公开(公告)号：EP2040289A3

公开(公告)日：2009-11-11

申请号：EP08250419.2

申请日：2008-02-05

Applicant: Phoenix Precision Technology Corporation

Inventor： Hsu, Shih-Ping

IPC: H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC classification number: H01L24/81 ,  H01L23/498 ,  H01L23/49822 ,  H01L24/14 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/11902 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K3/062 ,  H05K3/108 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/0574 ,  Y10T29/49165

Abstract: The present invention relates to a packaging substrate and a method for manufacturing the same. The packaging substrate comprises: a substrate body (30), wherein a surface thereof has a circuit layer comprising a plurality of circuits (33) and a plurality of conductive pads (34), and the conductive pads are higher than the circuits; and an insulating protection layer (37) disposed on the surface of the substrate body, wherein the insulating protection layer has a plurality of openings (371) exposing the conductive pads, and the size of the openings is larger than or equal to that of the conductive pads. Accordingly, the packaging substrate structure of the present invention can be employed in a flip-chip packaging structure of fine-pitch.

公开(公告)号：EP2007176A4

公开(公告)日：2009-11-11

申请号：EP07736883

申请日：2007-03-14

Applicant: SUMITOMO BAKELITE CO

Inventor： CHUMA TOSHIAKI ,  INABA MAKOTO

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/148 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481

公开(公告)号：EP2104136A1

公开(公告)日：2009-09-23

申请号：EP07850933.8

申请日：2007-12-19

Applicant: International Business Machines Corporation

Inventor： OYAMA, Yukifumi ,  TORIYAMA, Kazushige ,  NISHIWAKI, Hidetoshi ,  ORII, Yasumitsu ,  NISHIO, Toshihiko

IPC: H01L21/60

CPC classification number: H01L24/13 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2201/40 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/7515 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/3478 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/049 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: After preliminary supply of an equal amount of solder to all of stud-bumps of a semiconductor part, establishing solder connection between the stud-bumps and connecting pads of a circuit substrate. A method for mounting a semiconductor part on a circuit substrate is provided, which includes the steps of preparing the semiconductor part (10) having a surface thereof provided with a plurality of stud-bumps (12), preparing a solder substrate (13) having a surface thereof on which solid-solders (14) corresponding to respective of the plurality of stud-bumps (12) are arranged, preparing the circuit substrate (20) having a surface thereof provided with connecting pads (21) corresponding to respective of the plurality of stud-bumps, attaching, to respective tip ends of the plurality of stud bumps, the corresponding solid-solders on the solder substrate, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective of the tip ends of the stud-bumps with the corresponding connecting pads, and melting the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective of the stud-bumps and the corresponding connecting pads.

Abstract translation: 在向半导体部件的所有凸起凸起预先供应相等量的焊料之后，在电路基板的凸块和凸块之间建立焊接连接。 提供了一种在电路基板上安装半导体部件的方法，包括准备半导体部件（10）的步骤，该半导体部件（10）的表面设置有多个凸块（12），制备焊料基板（13），其具有 在其表面上布置有与多个柱形突起（12）中的相应的固体焊料（14），准备电路基板（20），其表面设置有与其相应的连接焊盘（21） 多个凸起凸起，附接到多个凸起凸块的相应末端，焊料基板上的对应的固体焊料，将附接到凸块凸块的顶端的固体焊料与焊料基板分离，接触 所述固体焊料用相应的连接焊盘附接到所述突起凸起的各个末端，并且熔化与相应的连接焊盘接触的固体焊料，从而建立焊料连接 在相应的支柱凸块和相应的连接垫之间。

公开(公告)号：EP1408364B1

公开(公告)日：2009-05-13

申请号：EP03028994.6

申请日：1998-03-04

Applicant: Sharp Kabushiki Kaisha

Inventor： Shiota, Motoji ,  Inada, Kiyoshi ,  Yoshida, Hirokazu

IPC: G02F1/13 ,  H01L21/60 ,  H05K3/32

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/09709 ,  H05K2201/10674 ,  H01L2924/00

