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    Electrical interconnect system
    133.
    发明公开
    Electrical interconnect system 失效
    电气连接系统。

    公开(公告)号：EP0622866A3

    公开(公告)日：1996-04-10

    申请号：EP93120300.4

    申请日：1993-12-16

    Applicant: Hewlett-Packard Company

    Inventor： Wilson, Arthur King ,  Brown, Patricia Susan ,  Arbeiter, Jason R.

    IPC: H01R9/07 ,  B41J2/175

    CPC classification number: B41J2/17526 ,  B41J2/1752 ,  H01R12/62 ,  H05K1/0393 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2203/167

    Abstract: An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer (56); at least one protrusion (118) on the flexible first layer (56) that has an electrical contact (100); a second layer (54) having at least one electrical contact (134); and a spring device (124) coupled to the flexible first layer (56) and to the second layer (54) for pressing the electrical contact (100) on a protrusion (118) on the flexible first layer (56) to the electrical contact (134) on the second layer (54) to electrically connect the electrical contact (100) on the protrusion (118) to the electrical contact (134) on the second layer (54). In a specific embodiment the spring device (124) for pressing the electrical contact (100) on the protrusion (118) of the flexible first layer (56) to the electrical contact (134) on the second layer (54) includes relief device (132) for allowing the flexible first layer (56) to deform during assembly of the improved electrical interconnect system for a flexible circuit. In an alternate specific embodiment the electrical contacts (100) on the protrusions (118) on the flexible first layer (56) and the corresponding electrical contacts (134) on the second layer (54) are coated with gold. In another alternate specific embodiment the improved electrical interconnect system includes an alignment apparatus coupled to the flexible first layer (56) and the second layer (54) and the spring device (124) for aligning the flexible first layer (56) with the second layer (54) and the spring device (124). The improved electrical interconnect system for a flexible circuit provides higher interconnect density, reduced cost and increased reliability compared to conventional interconnect systems.

    Method and apparatus for providing electrical power to electronic devices enclosed in a chip carrier
    135.
    发明公开
    Method and apparatus for providing electrical power to electronic devices enclosed in a chip carrier 失效
    在电源的方法和装置的电 - 嵌入式芯片载体 - 电气部件。

    公开(公告)号：EP0661778A3

    公开(公告)日：1995-08-30

    申请号：EP94116715.7

    申请日：1994-10-22

    Applicant: International Business Machines Corporation

    Inventor： Foster, Richard A.

    IPC: H01R23/68 ,  H01R9/07 ,  H05K3/36

    CPC classification number: H01R12/62 ,  H01R12/7088 ,  H05K1/0263 ,  H05K1/0393 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09309 ,  H05K2203/063

    Abstract: A laminar power bus (26) is provided. The laminar power bus includes a plurality of interfacing sheets (32, 34, 36, 52, 54). Power is transferred from a power supply to a chip carrier via a first and second conductive sheets (34, 36) adhered to opposite sides of an insulating sheet (32). Apertures (48) through the second conductive sheet (36), and a concentrically aligned apertures (46) through the insulating sheet (32) permits depressions forming protrusions (38) in the first conductive sheet (34) to protrude through the second conductive sheet (36) and extend beyond the plane of the first conductive sheet (34). Additional depressions in the second conductive sheet (36) forming protrusions (42) extending away from the insulating sheet (52). The protrusions (38, 42) in the first and second conductive sheets (34, 36) are arranged in a pattern corresponding to a pattern of metal pads (40, 44) for receiving electrical power on the substrate (22) of the chip carrier. The laminar power bus is connected to the substrate (22) of the chip carrier.

    Electrical interconnect system
    137.
    发明公开
    Electrical interconnect system 失效
    Elektrisches Verbindungssystem。

    公开(公告)号：EP0622866A2

    公开(公告)日：1994-11-02

    申请号：EP93120300.4

    申请日：1993-12-16

    Applicant: Hewlett-Packard Company

    Inventor： Wilson, Arthur King ,  Brown, Patricia Susan ,  Arbeiter, Jason R.

