公开(公告)号：EP2752505A4

公开(公告)日：2015-07-01

申请号：EP12829006

申请日：2012-08-30

Applicant: JX NIPPON MINING & METALS CORP

Inventor： NAGAURA TOMOTA ,  SAKAGUCHI KAZUHIKO

IPC: C23C28/00 ,  B32B15/01 ,  C25D1/04 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/56 ,  C25D3/58 ,  C25D5/14 ,  C25D7/06 ,  C25D9/08 ,  C25D11/38 ,  H05K1/09 ,  H05K3/02

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 µg/dm 2 of Ni and said Cr layer containing 10-100 µg/dm 2 of Cr is provided.

公开(公告)号：EP2811512A1

公开(公告)日：2014-12-10

申请号：EP12864126.3

申请日：2012-12-10

Applicant: Kyocera Corporation

Inventor： NIINO,Noritaka

IPC: H01L23/13 ,  H01L23/12 ,  H05K1/02

CPC classification number: H01L23/3735 ,  C04B35/645 ,  C04B37/026 ,  C04B2235/6567 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/407 ,  C04B2237/59 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0306 ,  H05K3/388 ,  H05K2201/0338 ,  H01L2924/00 ,  H01L2924/00014

Abstract: [Object] To provide a circuit board which has good long-term reliability.
[Solution] A circuit board of the present invention includes a ceramic board and a metal plate on the ceramic board via a metal layer. The metal layer includes a first metal portion which is in contact with the ceramic board, a second metal portion which is in contact with the metal plate, and a third metal portion between the first metal portion and the second metal portion. A part of the first metal portion extends toward a direction of the second metal portion such that the part of the first metal portion penetrates the third metal portion, and spreads out in a lateral direction along the second metal portion.

Abstract translation: 本发明的目的是提供一种具有良好的长期可靠性的电路板。 解决方案本发明的电路板通过金属层在陶瓷板上包括陶瓷板和金属板。 金属层包括与陶瓷板接触的第一金属部分，与金属板接触的第二金属部分以及在第一金属部分和第二金属部分之间的第三金属部分。 第一金属部分的一部分朝向第二金属部分的方向延伸，使得第一金属部分的一部分穿过第三金属部分，并且沿第二金属部分在横向方向上展开。

公开(公告)号：EP2752505A1

公开(公告)日：2014-07-09

申请号：EP12829006.1

申请日：2012-08-30

Applicant: JX Nippon Mining & Metals Corporation

Inventor： NAGAURA,Tomota ,  SAKAGUCHI,Kazuhiko

IPC: C23C28/00 ,  B32B15/01 ,  C25D7/06

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 µg/dm 2 of Ni and said Cr layer containing 10-100 µg/dm 2 of Cr is provided.

Abstract translation: 本发明提供了一种载体附着的铜箔，其中在层叠到绝缘基板之前，超薄铜箔不从载体剥离，而是可以在层压到绝缘基板之后从载体上剥离。 一种载体附着铜箔，其包含铜箔载体，层叠在所述铜箔载体上的中间层和层叠在所述中间层上的超薄铜层，其中所述中间箔配置有与所述中间层的界面接触的Ni层 铜箔载体和与超薄铜层的界面接触的Cr层，所述Ni层含有1000-40,000μg/ dm 2的Ni，所述Cr层含有10-100μg/ dm 2的Cr。

公开(公告)号：EP2508048A1

公开(公告)日：2012-10-10

申请号：EP10787284.8

申请日：2010-11-23

Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： KOHN, Cordula ,  KÜBLER, Rainer ,  MÜLLER, Sebastian

IPC: H05K3/28 ,  H05K3/32 ,  H01L31/0224 ,  H01R4/00

CPC classification number: H05K3/245 ,  H01L31/022425 ,  H05K3/321 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0338 ,  H05K2201/10977 ,  H05K2203/1131 ,  H05K2203/1147 ,  H05K2203/1476 ,  Y02E10/50

Abstract: The invention relates to a metal-contacted substrate (1), in which at least one surface of the substrate is entirely or partially provided with a metal contact (2, 3). For mechanical stabilisation, the metal contact is provided with a matrix material (5). The invention also relates to a method for producing such a substrate.

