous silicon. The invention further relates to a method for production of such a substrate.

公开(公告)号：EP1707315A1

公开(公告)日：2006-10-04

申请号：EP05703853.1

申请日：2005-01-13

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： HAYASHI, Fumihiro Sumitomo Electric Industries Ltd ,  MASUDA, Yasuhito Sumitomo Electric Industries, Ltd ,  OKUDA, Yasuhiro Sumitomo Electric Industries, Ltd.

IPC: B24C1/04 ,  C23C18/16 ,  H05K3/10

CPC classification number: B24C3/322 ,  B24C1/04 ,  B24C11/00 ,  C23C18/1605 ,  C23C18/1644 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/182 ,  H05K3/184 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/025 ,  H05K2203/0565 ,  Y10T428/24479 ,  Y10T428/24496 ,  Y10T428/24612 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T442/674

Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions.
With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.

Abstract translation: 本发明的一个目的是提供一种用于通过部分，凹陷部分在哪个复杂和精细的制造多孔材料的方法，和类似物已被图案化。 它是提供一种图案化的多孔模制产品或无纺织物，其中，镀覆层已经穿过部分的表面和凹部上被选择性地形成。 通过本发明，通过在一图案部分具有掩模放置在该多孔模制产品的至少一个侧面或无纺布。 一种流体或一种流体包含磨粒从掩模上方喷射，从而形成贯通部或凹部，或它们两者中，向其中通过掩模的部分各自的开口形状已经被转移到多孔成型制品 或非织造织物。 本发明提供一种多孔模制产品或无纺织物，其中镀层已被选择性地形成贯通部的表面或凹部，或者两者的论文上，电路部件上，或诸如此类。