    IPC: H01R9/07 ,  B41J2/175

    CPC classification number: B41J2/17526 ,  B41J2/1752 ,  H01R12/62 ,  H05K1/0393 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2203/167

    Abstract: An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer (56); at least one protrusion (118) on the flexible first layer (56) that has an electrical contact (100); a second layer (54) having at least one electrical contact (134); and a spring device (124) coupled to the flexible first layer (56) and to the second layer (54) for pressing the electrical contact (100) on a protrusion (118) on the flexible first layer (56) to the electrical contact (134) on the second layer (54) to electrically connect the electrical contact (100) on the protrusion (118) to the electrical contact (134) on the second layer (54). In a specific embodiment the spring device (124) for pressing the electrical contact (100) on the protrusion (118) of the flexible first layer (56) to the electrical contact (134) on the second layer (54) includes relief device (132) for allowing the flexible first layer (56) to deform during assembly of the improved electrical interconnect system for a flexible circuit. In an alternate specific embodiment the electrical contacts (100) on the protrusions (118) on the flexible first layer (56) and the corresponding electrical contacts (134) on the second layer (54) are coated with gold. In another alternate specific embodiment the improved electrical interconnect system includes an alignment apparatus coupled to the flexible first layer (56) and the second layer (54) and the spring device (124) for aligning the flexible first layer (56) with the second layer (54) and the spring device (124). The improved electrical interconnect system for a flexible circuit provides higher interconnect density, reduced cost and increased reliability compared to conventional interconnect systems.

    Abstract translation: 一种用于柔性电路的改进的电互连系统，包括：柔性第一层（56）; 所述柔性第一层（56）上的至少一个突起（118）具有电接触（100）; 具有至少一个电触点（134）的第二层（54）; 以及耦合到所述柔性第一层（56）和所述第二层（54）的弹性装置（124），用于将所述柔性第一层（56）上的突起（118）上的所述电触头（100）挤压到所述电触点 （134），以将所述突起（118）上的所述电触点（100）电连接到所述第二层（54）上的所述电触头（134）。 在一个具体实施例中，用于将柔性第一层（56）的突起（118）上的电触点（100）压到第二层（54）上的电接触（134）的弹簧装置（124）包括释放装置 132），用于允许柔性第一层（56）在用于柔性电路的改进的电互连系统的组装期间变形。 在替代的具体实施例中，柔性第一层（56）上的突起（118）上的电触头（100）和第二层（54）上的对应的电触头（134）涂覆有金。 在另一个可选的具体实施例中，改进的电互连系统包括耦合到柔性第一层（56）和第二层（54）和弹簧装置（124）的对准装置，用于将柔性第一层（56）与第二层 （54）和弹簧装置（124）。 与常规互连系统相比，用于柔性电路的改进的电互连系统提供更高的互连密度，降低的成本和增加的可靠性。

    Electrical test probe having shaped contacts
    140.
    发明公开
    Electrical test probe having shaped contacts 失效
    与形状联系的电气连接

    公开(公告)号：EP0529577A3

    公开(公告)日：1993-08-04

    申请号：EP92114444.0

    申请日：1992-08-25

    Applicant: Hughes Aircraft Company

    Inventor： Feigenbaum, Haim ,  Crumly, William R. ,  Schreiber, Christopher M.

    IPC: G01R1/073 ,  H05K3/20 ,  H05K3/40

    CPC classification number: G01R1/073 ,  H05K3/205 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10666 ,  H05K2203/0113 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/167

    Abstract: Shaped contacts (40, 42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool makes indentations (24a, 24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a, 24b), are electroplated with a pattern of conductive material (34, 36, 38), and a dielectric substrate is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical or pyramidal shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed. This enables the contacts to penetrate foreign materials, such as oxides, that may form on the surface of the pads, to which the contacts are to be connected to ensure a good contact without any need for wiping action.

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