公开(公告)号：EP0996323B1

公开(公告)日：2008-07-02

申请号：EP99119684.1

申请日：1999-10-05

Applicant: TDK Corporation

Inventor： Kudoh, Kazuo, c/o TDK Corporation ,  Katsumata, Masashi, c/o TDK Corporation

IPC: H05K3/36 ,  H05K1/14

CPC classification number: H05K1/145 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/10636 ,  Y02P70/611

公开(公告)号：EP1866961A2

公开(公告)日：2007-12-19

申请号：EP06738702.7

申请日：2006-03-15

Applicant: Medconx, Inc.

Inventor： KENT, Harold, B. ,  LEVANTE, James, J. ,  FINE, Aaron, T. ,  LAYTON, Joseph, R.

IPC: H01L23/28

CPC classification number: H05K3/3494 ,  H01L23/13 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19043 ,  H01R43/0256 ,  H05K1/116 ,  H05K1/184 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2203/0195 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/2075 ,  H01L2924/00014 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00015

Abstract: A micro solder pot includes a dielectric substrate having at least one hole formed therein, a conductive coating coupled to the interior of the hole, and at least one heat transfer pad spaced from the hole in thermal communication with the conductive coating of the hole. When the heat transfer pad is exposed to a heat source, the conductive coating inside the hole is heated. The micro solder pot may also include a thermally activated conductive material disposed within the hole. When the heat transfer pad is exposed to a heat source, the thermally activated conductive material becomes liquidus such that a component can be inserted into the liquidus material. When the heat source is removed, the thermally activated conductive material cools to couple the component to the conductive coating in the hole.

公开(公告)号：EP1849186A2

公开(公告)日：2007-10-31

申请号：EP06735419.1

申请日：2006-02-14

Applicant: IRVINE SENSORS CORPORATION

Inventor： MICHAELS, Daniel ,  BOYD, William, E.

IPC: H01L23/02

CPC classification number: H05K1/147 ,  H01L25/105 ,  H01L2225/0652 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/0397 ,  H05K2201/09181 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A multilayer module comprised of stacked IC package layers is disclosed. A plurality of layers preferably having ball grid array I/O are stacked and interconnected using one or more interposer layers for the routing of electronic signals to appropriate locations in the module through angularly depending leads. The stack is further comprised of an interface PCB for the routing of electronics signals to and from the layers in the module and for connection to an external circuit.

公开(公告)号：EP1817947A1

公开(公告)日：2007-08-15

申请号：EP05851537.0

申请日：2005-11-10

Applicant: PPG Industries Ohio, Inc.

Inventor： OLSON, Kevin, C. ,  WANG, Alan, E. ,  ELENIUS, Peter ,  GOODMAN, Thomas, W.

IPC: H05K3/46 ,  H05K3/44

CPC classification number: H05K3/002 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09545 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135

Abstract: A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.

公开(公告)号：EP1235233B1

公开(公告)日：2005-11-23

申请号：EP02076768.7

申请日：1994-09-13

Applicant: TYCO Electronics Corporation

Inventor： Fang, Shou-Mean ,  Siden, Denis ,  Thompson, Mark ,  Zhang, Michael

IPC: H01C1/14 ,  H01C7/02 ,  H01C17/28

CPC classification number: H01C17/28 ,  H01C1/1406 ,  H01C7/027 ,  H01C17/06586 ,  H05K1/182 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10469 ,  H05K2201/10666

公开(公告)号：EP1416778A2

公开(公告)日：2004-05-06

申请号：EP03256881.8

申请日：2003-10-30

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Yatsu, Hiroyuki

IPC: H05K1/14 ,  H05K3/34

CPC classification number: H05K1/184 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/10477 ,  H05K2201/10727 ,  Y02P70/613

Abstract: An electronic unit includes a module (1) in which a semiconductor device (3) is attached on the bottom of a circuit board (2) and which has lands (4) provided on the bottom of the circuit board, and a printed circuit board (5) on which the module is mounted, the printed circuit board having a hole (5a) in a position facing the semiconductor device and having electrical conductors (6) to which the lands are soldered. The module is mounted on the printed circuit board by soldering the lands to the electrical conductors while the semiconductor device is disposed in the hole. Accordingly, the electronic unit is smaller in height than conventional electronic units. Such a structure allows the module to be surface-mounted on the printed circuit board with solder paste, and thus high productivity of the electronic unit can be achieved.