公开(公告)号：EP2496661A2

公开(公告)日：2012-09-12

申请号：EP10790862.6

申请日：2010-11-02

Applicant: Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd.

Inventor： MAGDASSI, Shlomo ,  GROUCHKO, Michael ,  LAYANI, Michael

IPC: C09K11/02

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

Abstract translation: 本发明提供了用于制造导电透明膜的方法和包括其的电子或光电子器件。

公开(公告)号：EP2157607A4

公开(公告)日：2012-09-05

申请号：EP08777066

申请日：2008-05-30

Applicant: KYOCERA CORP

Inventor： ABE YUICHI ,  NAKAMURA KIYOTAKA

IPC: H01L23/36 ,  C04B37/02 ,  H01L23/12 ,  H01L23/373 ,  H05K1/02

CPC classification number: H05K1/0203 ,  C04B37/006 ,  C04B2237/124 ,  C04B2237/368 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0306 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/042 ,  H05K2201/066 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01033

公开(公告)号：EP2384101A4

公开(公告)日：2012-08-29

申请号：EP10735737

申请日：2010-01-21

Applicant: JX NIPPON MINING & METALS CORP

Inventor： YAMANISHI KEISUKE ,  KAMINAGA KENGO ,  FUKUCHI RYO

IPC: H05K1/09 ,  B32B15/01 ,  C23C28/00 ,  C23C30/00 ,  C23F1/18 ,  H05K3/06

CPC classification number: H05K1/09 ,  B32B15/018 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C23C28/025 ,  C23C30/00 ,  C23F1/18 ,  H05K3/0073 ,  H05K3/06 ,  H05K2201/0338 ,  H05K2201/0355 ,  Y10T428/12438

公开(公告)号：EP2457413A1

公开(公告)日：2012-05-30

申请号：EP10737706.1

申请日：2010-07-20

Applicant: PPG Industries Ohio, Inc.

Inventor： SHORT, John, R.

IPC: H05B3/84

CPC classification number: H05K1/0274 ,  H05B3/84 ,  H05B2203/016 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/10272

Abstract: A bus bar system includes a non-conductive substrate having a major surface. At least one conductive bus bar is formed over at least a portion of the major surface. A conductive coating is formed over at least a portion of the bus bar and the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is applied over at least a portion of the film/bus bar junction. The system can optionally include a conductive metallic foil adhered to the isotropically conductive adhesive.

Abstract translation: 母线系统包括具有主表面的非导电衬底。 在主表面的至少一部分上形成至少一个导电汇流条。 在母线和主表面的至少一部分上形成导电涂层。 诸如各向同性导电的带或膜之类的导电粘合剂涂覆在膜/母线结的至少一部分上。 该系统可以可选地包括粘附到各向同性导电粘合剂的导电金属箔。

公开(公告)号：EP1893006B1

公开(公告)日：2012-04-25

申请号：EP07108839.7

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/46 ,  C23G1/10

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

公开(公告)号：EP2300869A2

公开(公告)日：2011-03-30

申请号：EP09767474.1

申请日：2009-06-09

Applicant: 3M Innovative Properties Company

Inventor： NIRMAL, Manoj ,  MAKI, Stephen, P. ,  RADEL, Jason, C. ,  BROTT, Robert, L. ,  MCCLURE, Donald, J. ,  BRIGHT, Clark, I.

IPC: G02F1/1335 ,  G02F1/1333

CPC classification number: H05K1/0274 ,  G02F1/133502 ,  G02F1/133512 ,  G02F1/13439 ,  G02F1/13718 ,  G02F2001/133521 ,  G02F2203/34 ,  H05K1/032 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/0108 ,  H05K2201/0338 ,  H05K2201/10136

Abstract: A conducting film or device electrode includes a substrate and two transparent or semitransparent conductive layers separated by a transparent or semitransparent intervening layer. The intervening layer includes electrically conductive pathways between the first and second conductive layers to help reduce interfacial reflections occurring between particular layers in devices incorporating the conducting film or electrode.