公开(公告)号：EP1599077A1

公开(公告)日：2005-11-23

申请号：EP05291071.8

申请日：2005-05-18

Applicant: Aries Electronics, Inc

Inventor： Walter, James P. ,  Sinclair, William Y.

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/36

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K3/002 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2203/0554 ,  Y10T29/49147

Abstract: A method of creating domed shaped contacts on a printed circuit board (12) includes etching or drilling a central opening in each copper pad (14), and then screening a mound of silver epoxy into the opening. The silver epoxy above the pad slumps to form a domed bump. The silver epoxy is then cured and is coated, in turn, by a layer of electroless nickel (24) and gold (26). The resulting gold plated contacts are of monolithic structure and function to facilitate connection to a mezzanine board.

Abstract translation: 在印刷电路板（12）上形成圆顶形触点的方法包括蚀刻或钻取每个铜垫（14）中的中心开口，然后将银环氧树脂堰一起筛选到开口中。 垫上的银环氧树脂塌陷形成圆顶凸起。 然后将银环氧树脂固化，并依次由一层无电镀镍（24）和金（26）涂覆。 所得到的镀金触点具有整体结构，并且有助于连接到夹层板。

公开(公告)号：EP1542518A1

公开(公告)日：2005-06-15

申请号：EP03730747.7

申请日：2003-06-02

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： HAYASHI, N., Osaka Works SUMITOMO ELEC. IND. LTD. ,  OKA, Y., Osaka Works of SUMITOMO ELEC. IND. LTD. ,  KANDA, Masahiko ,  YAGI, N., Osaka Works of SUMITOMO ELEC. IND. LTD. ,  MIYAZAKI, K., Osaka Works SUMITOMO ELEC. IND. LTD. ,  NAKATSUGI, K., Osaka Works SUMITOMO ELEC. IND. LTD

IPC: H05K3/12 ,  H05K3/16

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 µm or less and the maximum particle diameter of which is 15 µm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

Abstract translation: 一种新的板，用于印刷电路，其包括具有一个明确的和有利的边界线，并通过在序印刷方法制造的细导体配线：例如丝网印刷，使用相同的印刷电路板，和用于制造它们的方法。 一种用于印刷电路板和用于制造该中DASS的特征的方法管芯的基板的表面进行的表面处理之一：（a）粗化，（2）等离子体处理，（3）粗糙化，然后等离子处理， 和（4）粗糙化，然后，通过溅射形成金属薄膜包衣的。 的印刷电路板以及用于制造它的方法是表征在没有导体布线是通过使用导电膏包含金属颗粒的所有的平均粒径是4微米或更小，所有的最大粒径是15印刷制造 微米或更小。 另一印刷电路板以及用于制造它的方法，使用以1.1 M / B的体积比的导电膏包含金属颗粒M和粘合剂乙制造的导体布线的DASS模具表面，其特征在于，以1.9 / 1 被蚀刻，电镀涂层的表面上形成。

公开(公告)号：EP1364220A2

公开(公告)日：2003-11-26

申请号：EP02709401.0

申请日：2002-02-07

Applicant: INTERLINK ELECTRONICS, INC.

Inventor： BAKER, Jeffrey, R. ,  SANCHEZ, Carlos, S.

IPC: G01R27/08

CPC classification number: H01H13/702 ,  G01L1/20 ,  G01L1/205 ,  H01H2201/036 ,  H01H2203/02 ,  H01H2239/01 ,  H05K1/0268 ,  H05K1/11 ,  H05K1/141 ,  H05K1/167 ,  H05K3/249 ,  H05K3/305 ,  H05K3/365 ,  H05K2201/035 ,  H05K2201/09663 ,  H05K2201/10151 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: The cost and complexity of an electronic pressure sensitive transducer (20) are decreased by constructing such a transducer directly on a printed circuit board (22) containing support electronics. Conductive traces (24) are formed on the printed circuit board (22) to define a contact area (26). A flexible substrate (28) having an inner surface is positioned over the contact area (26). An adhesive spacer (34), substantially surrounding the contact area (26), attaches the flexible substrate to the printed circuit board (22). At least one resistive layer (32) is deposited on the flexible substrate (28) inner surface. In use, the resistive layer (32) contacts at least two conductive traces (24) in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.

公开(公告)号：EP1328373A2

公开(公告)日：2003-07-23

申请号：EP01985114.6

申请日：2001-10-24

Applicant: Nanopierce Technologies Inc.