公开(公告)号：EP2020835A2

公开(公告)日：2009-02-04

申请号：EP08009013.7

申请日：2008-05-15

Applicant: Phoenix Precision Technology Corporation

Inventor： Hsu, Shih-Ping

IPC: H05K3/34

CPC classification number: H05K3/3473 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05567 ,  H01L2224/05644 ,  H01L2224/05671 ,  H01L2224/13109 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/0989 ,  H05K2203/043 ,  H05K2203/0542 ,  H01L2924/00014

Abstract: Provided is a circuit board including: a circuit board body with at least one surface having a plurality of electrically connecting pads; an insulating protection layer formed on the circuit board body and formed with an opening corresponding in position to one of the electrically connecting pads, being larger than the electrically connecting pad, and not being in contact with the periphery of the electrically connecting pad; and a soldering material formed on, and confined to, the electrically connecting pad; thus allowing an electrically conductive element limited in the opening formed in the insulating protection layer to be fabricated from the soldering material by a reflow process with a view to forming a fine-pitch electrically connecting structure.

Abstract translation: 提供一种电路板，包括：电路板主体，具有至少一个具有多个电连接焊盘的表面; 绝缘保护层，形成在所述电路板主体上并形成有与所述电连接焊盘中的一个相对应的开口，所述开口比所述电连接焊盘大并且不与所述电连接焊盘的外围接触; 以及形成在所述电连接焊盘上并限制在所述电连接焊盘上的焊接材料; 从而允许限制在绝缘保护层中形成的开口中的导电元件通过回流工艺由焊接材料制造，以形成精细节距的电连接结构。

公开(公告)号：EP1884995A3

公开(公告)日：2009-01-07

申请号：EP07113606.3

申请日：2007-08-01

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Nakamura, Junichi

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/108 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09527 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring substrate (11) includes a first insulation layer (14), a connection terminal (15), a second insulation layer (21), a via (24), and a wiring pattern (16). The connection terminal (15) is disposed in the first insulation layer (14) so as to be exposed from a first main surface (14B) of the first insulation layer (14), and is electrically connected with a semiconductor chip (12). The second insulation layer (21) is disposed on a second main surface (14C) of the first insulation layer (14) situated on the opposite side from the first main surface (14B). The via (24) is disposed in the second insulation layer (21), and is electrically connected with the connection terminal (15). The via (24) is separated from the connection terminal (15). The wiring pattern (16) is disposed on the second main surface (14C) of the first insulation layer (14) and electrically connects the connection terminal (15) and the via (24).

Abstract translation: 布线基板（11）包括第一绝缘层（14），连接端子（15），第二绝缘层（21），通孔（24）和布线图案（16）。 连接端子（15）设置在第一绝缘层（14）中，以从第一绝缘层（14）的第一主表面（14B）露出，并与半导体芯片（12）电连接。 第二绝缘层（21）设置在位于与第一主表面（14B）相反一侧的第一绝缘层（14）的第二主表面（14C）上。 通孔（24）设置在第二绝缘层（21）中，并与连接端子（15）电连接。 通孔（24）与连接端子（15）分离。 布线图案（16）设置在第一绝缘层（14）的第二主表面（14C）上，并且电连接连接端子（15）和通孔（24）。

公开(公告)号：EP1995724A1

公开(公告)日：2008-11-26

申请号：EP08250082.8

申请日：2008-01-09

Applicant: NITTO DENKO CORPORATION

Inventor： Ohsawa, Tetsuya c/o Nitto Denko Corporation ,  Terada, Naohiro c/o Nitto Denko Corporation

IPC: G11B5/60 ,  H05K3/34

CPC classification number: H05K3/3478 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/056 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/041 ,  H05K2203/167

Abstract: A stepped-part 4b with a lower tip side is formed on the top face of a pattern end 4, and a lower face 4c thereof is used as a plane on which a solder ball 7 is provided. One or more protrusions 4d made of a swollen conductive layer are formed on the lower face to limit displacement of the solder ball in the tip direction and the both side directions. The solder ball is held by the protrusions to suppress deviation of the solder ball.

