公开(公告)号：EP2717304A1

公开(公告)日：2014-04-09

申请号：EP12793698.7

申请日：2012-05-28

申请人： Sumitomo Bakelite Company Limited

发明人： MURAYAMA Ryuichi ,  SHIMOBE Yasuo ,  KANAMORI Naoya

IPC分类号： H01L21/52 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00

CPC分类号： C09J9/02 ,  C08K3/10 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  H01L23/3107 ,  H01L23/49513 ,  H01L24/73 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/15747 ,  H01S5/0226 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to the present invention, a resin composition having superior workability is provided. The paste-like resin composition of the present invention adheres a semiconductor element and a base material, and contains (A) a thermosetting resin and (B) metal particles. d 95 in the volume-based particle size distribution of the metal particles as determined with a flow-type particle image analyzer is 10 µm or less. In other words, the volume ratio of metal particles having a particle diameter that exceeds 10 µm is less than 5%. Here, d 95 indicates the particle diameter at which the cumulative volume ratio thereof is 95%.

摘要翻译： 。根据本发明，提供了一种具有优异的加工性的树脂组合物。 本发明的糊状树脂组合物粘合的半导体元件和基体材料，并含有（A）热固性树脂和（B）的金属颗粒。 ð95在用流式颗粒图像分析仪开采为确定性的金属粒子的体积基准的粒径分布是10微米或更小。 换句话说，具有粒径的金属颗粒的体积比没有超出10微米是小于5％。 这里，D 95表示粒径在其中其累积体积比率为95％。

公开(公告)号：EP2717302A1

公开(公告)日：2014-04-09

申请号：EP12793073.3

申请日：2012-05-24

申请人： Sumitomo Bakelite Company Limited

发明人： SHIMOBE Yasuo ,  MURAYAMA Ryuichi ,  MITOTE Keiji

IPC分类号： H01L21/52

CPC分类号： H01L23/49579 ,  C08K3/08 ,  C08K2003/0806 ,  C09J9/00 ,  C09J11/04 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/49513 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29386 ,  H01L2224/29439 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/32245 ,  H01L2224/3226 ,  H01L2224/32501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2924/01014 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

摘要： According to the present invention, a semiconductor having excellent yield is provided. The semiconductor device (10) of the present invention includes :
a base material(die pad) (2), a semiconductor element(3), and an adhesive layer(1) intervening the space between the base material and the semiconductor element (3) to adhere the base material and the semiconductor element. Thermal conductive filler (8) is contained in the adhesive layer (1), and when the content of the thermal conductive filler dispersed in the whole of the adhesive layer is expressed as C,
the content of the thermal conductive filler in the region 1 ranging from the interface of the adhesive layer at the side of the semiconductor element to the depth by 2µm is expressed as C1, and the content of the thermal conductive filler in the region 2 ranging from the interface of the adhesive layer at the side of the base material to the depth by 2µm is expressed as C2, the following formulae are satisfied:
C1

摘要翻译： 根据本发明，提供了具有优异成品率的半导体。 本发明的半导体装置（10）包括：基材（管芯焊盘）（2），半导体元件（3）以及介于基材和半导体元件（3）之间的空间的粘合剂层（1） ）以粘附基材和半导体元件。 在粘合剂层（1）中含有导​​热性填料（8），将分散在整个粘合剂层中的导热性填料的含量设为C时，区域1的导热性填料的含量为 从半导体元件侧的粘接层的界面到2μm的深度的距离设为C1，从基底侧的粘接层的界面到区域2的导热填料的含量 材料深度2μm表示为C2，满足下列公式：C1

公开(公告)号：EP2704235A1

公开(公告)日：2014-03-05

申请号：EP13181704.1

申请日：2013-08-26

申请人： Sumitomo Bakelite Company Limited

发明人： Ono, Yukiharu ,  Takeuchi, Takeshi ,  Watanabe, Tsuyoshi

IPC分类号： H01M4/36 ,  H01M4/587 ,  H01M10/0525 ,  H01M10/054 ,  H01M4/02

CPC分类号： H01M4/587 ,  H01M4/364 ,  H01M4/366 ,  H01M10/0525 ,  H01M10/054 ,  H01M2004/021 ,  H01M2004/027

摘要： A negative-electrode material is a carbonaceous negative-electrode material used in an alkali metal ion battery and an average layer spacing d 002 of face (002) calculated by an X-ray diffraction method using CuKα radiation as a radiation source is equal to or more than 0.340 nm. When the negative-electrode material is embedded in an epoxy resin, the epoxy resin is cured, the resultant cured material is cut and polished to expose a cross-section of the negative-electrode material, and the cross-section is observed in a bright field with 1000 times magnification using an optical microscope, a first region (101) and a second region (103) having different reflectance ratios are observed from the cross-section of the negative-electrode material (100).