Abstract translation: 在模块（1）上设置安装在具有焊盘（4）的电路板（2）的底部的半导体器件（3）。 印刷电路板（PCB）（5）通过在将半导体器件设置在孔（5a）中的同时将焊盘焊接到电导体（6）上来安装模块。

公开(公告)号：EP0949642A3

公开(公告)日：2004-01-02

申请号：EP99302518.8

申请日：1999-03-31

Applicant: TDK Corporation

Inventor： Ahiko, Taisuke ,  Sato, Hiroki ,  Ishigaki, Takaya ,  Kamiya, Takashi ,  Yamamoto, Masanori

IPC: H01G4/232 ,  H01G4/38 ,  H01G2/06

CPC classification number: H01G4/012 ,  H01G4/232 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A ceramic substrate (1) has two side surfaces (64, 65) in a lengthwise direction (X) and two side surfaces (66, 67) in a widthwise direction Y intersecting each other, and is also provided with at least one flat surface (68) in a thicknesswise direction (Z). Internal electrode films (2 to 11) are embedded in the ceramic substrate (1) with film surfaces thereof extending roughly parallel to the flat surface (68) of the ceramic substrate (1). External electrodes (44, 55) are each provided on the flat surface (68) of the ceramic substrate (1) toward one of the two ends of the ceramic substrate (1) in the lengthwise direction (X), are electrically continuous with the internal electrode films (2 to 11) and are formed over distances (d11, d12) and (d21, d22) from the two side surfaces (66, 67) in the widthwise direction (Y).

Abstract translation: 陶瓷基板（1）在长度方向（X）上具有两个侧表面（64,65）和沿宽度方向Y彼此相交的两个侧表面（66,67），并且还设置有至少一个平坦表面 （68）在厚度方向（Z）上。 内部电极膜（2〜11）嵌入在陶瓷基板（1）中，其膜表面大致平行于陶瓷基板（1）的平坦表面（68）延伸。 在陶瓷基板（1）的平坦表面（68）上沿着长度方向（X）向陶瓷基板（1）的两端之一设置外部电极（44,45），与陶瓷基板 内部电极膜（2〜11），并且在宽度方向（Y）上从两个侧面（66,67）的距离（d11，d12）和（d21，d22）形成。

公开(公告)号：EP1362500A1

公开(公告)日：2003-11-19

申请号：EP02711160.8

申请日：2002-02-15

Applicant: Koninklijke Philips Electronics N.V.

Inventor： HORIE, Kenichi

IPC: H05K1/14 ,  H05K3/00 ,  H01Q23/00

CPC classification number: H05K3/0052 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01Q23/00 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181

Abstract: The electronic device of the invention is such constructed that the antenna part (3) and the RF circuit part (4) can show their respective functions even after the antenna part (3) and the RF circuit part (4) have been separated. Besides a scribe line 6 is formed on a-preferably ceramic-substrate for separating the antenna part (3) from the RF circuit part (4). Both parts may be separated after a change in any environmental condition, such as a change in the circuit configuration of the board on which the device (10) is to be mounted.

公开(公告)号：EP1347470A1

公开(公告)日：2003-09-24

申请号：EP03076248.8

申请日：1993-07-08

Applicant: Tyco Electronics Corporation

Inventor： Graves, Gregory A. ,  Zhang, Michael ,  Chandler, Daniel ,  Chang, Chi-Ming, Dept. Chem. Eng. ,  Fang, Shou-Mean

IPC: H01C1/14

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising

(a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and
(b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element.
Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，该装置包括（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分和主体部分 电阻元件的一部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 与电阻元件的主要部分。 这样的装置可以以各种方式固定到电路板，并且可以弹性变形的端子。

公开(公告)号：EP1296453A3

公开(公告)日：2003-06-04

申请号：EP02021467.2

申请日：2002-09-25

Applicant: TDK Corporation

Inventor： Nakano, Masahiro, c/oTDK Corporation

IPC: H03H9/05

CPC classification number: H03H9/059 ,  H01L2224/16225 ,  H01L2924/15311 ,  H03H9/1071 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  Y02P70/613

Abstract: On a piezoelectric substrate 23, there are provided surface acoustic wave devices F 1 and F 2 in which predetermined circuit patterns are formed, and a package substrate 11 comprising side vias 16 formed in a caved manner in the thickness direction on side surfaces on which the surface acoustic wave devices are mounted. When the side vias 16 are each assumed to have the opening width ϕ and the maximum depth D, a size satisfying ϕ/2

Abstract translation: 在压电基板23上，设置有表面声波装置F1和F2，其中形成有预定的电路图案，以及封装基板11，该封装基板11包括在侧表面上以厚度方向以凹下方式形成的侧通孔16， 波装置。 当侧面通孔16各自具有开口宽度phi和最大深度D时，假设满足phi / 2