Inventor： NEUHAUS, Herbert ,  ZOU, Bin

IPC: B23K31/00 ,  C22C24/00

CPC classification number: H01L24/83 ,  H01B1/16 ,  H01B1/22 ,  H01L21/4853 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/11505 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29411 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15747 ,  H05K1/095 ,  H05K3/245 ,  H05K3/247 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/023 ,  H05K2201/035 ,  H05K2201/0367 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: The disclosed invention relates to materials and processes for creating particle-enhanced bumps on electrical contact surfaces through stencil or screen printing processes. The materials are mixtures of conductive ink, conductive paste, or conductive adhesive and conductive hard particles (104). The process involves depositing the mixture (108) onto electrical contact surfaces by stencil printing, screen printing, or other dispensing techniques (110). In another embodiment, the ink, paste, or adhesive deposit. Once cured (114), the deposition provides a hard, electrical contact bump on the contact surface with a rough, conductive, sandpaper-like surface that can be easily connected to an opposing contact surface without any further surface preparation of either surface.

公开(公告)号：EP0907893A1

公开(公告)日：1999-04-14

申请号：EP97930946.0

申请日：1997-06-23

Applicant: IMC Industriellt Mikroelektronikcentrum AB

Inventor： GONG, Shaofang ,  BODÖ, Peter ,  HENTZELL, Hans

IPC: G01R31 ,  G01R1 ,  G09F9 ,  H05K3

CPC classification number: H05K3/3436 ,  G01R1/06755 ,  G01R1/07307 ,  G01R31/2886 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/0338 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613

Abstract: A method of testing and mounting electronic components that are to be surface-mounted. The components include on one side a plurality of contact pads that shall be connected electrically to contact pads on one side of a test board, particularly BGA components and corresponding components. The invention is characterized by applying to the component contact pads (2) a metal (5) which is liquid at room temperature or at an elevated room temperature, in a first method step; lifting the component (1) away from the surface of the metal (5) in a second method step, wherewith part (7) of the liquid metal remains on the component contact pads (2); and bringing the component contact pads (2) provided with the liquid metal into abutment with corresponding contact pads (3) on the test board (4), in a third method step.

公开(公告)号：EP0745315A4

公开(公告)日：1999-01-20

申请号：EP95944372

申请日：1995-12-19

Applicant: MOTOROLA INC

Inventor： BRADLEY EDWIN L III ,  BANERJI KINGSHUK ,  KAZEM-GOUDARZI VAHID

IPC: B23K35/02 ,  B23K35/26 ,  H05K3/12 ,  H05K3/34 ,  B23K1/00

CPC classification number: H05K3/3463 ,  B23K35/025 ,  B23K35/26 ,  B23K2201/04 ,  B23K2201/12 ,  H05K3/1216 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/043

Abstract: A soldering process uses two or more different solder alloys. A first solder alloy (115) that undergoes a solid-to-liquid transition at a first temperature is coated (20) onto the solderable surfaces (105) of a printed circuit board (100). A solder paste (120) that undergoes this solid-to-liquid transition at a temperature greater than the first temperature is deposited on the coated solderable portions, and is heated to a temperature that is above the first temperature but below the second temperature. During this time, the first solder alloy liquifies, while the solder paste does not. The first solder alloy wets to the individual particles in the solder paste, and alloys to the solderable surfaces and the solder particles in the solder paste. The soldering composition is subsequently cooled (40) to solidify the first solder material, forming a solid and substantially planar coating on the solderable portions of the printed circuit board.

Abstract translation: 焊接工艺使用两种或更多种不同的焊料合金。 在第一温度下经历固 - 液过渡的第一焊料合金（115）被涂覆（20）到印刷电路板（100）的可焊接表面（105）上。 在大于第一温度的温度下经历这种固 - 液过渡的焊膏（120）沉积在涂覆的可焊接部分上，并被加热到高于第一温度但低于第二温度的温度。 在此期间，第一焊料合金液化，而锡膏不会。 第一焊料合金润湿焊锡膏中的各个颗粒，并将其焊接到可焊接表面以及焊膏中的焊料颗粒。 焊接组合物随后被冷却（40）以固化第一焊料材料，在印刷电路板的可焊接部分上形成固体和基本上平面的涂层。

公开(公告)号：EP0845807A2

公开(公告)日：1998-06-03

申请号：EP97120112.4

申请日：1997-11-17

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Sato, Tomotoshi

IPC: H01L21/60 ,  H05K3/34

CPC classification number: H05K3/3457 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L24/98 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/81191 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0445 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method for producing an electronic circuit device includes a repair step in which, in a case where a semiconductor device once mounted on a wiring board is defective, the defective semiconductor device is removed from the wiring board and a new semiconductor device is mounted on the wiring board. The repair step includes the steps of: removing an excessive residue of a brazing metal residue remaining on lands of the wiring board from which the defective semiconductor device has been removed and leaving a uniform amount of the brazing metal residue on the lands; aligning the new semiconductor device with the wiring board; and melting the brazing metal residue which is made uniform and remains on the lands and projecting electrodes of the new semiconductor device by heating, thereby connecting the new semiconductor device to the wiring board.