公开(公告)号：EP2306244B1

公开(公告)日：2013-11-06

申请号：EP09794296.5

申请日：2009-06-19

申请人： Sumitomo Bakelite Company Limited

发明人： SUGIYAMA, Hiromichi ,  MAKABE, Hiroaki

IPC分类号： G03F7/022 ,  G03F7/023

CPC分类号： G03F7/0233 ,  G03F7/0226

公开(公告)号：EP2551924A1

公开(公告)日：2013-01-30

申请号：EP11759295.6

申请日：2011-03-17

申请人： Sumitomo Bakelite Company Limited

发明人： KUSUNOKI Junya ,  TAKEUCHI Etsu ,  SUGIYAMA Hiromichi ,  KUBOYAMA Toshiharu ,  KAWATA Masakazu

IPC分类号： H01L33/32

CPC分类号： H01L33/0079 ,  H01L33/32

摘要： An object of the invention is to provide a method of manufacturing a light-emitting element, in which residue from a fixing resin layer is less likely to be left on a semiconductor layer and a supporting base in the case of manufacturing the light-emitting element by a laser lift-off technique. Furthermore, another object of the invention is to provide a highly reliable light-emitting element that is manufactured by the method of the present invention. The above-described objects are accomplished by applying a thermally decomposable resin composition as a fixing resin layer that fixes the semiconductor layer to a supporting base, and by thermally decomposing the fixing resin layer at the time of peeling off the semiconductor layer from the supporting base.

摘要翻译： 本发明的一个目的是提供一种制造发光元件的方法，在从固定用树脂层，其残基是不太可能被留在半导体层和在制造的发光元件的情况下的支撑基底上 通过激光剥离技术。 进一步，本发明的另一个目的是提供一种高可靠性的发光元件并通过本发明的方法制造的。 上述目的通过施加热分解性树脂组合物作为定影树脂层那样在半导体层的修复到支撑基底来实现，并通过在从支撑基底剥离半导体层时热分解的固定用树脂层 ，

公开(公告)号：EP2530786A1

公开(公告)日：2012-12-05

申请号：EP11736877.9

申请日：2011-01-18

申请人： Sumitomo Bakelite Company Limited

发明人： KAGIMOTO Tomohiro ,  CHUMA Toshiaki

IPC分类号： H01R11/01 ,  C09D7/12 ,  C09D201/00 ,  H01B1/22 ,  H01B5/16 ,  H01L21/60 ,  H01R4/02 ,  H01R43/02 ,  H05K3/32

CPC分类号： H01L24/29 ,  B32B15/08 ,  B32B2311/14 ,  B32B2311/16 ,  C09D5/24 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/11436 ,  H01L2224/11522 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83222 ,  H01L2224/83224 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2224/9201 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A conductive connecting sheet (1) of the present invention is composed of a layered body including resin composition layers (11, 13) and a metal layer (12), and each resin composition layer (11, 13) satisfies the following requirement A: in the case where at least a part of metal ball(s) made of the metal material having low melting point is provided within each resin composition layer (11, 13), the metal ball(s) is heated at a temperature which is a melting temperature thereof or higher according to "test methods for soldering resin type fluxes" defined in JIS Z 3197, and then a wet extension of the metal ball (s) is measured, the wet extension is 37% or more. If the conductive connecting sheet is used for forming connection portions electrically connecting terminals to each other, the connection portions can be formed by selectively aggregating a heated and melted metal material between the terminals and a sealing layer constituted from a resin component can be formed so as to surround the connection portions. As a result, since peripheries of the connection portions can be covered by the resin component, the connection portions are fixed. Further, since an insulating property between the adjacent terminals can be secured by the sealing layer, generation of a leak current between the adjacent terminals can be reliably prevented.

