公开(公告)号：EP1226743B1

公开(公告)日：2008-10-01

申请号：EP00974728.8

申请日：2000-11-06

Applicant: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM ( IMEC)

Inventor： BEYNE, Eric ,  LECHLEITER, Francois

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K3/025 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/09536 ,  H05K2203/0152 ,  H05K2203/0353 ,  H05K2203/066 ,  H05K2203/068 ,  H05K2203/0769 ,  H05K2203/1581

Abstract: Method and apparatus of fabricating a core laminate Printed Circuit Board structure with highly planar external surfaces is provided. A pre-formed flat material including a first resinous sub-material and a second carrier sub-material is used to planarize external surfaces. During lamination, uniform pressure is applied to the pre-formed flat sheet which covers the upper surface of the printed circuit. The resinous material of the first sub-material flows to fill the crevices, vias, etc. of the upper surface of the PCB. Moreover, due to the uniform pressure on the pre-formed flat sheet, the resinous first sub-material is planarized. This planarized surface provides a suitable base substrate for a thin film multilayer build-up structure and that provides electrical connections between the thin film top layers and the Printed Circuit Board - style core layers.

公开(公告)号：EP1960192A1

公开(公告)日：2008-08-27

申请号：EP06839115.0

申请日：2006-12-06

Applicant: Isola USA Corp.

Inventor： AMLA, Tarun ,  CONN, Peggy, M. ,  KAMLA, Jeff

IPC: B32B17/10

CPC classification number: B32B15/14 ,  B32B5/024 ,  B32B15/08 ,  B32B15/20 ,  B32B17/04 ,  B32B2305/076 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/024 ,  H05K1/036 ,  H05K3/022 ,  H05K3/382 ,  H05K3/386 ,  H05K2201/0358 ,  Y10T428/24355 ,  Y10T428/26 ,  Y10T428/31678

Abstract: Laminate precursors and laminates for use in high speed and high frequency printed circuit boards, and methods for their preparation.

公开(公告)号：EP1911860A1

公开(公告)日：2008-04-16

申请号：EP06766606.5

申请日：2006-06-12

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： MATSUNAGA, T. c/o MITSUI MINING & SMELTING CO. LTD

IPC: C23C28/00

CPC classification number: C23C28/00 ,  B05D2202/45 ,  B05D2350/65 ,  H05K3/384 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/27 ,  Y10T428/31663

Abstract: It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. To achieve this object, a surface-treated copper foil comprising an rust-proofing layer and a silane coupling agent layer formed on the bonding surface of an electrodeposited copper foil to an insulating resin substrate, wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m 2 and a tin layer having a thickness by weight of 5 to 40 mg/m 2 stacked in this order, and the rust-proofing layer is provided with the silane coupling layer on the surface is applied. Also a surface-treated copper foil coated with a very thin primer resin layer, comprising the surface-treated copper foil according to the present invention (without roughening treatment), and a very thin primer resin layer having a thickness by calculation of 0.5 to 5-micron meter provided on the bonding surface of the surface-treated copper foil to the insulating resin substrate is applied.

Abstract translation: 它是本发明的一个目的是提供一种表面处理铜箔与表现出在剥离强度和电阻性能良好剥离化学处理后损失的印刷电路板的无铬防锈层的电解铜箔的特征在于 ， 为了实现该目的，表面处理铜箔，其包括防锈层，并在绝缘性树脂基材，worin的防锈层构成的电解铜箔的接合表面上，以硅烷偶联剂层包括具有镍层 至40mg / m 2，并且其厚度（重量）的5〜40毫克/以此顺序堆叠m 2，并且在防锈层上的锡层的厚度（重量）的5设置有在表面上的硅烷偶联剂层 是应用。 这样的表面处理铜箔涂覆有非常薄的底漆树脂层，其特征在于所述表面处理铜箔雅丁到本发明（没有粗糙化处理），且厚度为0.5至5计算的非常薄的底漆树脂层 所提供的表面处理铜箔的与绝缘树脂基材的贴合表面上-micron米被应用。

公开(公告)号：EP0873047B1

公开(公告)日：2008-02-13

申请号：EP98106742.4

申请日：1998-04-14

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Kobayashi, Kazuhito ,  Kumashiro, Yasushi ,  Takahashi, Atsushi ,  Morita, Koji ,  Tanabe, Takahiro ,  Yamamoto, Kazunori ,  Nakaso, Akishi ,  Arike, Shigeharu ,  Otsuka, Kazuhisa ,  Urasaki, Naoyuki ,  Fujimoto, Daisuke ,  Takano, Nozomu

IPC: H05K3/46

CPC classification number: H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

公开(公告)号：EP1843650A2

公开(公告)日：2007-10-10

申请号：EP07013524.9

申请日：1999-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Hirose, Naohiro ,  Noda, Kouta ,  Segawa, Hiroshi ,  En, Honjin ,  Tsukada, Kiyotaka ,  Ishida, Naoto ,  Asano, Kouji ,  Shouda, Atsushi

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A multilayered printed circuit board comprising: a substrate (330) on which a conductive circuit (334) is formed; an interlayer insulating resin layer (350) formed on the conductive circuit (334); an opening (348) for forming a via hole (360) formed in the interlayer insulating resin layer (350); and another conductive circuit (358) including a via hole (360) and formed on the interlayer insulating resin layer (350), wherein
the surface of the conductive circuit (334) is subjected to a coarsening process using etching solution containing cupric complex and organic acid, and
stripe pits and projections are formed on the inner wall of the opening (348) for forming the via hole (360).