Abstract translation: 一种用于在电子电路装置的制造方法包括其中一个修复步骤中，在一个半导体器件一旦被安装在布线基板上有缺陷，缺陷的半导体器件是从布线板和一个新的半导体器件移除的情况下被安装在 布线板。 修补步骤包括下列步骤：移除残留在布线板的焊接区的钎金属残余物从该缺陷的半导体器件已被去除的过多残渣的和留在土地上的钎焊金属残留物的均匀量; 与布线板的新的半导体器件对准; 并熔化的钎焊金属残留物的所有其变得均匀，并保持在上述接合部上，通过加热投影新半导体器件的电极，从而使新的半导体器件连接到布线板上。

公开(公告)号：EP0818946A2

公开(公告)日：1998-01-14

申请号：EP97305014.9

申请日：1997-07-08

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Matsuno, Yukio

IPC: H05K3/46 ,  H05K3/40

CPC classification number: H05K1/113 ,  H05K1/095 ,  H05K3/0094 ,  H05K3/181 ,  H05K3/247 ,  H05K3/4007 ,  H05K3/429 ,  H05K3/4685 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/0959 ,  H05K2203/072

Abstract: A printed-wiring board has a copper foil (the first conductive layer) providing electric conductivity formed on one or both sides of an insulating board providing electrical insulation, an insulating layer providing electrical insulation formed at specific sites (where there are through-holes) on the first conductive layer, and a second conductive layer providing electric conductivity formed on the insulating layer. In this printed-wiring board, when the second conductive layer is formed, deposition of an electrically conductive material by plating, and polishing of the deposited electrically conductive material, these steps are repeated at least once, so that the surface of the second conductive layer can be smoothened to enhance the bonding stability of chip parts.

公开(公告)号：EP0501414A1

公开(公告)日：1992-09-02

申请号：EP92103166.2

申请日：1992-02-25

Applicant: ROHM CO., LTD.

Inventor： Hirai, Minoru, c/o Rohm Co., Ltd.

IPC: H01R23/68 ,  G02F1/1345

CPC classification number: H01R4/04 ,  G02F1/13452 ,  H01R12/82 ,  H05K3/06 ,  H05K3/245 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/035 ,  H05K2203/0338

Abstract: A method of connecting electrodes of a display apparatus includes a process of forming conductive metal paste on an electrode pattern on a flexible resin plate where a drive circuit device is mounted and a process of position-adjusting the electrode pattern on which the conductive metal paste is provided and the electrode pattern on a plane-type display body to heat and pressurize them. By this method, the electrode pattern on the display body and the electrode pattern on the drive circuit side are connected to each other through the conductive metal paste.

Abstract translation: 连接显示装置的电极的方法包括在安装有驱动电路装置的柔性树脂板上的电极图案上形成导电性金属糊料的工序，以及将导电性金属糊料的电极图案位置调整 并且平面型显示体上的电极图案对其加热和加压。 通过这种方法，显示体上的电极图案和驱动电路侧的电极图案通过导电金属膏彼此连接。

公开(公告)号：EP0272678A3

公开(公告)日：1990-04-25

申请号：EP87118977.5

申请日：1987-12-21

Applicant: SEL SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Mase, Akira

IPC: G02F1/133 ,  H01L21/48

CPC classification number: G02F1/13452 ,  G02F1/13439 ,  G02F1/1345 ,  H01L21/4867 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81192 ,  H01L2224/83851 ,  H01L2924/00011 ,  H05K1/095 ,  H05K3/245 ,  H05K2201/0326 ,  H05K2201/035 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49155 ,  H01L2224/29075 ,  H01L2924/00014

Abstract: An improved method of forming an electrode pattern on a substrate (1) is described. The substrate is coated with a first conductive film (2a) and subjected to baking. On the first conductive film is then overlied a second conductive film (2) which mends possi­ble fissures of the first conductive film which, besides, would produce open circuits in the pattern.