Abstract translation: 在图案端4的上表面上形成具有下端侧的台阶部分4b，其下表面4c用作设置有焊球7的平面。 在下表面形成由膨胀的导电层制成的一个或多个突起4d，以限制焊球在尖端方向和两侧方向上的位移。 焊球由突起保持以抑制焊球的偏离。

公开(公告)号：EP1978601A1

公开(公告)日：2008-10-08

申请号：EP07707516.6

申请日：2007-01-26

Applicant: Matsushita Electric Works, Ltd

Inventor： TANAKA, Hirohisa ,  HASHIMOTO, Shunsuke

IPC: H01R12/16 ,  H05K1/14

CPC classification number: H05K3/368 ,  H01R12/523 ,  H01R12/57 ,  H01R12/58 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10378

Abstract: A thin board-to-board connector with high density in which there is no connection between three-dimensional complex metal springs. The board-to-board connector (1) comprises a connector (4) having a bump (43) for electrical connection having an umbrella shape on a board (41) and connected to a circuit board (2) and a connector (5) having an elastic electrically conductive section (54) having a through hole (55) made in a conductive pattern (53) on an elastic insulating board (51) and connected to a circuit board (3) electrically connected to the elastic conductive section (54). When a bump (43) is inserted into the through hole (55), the elastic conductive section (54) is electrically connected to the bump (43), and the side surface of the through hole (55) is pressed against to the bump (43) and elastically deformed and dented. Consequently, the bump (43) is press-fit into the through hole (55). With this, the bump (43) can be inserted into the elastic conductive section (54) and engaged with it, and thereby electrical and mechanical connection between circuit boards can be simultaneously achieved in a two-dimensional manner, realizing a low-height connector.

Abstract translation: 具有高密度的薄板对板连接器，其中三维复杂金属弹簧之间没有连接。 板对板连接器（1）包括连接器（4），其具有用于电连接的凸块（43），其具有在板（41）上的伞形状并连接到电路板（2）和连接器（5） 具有弹性导电部分（54），其具有在弹性绝缘板（51）上以导电图案（53）制成并连接到电连接到弹性导电部分（54）的电路板（3）的通孔（55） ）。 当凸块（43）插入到通孔（55）中时，弹性导电部分（54）电连接到凸块（43），并且通孔（55）的侧表面被压靠在凸块 （43）并且弹性变形和凹陷。 因此，凸块（43）压配合到通孔（55）中。 由此，可以将凸起（43）插入到弹性导电部（54）中并与其接合，从而能够以二维方式同时实现电路基板之间的电气和机械连接，实现低高度连接器 。

公开(公告)号：EP1744605A3

公开(公告)日：2008-06-11

申请号：EP06014276.7

申请日：2006-07-10

Applicant: Seiko Epson Corporation

Inventor： Hashimoto, Nobuaki

IPC: H05K1/16

CPC classification number: H01L23/3114 ,  G02F1/13452 ,  H01L23/5228 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/167 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09909 ,  H05K2203/0361 ,  H01L2924/00 ,  H01L2924/01028

Abstract: An electronic board includes: a substrate (P); and a wiring pattern (20, 21) provided on the substrate (P) and having a part that forms a resistance element (R), the part having wiring specifications that are different from those of other parts.

公开(公告)号：EP1503216A4

公开(公告)日：2008-03-26

申请号：EP03758872

申请日：2003-10-24

Applicant: JSR CORP

Inventor： SATO KATSUMI ,  INOUE KAZUO

IPC: G01R31/02 ,  G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01B5/16 ,  H01L21/66 ,  H01L23/498 ,  H01R11/01 ,  H01R33/76 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42

CPC classification number: G01R1/07314 ,  G01R1/06711 ,  G01R1/06733 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R11/01 ,  H01R12/523 ,  H05K1/116 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2203/0733 ,  H01L2924/00

Abstract: A sheet-form connector capable of forming an electrode structure having a small-diameter surface electrode unit, positively attaining a stable electric connection condition for a circuit device having electrodes formed at a small pitch, and providing a high durability without the electrode structure coming off an insulating sheet; and a production method and an application therefore. The sheet-form connector comprises an insulating sheet and a plurality of electrode structures provided to the insulating sheet to extend through the sheet in its thickness direction, wherein each of the electrode structures comprises a surface electrode part exposed to and protruding from the surface of the insulating sheet, a rear electrode part exposed to the rear surface of the insulating sheet, a shorting part extending continuously from the base end of the surface electrode part through the insulating sheet in its thickness direction until connected to the rear electrode part, and a holding part extending continuously from the base end of the surface electrode part along the surface of the insulating sheet toward the outer side.