摘要翻译： 的导电连接片（1）本发明的由层积体的包含树脂组合物层（11，13）和金属层（12），和各树脂组合物层（11，13）SATIS外资企业下面要求答： 在其中至少有由具有低熔点的金属材料的金属球（一个或多个）的一部分的各树脂组合物层（11，13）中提供的情况下，金属球（一个或多个）在一定温度下加热所有这是一个 其熔化温度以上gemäß到“测试方法用于焊接树脂型通量”在JIS Z 3197所定义，然后将金属球（一个或多个）的湿延伸测定，湿延伸是37％以上。 如果导电连接片被用于形成连接部分电连接端子海誓山盟，连接部分可以通过选择性地聚集在端子和密封层之间的加热熔融金属材料来形成由树脂成分构成，可以形成为 以围绕连接部。 其结果是，由于连接部份的边缘可以通过树脂成分所覆盖，所述连接部分被固定。 此外，由于在相邻的端子之间的绝缘性可以通过密封层被固定，产生相邻端子之间的漏电流可以被可靠地防止。

公开(公告)号：EP2282209B1

公开(公告)日：2012-10-03

申请号：EP09738633.8

申请日：2009-04-28

申请人： Sumitomo Bakelite Company Limited

发明人： ABE, Midori ,  SHIMAOKA, Hideyuki ,  KURAMOTO, Hiromitsu

IPC分类号： G01N33/58 ,  G01N30/04 ,  G01N30/88

CPC分类号： G01N33/50 ,  G01N2030/8836 ,  G01N2400/00

公开(公告)号：EP2484739A1

公开(公告)日：2012-08-08

申请号：EP10820557.6

申请日：2010-09-29

申请人： Sumitomo Bakelite Company Limited

发明人： CHUMA Toshiaki ,  OKADA Wataru ,  KAGIMOTO Tomohiro

IPC分类号： C09J201/00 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J133/02 ,  C09J163/00 ,  C09J171/10 ,  C09J179/08 ,  H01B5/16 ,  H01L21/60 ,  H01R11/01 ,  H01R43/00 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC分类号： H05K3/3478 ,  C08G2650/56 ,  C08L33/08 ,  C08L63/00 ,  C08L71/00 ,  C08L79/08 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2463/00 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/111 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2224/83886 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01R13/03 ,  H05K3/305 ,  H05K3/363 ,  H05K2201/10977 ,  H05K2203/0405 ,  Y10T428/31529 ,  Y10T428/31678 ,  C08L2666/02 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/29113 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00015

摘要： The present invention provides a conductive connecting material having a multi-layered structure comprising a resin composition and a metal foil selected from a solder foil or a tin foil, wherein the minimum ion viscosity value of the resin composition is 4-9 when measured in accordance with ASTM standard E2039 by applying a frequency of 10000Hz at the melting point of the metal foil. The present invention further provides a method for connecting terminals and a method for producing a connection terminal using the conductive connecting material. By using the conductive connecting material of the present invention, good electric connection between connection terminals as well as highly-reliable insulation between adjacent terminals can be achieved.

摘要翻译： 本发明提供了具有多层结构，其包含树脂组合物和由焊料箔或锡箔中的金属箔，worin树脂组合物的最低粘度离子值被4-9当雅舞蹈测量的导电连接材料 与通过在金属箔的熔点下施加10000Hz的频率ASTM标准E2039。 本发明还提供了连接端子的方法以及使用导电连接材料的连接端子的方法。 通过使用本发明的导电连接材料，连接端子之间的可靠性高的绝缘，相邻端子之间良好的电连接，以及可以实现的。

公开(公告)号：EP2455965A1

公开(公告)日：2012-05-23

申请号：EP10799595.3

申请日：2010-07-09

申请人： Sumitomo Bakelite Company Limited

发明人： MAEJIMA, Kenzou ,  KATSURAYAMA, Satoru ,  MEURA, Toru

IPC分类号： H01L21/60

CPC分类号： C09D163/00 ,  H01L21/563 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81091 ,  H01L2224/81093 ,  H01L2224/81097 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81209 ,  H01L2224/81211 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8349 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/3512

