公开(公告)号：EP2410827A1

公开(公告)日：2012-01-25

申请号：EP10753334.1

申请日：2010-02-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： KATO Noboru

IPC: H05K3/46 ,  H01L23/12 ,  H05K1/02

CPC classification number: H05K1/118 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/141 ,  H05K3/4632 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00

Abstract: A circuit board to be mounted on a printed circuit board and a mother laminated body are provided, the circuit board being capable of suppressing detachment thereof from the printed circuit board even if the printed circuit board is deformed.
A laminated body (11) is configured by induing insulation layers (16) composed of a flexible material that are stacked on one another. External electrodes are provided on a bottom surface of the laminated body (11). Ground conductors (18a, 18b) are provided in the laminated body (11) and harder than the insulation layers (16). The laminated body (11) includes a flexible region (E2) and a rigid region (E1) that is adjacent to the flexible region (E2) when viewed in a plan from a z-axis direction, The rigid region (E1) is defined by the ground conductors (18a, 18b) when viewed in a plan from the z-axis direction, The external electrodes are provided within the flexible region (E2) when viewed in a plan from the z-axis direction.

Abstract translation: 设置安装在印刷电路板和母体层叠体上的电路板，即使印刷电路板发生变形，电路板也能够抑制与印刷电路板的分离。 层叠体（11）通过包含彼此堆叠的由柔性材料构成的绝缘层（16）构成。 外部电极设置在层叠体（11）的底面上。 接地导体（18a，18b）设置在层叠体（11）中并且比绝缘层（16）硬。 层叠体（11）在从z轴方向的平面图中观察时，包括柔性区域（E2）和与柔性区域（E2）相邻的刚性区域（E1）。刚性区域（E1）被限定 通过接地导体（18a，18b）在从z轴方向的平面图中观察时，当从z轴方向的平面图中观察时，外部电极设置在柔性区域（E2）内。

公开(公告)号：EP2227076A4

公开(公告)日：2011-10-12

申请号：EP09815564

申请日：2009-04-24

Applicant: HUAWEI TECH CO LTD

Inventor： HUANG MINGLI ,  ZHANG SHUN ,  YANG XICHEN ,  ZHAO JUNYING ,  LUO BING ,  LI ZHIHAI ,  WANG GUOLIANG

IPC: H05K3/46

CPC classification number: H05K1/0206 ,  H05K1/0204 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/10416 ,  H05K2203/063 ,  Y10T29/49124

公开(公告)号：EP2037723A3

公开(公告)日：2010-12-29

申请号：EP08164448.6

申请日：2008-09-16

Applicant: TridonicAtco Deutschland GmbH

Inventor： Schubert, Gisbert

IPC: H05K3/32

CPC classification number: H05K3/326 ,  F21K9/00 ,  F21Y2115/10 ,  H01R4/2487 ,  H01R25/147 ,  H05K3/308 ,  H05K3/4046 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K2201/10106 ,  H05K2201/10409

Abstract: Eine Basisplatte (21) für ein Leuchtelement (26) insbesondere für die Lichtwerbung weist
- eine erste leitfähige Schicht (23) mit einer ersten Öffnung (32) und eine zweite leitfähige Schicht (24) mit einer zweiten Öffnung (33), und
- eine Isolierschicht (22) zwischen der ersten und der zweiten leitfähigen Schicht (23, 24) auf,

wobei ein erstes Befestigungselement (40) durch die erste Öffnung (32) bzw. ein zweites Befestigungselement (41) durch die zweite Öffnung (33) in die Basisplatte (21) derart einfügbar sind, dass das erste Befestigungselement (40) nur an die zweite leitfähige Schicht (24) bzw. das zweite Befestigungselement (41) nur an die erste leitfähige Schicht (24) elektrisch anschließbar sind.

Abstract translation: 板（21）具有带有开口（33）的导电层（23）和具有另一开口的另一导电层（24）。 绝缘层（22）设置在导电层之间，绝缘层是塑料板。 两个紧固元件（40,41）穿过相应的开口插入，使得紧固元件（40）电连接到导电层（24）和/或电连接到导电层的紧固元件（41） （23）。 导电层由铝构成。 对于照明广告，还包括用于照明的照明信件的独立权利要求。

公开(公告)号：EP1777714B1

公开(公告)日：2010-07-07

申请号：EP06019851.2

申请日：2006-09-22

Applicant: Georgia Tech Research Corporation

Inventor： Wan, Lixi

IPC: H01G4/228 ,  H05K1/00 ,  H01L21/00

CPC classification number: H05K1/162 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/09763 ,  Y10S257/908

公开(公告)号：EP1777744A3

公开(公告)日：2010-05-12

申请号：EP06019852.0

申请日：2006-09-22

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Swaminathan, Madhavan ,  Wan, Lixi ,  Engin, Ege ,  Muthana, Prathap

IPC: H01L23/498 ,  H05K1/16 ,  H01L23/50 ,  H01L23/64

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09763 ,  Y10S257/904 ,  Y10S257/924 ,  H01L2924/00

Abstract: One embodiment of the present invention provides a device for providing a low noise power supply package to an IC in the mid-frequency range of 1 MHz to 3 GHz comprising installing in said package an array of embedded discrete ceramic capacitors (1600), and optionally planar capacitor layers (1500). A further embodiment provides a device for providing a low noise power supply package to an IC in the mid-frequency range of 1 MHz to 3 GHz comprising using an array of embedded discrete ceramic capacitors with different resonance frequencies, arranged in such a way that the capacitor array's impedance vs frequency curve in the critical mid-frequency range yields impedance values at or below a targeted impedance value.