公开(公告)号：EP1627901A4

公开(公告)日：2006-08-02

申请号：EP04734410

申请日：2004-05-21

Applicant: HITACHI CHEMICAL CO LTD

Inventor： TANAKA KENJI ,  TAKEUCHI KAZUMASA ,  OGAWA NOBUYUKI ,  MASUDA KATSUYUKI

IPC: C09D5/00 ,  B32B7/04 ,  B32B15/08 ,  C08G73/14 ,  C09D163/00 ,  C09D179/08 ,  C09D201/00 ,  C09J163/00 ,  C09J179/08 ,  C09J201/00 ,  H05K3/38

CPC classification number: B32B27/36 ,  B32B7/04 ,  B32B15/08 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/281 ,  B32B27/322 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/748 ,  B32B2457/00 ,  C08G73/14 ,  H05K3/386 ,  H05K2201/0358 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

公开(公告)号：EP0746189B1

公开(公告)日：2005-02-02

申请号：EP96303955.7

申请日：1996-05-31

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Shimizu, Hiroshi ,  Ogawa, Nobuyuki ,  Shibata, Katsuji ,  Nakaso, Akishi

IPC: H05K3/46 ,  C09K13/02 ,  C08J7/12

CPC classification number: H05K3/4655 ,  C08J7/12 ,  C08J2363/00 ,  H05K3/002 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K2203/0783 ,  Y10S428/901

公开(公告)号：EP1310525A4

公开(公告)日：2005-01-26

申请号：EP02733251

申请日：2002-05-30

Applicant: MITSUI MINING & SMELTING CO

Inventor： SATO TETSURO ,  ASAI TSUTOMU ,  MATSUSHIMA TOSHIFUMI

IPC: B32B15/08 ,  C08G59/62 ,  C08L61/10 ,  C08L63/00 ,  C08L101/00 ,  C09D163/00 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/4655 ,  B32B15/08 ,  C08L63/00 ,  C09D163/00 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0358 ,  Y10T428/31529 ,  C08L2666/02

Abstract: The invention provides a copper foil with resin for the production of printed wiring boards which is excellent in the balance among flame retardance, flowability of resin, water resistance and peel strength, specifically a copper foil having a resin layer on one surface of the copper foil, characterized in that the resin layer is made from a resin composition comprising (a) 5 to 30 parts by weight of a composition consisting of both a polymer having crosslinking functional groups in the molecule and a crosslinking agent therefor, (b) 5 to 30 parts by weight of an epoxy resin which is liquid at room temperature, and (c) 40 to 90 parts by weight of a compound having a structure represented by the general formula (I): (I) wherein R is H or (II)

公开(公告)号：EP1307075A3

公开(公告)日：2004-12-29

申请号：EP02023716.0

申请日：2002-10-23

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Nakagiri, Yasushi ,  Suzuki, Takeshi ,  Echigo, Fumio

IPC: H05K1/03 ,  H05K3/40 ,  B32B27/04 ,  C08J5/24

CPC classification number: B32B5/26 ,  B32B3/266 ,  B32B5/022 ,  B32B15/14 ,  B32B2250/05 ,  B32B2250/40 ,  H05K1/036 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/10378 ,  H05K2203/0759 ,  H05K2203/1461 ,  Y10T428/24917 ,  Y10T428/249971

Abstract: The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of materials, physical properties, and a combination of the materials of an insulating layer. The present invention also provides a method for manufacturing the prepreg and the circuit board. The prepreg of the present invention includes a laminate (3) including at least one first layer (2) and at least one second layer (1). The first layer (2) is an insulating layer that includes a resin. The second layer (1) has pores that connect an upper and a lower surface of the second layer (1), and the upper and the lower surface of the second layer (1) differ from each other in at least one selected from open are ratio and average pore diameter. Using this prepreg makes it possible to provide a circuit board that is characterized, e.g., by low interstitial via connection resistance, excellent connection stability, and high durability.

公开(公告)号：EP1273609A4

公开(公告)日：2004-10-06

申请号：EP01999592

申请日：2001-12-05

Applicant: MITSUI MINING & SMELTING CO

Inventor： SATO T ,  ASAI T

IPC: C08L29/14 ,  C08G59/40 ,  C08G59/62 ,  C08L63/00 ,  C08L71/10 ,  C08L81/06 ,  H01L23/14 ,  H05K3/46 ,  B32B15/08 ,  B32B27/38 ,  C08L79/00 ,  H05K3/38

CPC classification number: H05K3/4655 ,  C08G59/4042 ,  C08L63/00 ,  H05K3/4652 ,  H05K2201/0358 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/16

Abstract: A resin compound for forming an interlayer insulating layer of a printed wiring board, characterized in that it comprises an epoxy resin containing as an epoxy resin curing agent having a nitrogen content of 5 to 25 wt % and a maleimide compound being curable with heat and contains no halogen elements. The resin compound can be used for producing a copper foil with a resin which is free of a halogen element and has high flame retardancy, and further exhibits excellent resistance to water and heat and good strength against peeling between the copper foil and a substrate.

Abstract translation: 本发明提供的树脂应用于铜箔，所有这一切是不含卤素元素，具有高阻燃性，优良的耐水性，耐热性，以及良好的剥离强度的基体材料和铜箔之间。 提供一种用于印刷电路板的层间电介质的制造的树脂化合物，所述树脂化合物包括环氧基树脂其包括：具有5至25％（重量）的环氧树脂固化剂的氮; 和具有马来酰亚胺化合物热固性性质，和树脂化合物已furthrt组合物的所有其不含卤素元素。