摘要： Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode for connection purposes with a second electronic component having a solder electrode for connection purposes, the method comprising the steps (i) to (iv) in this order: (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning, after the formation of said resin layer containing a thermosetting resin, said metal electrode for connection purposes of said first electronic component and said solder electrode for connection purposes of said second electronic component to face each other, heating said positioned electrodes at a temperature lower than the melting point of said solder of said solder electrode for connection purposes and applying pressure, and thereby bringing said metal electrode for connection purposes and said solder electrode for connection purposes into contact; (iii) heating said first electronic component and said second electronic component that have been brought into contact at a temperature higher than the melting point of said solder of said solder electrode for connection purposes while applying pressure using a pressurized fluid, and thereby fusion bonding said solder of said solder electrode for connection purposes to said metal electrode for connection purposes; and (iv) heating said resin layer containing a thermosetting resin at a temperature lower than the melting point of said solder of said solder electrode for connection purposes, and thereby curing said resin layer.

摘要翻译： 本发明提供一种电子部件的制造方法，其特征在于，通过使用焊接方法，将具有用于连接用的金属电极的第一电子部件与具有用于连接目的的焊料电极的第二电子部件接合，所述方法包括以下步骤（i）〜 （iv）按照以下顺序：（i）在所述第一电子部件和所述第二电子部件的至少一个焊点表面上形成含有热固性树脂的树脂层; （ii）在形成包含热固性树脂的所述树脂层之后，为了所述第一电子部件和所述焊料电极的连接目的而将所述金属电极定位为用于所述第二电子部件的连接目的彼此面对，将所述定位的电极加热到 用于连接目的的低于所述焊料电极的焊料的熔点的温度并施加压力，从而使用于连接目的的所述金属电极和用于连接目的的所述焊料电极接触; （iii）在使用加压流体施加压力的同时，为了连接目的，在高于所述焊料电极的焊料的熔点的温度下加热所述第一电子部件和所述第二电子部件接触，从而将所述 用于连接目的的所述焊料电极的焊料到所述金属电极用于连接目的; 和（iv）为了连接目的，在低于所述焊料电极的焊料的熔点的温度下加热含有热固性树脂的树脂层，从而固化所述树脂层。

公开(公告)号：EP2453469A1

公开(公告)日：2012-05-16

申请号：EP10796970.1

申请日：2010-05-31

申请人： Sumitomo Bakelite Company Limited

发明人： YASUDA Hiroyuki ,  HIRANO Takashi

IPC分类号： H01L21/301 ,  C09J7/02 ,  C09J133/00 ,  C09J161/06 ,  C09J163/00 ,  H01L21/52

CPC分类号： C09J163/00 ,  C08F218/08 ,  C08F2220/1825 ,  C08G18/6225 ,  C08G18/7621 ,  C08L61/04 ,  C08L63/00 ,  C08L2203/206 ,  C08L2666/14 ,  C09J7/20 ,  C09J133/08 ,  C09J175/14 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T428/24942 ,  Y10T428/24983 ,  Y10T428/2848 ,  C08F2220/1858 ,  C08F2222/1053 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A film for semiconductor includes a support film, a second adhesive layer, a first adhesive layer and a bonding layer which are laminated together in this order. This film for semiconductor is configured so that it supports a semiconductor wafer laminated on the bonding layer thereof when the semiconductor wafer is diced and the bonding layer is selectively peeled off from the first adhesive layer when a chip is picked up. This film for semiconductor is characterized in that in the case where peel strength at 23°C of the chip is defined as "F 23 (cN/25mm)" and peel strength at 60°C of the chip is defined as "F 60 (cN/25mm) ", F 23 is in the range of 10 to 80 and F 60 /F 23 is in the range of 0.3 to 5.5. This makes it possible to improve a pickup property of the chip, to thereby prevent generation of defects in a semiconductor element.

摘要翻译： 半导体膜包括依次层压在一起的支撑膜，第二粘合剂层，第一粘合剂层和粘合层。 该半导体用膜是在将半导体晶片切割时，在层叠于其接合层上的状态下支撑半导体晶片，在拾取芯片时将接合层选择性地从第一粘接层剥离的结构。 该半导体用膜的特征在于，将芯片在23℃下的剥离强度定义为“F23（cN / 25mm）”，将芯片的60℃下的剥离强度定义为“F60（cN / 25mm）“，F23在10至80的范围内，F60 / F23在0.3至5.5的范围内。 这使得可以改善芯片的拾取性能，从而防止在半导体元件中产生缺陷。