公开(公告)号：EP2048919A4

公开(公告)日：2010-01-06

申请号：EP07767924

申请日：2007-06-29

Applicant: SHINETSU POLYMER CO

Inventor： KAWAGUCHI TOSHIYUKI ,  TAHARA KAZUTOKI ,  SAGA TSUTOMU ,  NEGISHI MITSUAKI

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0191 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2201/093 ,  H05K2201/09309

公开(公告)号：EP1413178B1

公开(公告)日：2010-01-06

申请号：EP02750400.0

申请日：2002-08-02

Applicant: SanDisk Corporation

Inventor： WALLACE, Robert, F.

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0256 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07735 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0259 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/242 ,  H05K2201/0919 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2203/175 ,  H01L2924/00014

Abstract: A card manufacturing technique and the resulting card are provided. The card has a ground and/or power layer (112) extending to the edges of a circuit board for electrostatic discharge protection but also has gaps (112a) at the edge of the ground and/or power layer (112) to avoid short circuiting with conductive segments (160) of another layer deformed when the card is trimmed during manufacture.

公开(公告)号：EP2001676A1

公开(公告)日：2008-12-17

申请号：EP07752177.1

申请日：2007-03-01

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： KANAKARAJAN, Karthikeyan ,  KANAKARAJAN, Kuppusamy ,  MIN, Gary, Yonggang

IPC: B32B27/34 ,  B32B15/088 ,  B32B27/00 ,  H01B3/30 ,  H05K1/03

CPC classification number: H05K1/162 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B2270/00 ,  B32B2457/00 ,  H01B3/306 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/09309 ,  Y10T428/31681

Abstract: The invention is directed to polyimide based materials having improved electrical and mechanical performance, and also to a process of making such materials. The compositions of the invention comprise: i. a polyimide base polymer in an amount of at least 60 weight percent; ii. a discontinuous phase of inorganic material present in an amount of at least 4 weight percent; iii. a non-ionic halogenated dispersing agent in an amount of at least 0.1 weight percent; and iv. up to 30 weight percent of other optional ingredients, such as, fillers, processing aids, colorants, or the like. The compositions of the invention generally exhibit excellent high frequency performance and can be manufactured by incorporating the dispersing agent and inorganic material into a polyamic acid solution and then converting the polyamic acid solution into a polyimide by conventional or non-conventional means.

公开(公告)号：EP1955410A2

公开(公告)日：2008-08-13

申请号：EP06846450.2

申请日：2006-12-04

Applicant: Cisco Technology, Inc.

Inventor： CHENG, Wheling ,  KARAM, Roger ,  CAMERLO, Sergio

IPC: H01R12/04

CPC classification number: H05K1/0222 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/09309 ,  H05K2201/09809 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49162 ,  Y10T29/49165

Abstract: A method of fabricating a printed circuit board having a coaxial via is disclosed. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top signal layer and a bottom signal layer; forming a hollow via through the plurality of layers to connect GND layers in the printed circuit board, forming or inserting into the hollow via a conductor coated with non-conductive material, covering the top layer and bottom layer with dielectric and patterned signal layers, covering the top layer and bottom layer with a masking agent, plating the top layer and bottom layer with a conductive material that connects signal traces within via, and removing the masking agent from the top layer and bottom layer.

公开(公告)号：EP1912227A1

公开(公告)日：2008-04-16

申请号：EP08001701.5

申请日：2006-05-22

Applicant: E.I. du Pont de Nemours and Company

Inventor： The designation of the inventor has not yet been filed

IPC: H01G4/20 ,  C08K3/22 ,  C08L79/08

CPC classification number: H01G4/20 ,  H01G4/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/185 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/107 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/31529 ,  Y10T428/3154 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The invention relates to a process for making a planar capacitor comprising: dispersing a spinel crystal filler, a capacitor filler and optionally a light absorber into an organic solvent to form a dispersion; mixing the dispersion with a polyamic acid to form a mixed polymer blend; casting the mixed polymer blend onto a flat surface to form a polyamic film composite; and applying thermal energy to the polyamic film composite to dry and cure the composite to a filled polyimide film wherein the polyimide film has a dielectric constant between and including any two of the following numbers: 4, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, and 60.

Abstract translation: 本发明涉及一种制造平面电容器的方法，包括：将尖晶石晶体填料，电容器填料和任选的光吸收剂分散在有机溶剂中以形成分散体; 将分散体与聚酰胺酸混合以形成混合的聚合物共混物; 将混合的聚合物共混物浇铸到平坦表面上以形成聚酰胺薄膜复合材料; 以及将热能施加到所述聚酰胺薄膜复合材料上以使所述复合材料干燥并固化至填充的聚酰亚胺薄膜，其中所述聚酰亚胺薄膜的介电常数介于两个以下数字之间：4,5,10,15,20,25， 30，35，40，45，50，55和60。