公开(公告)号：EP1931189B1

公开(公告)日：2009-07-29

申请号：EP06025297.0

申请日：2006-12-07

Applicant: Hekatron Vertriebs GmbH

Inventor： Jäcklin, Samuel

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0039 ,  H05K1/0225 ,  H05K1/0227 ,  H05K1/0234 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09972 ,  H05K2201/10022 ,  H05K2201/10151

公开(公告)号：EP1966616A2

公开(公告)日：2008-09-10

申请号：EP06845970.0

申请日：2006-12-21

Applicant: Micron Technology, Inc.

Inventor： KINSLEY, Thomas

IPC: G01R31/04

CPC classification number: B23K1/0016 ,  G01R31/048 ,  H05K1/0268 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10734 ,  H05K2203/163 ,  H05K2203/175 ,  Y02P70/611 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed.

公开(公告)号：EP1827062A3

公开(公告)日：2008-08-20

申请号：EP07002932.7

申请日：2007-02-12

Applicant: Denso Corporation

Inventor： Ito, Atsushi ,  Honda, Takayoshi

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/114 ,  H05K3/341 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/09709 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: In an electronic device , a QFN is surface-mounted on a printed board . The QFN includes a main body containing an IC chip , a reinforcement portion , and multiple terminal portions . The reinforcement portion is exposed from a bottom portion of the main body and mechanically coupled with multiple reinforcement lands on the printed board. The multiple terminal portions are exposed from a peripheral of the main body and electrically coupled with multiple lands on the printed board. In the printed board, the multiple lands are connected with multiple conductive wires Some of the multiple conductive wires are outside of the surface-mounted area . The others are inside of the surface-mounted area to face the reinforcement lands. This enhances a mounting efficiency in the printed board.

公开(公告)号：EP1938674A2

公开(公告)日：2008-07-02

申请号：EP06826319.3

申请日：2006-10-20

Applicant: McKinzie, William E. III.

Inventor： McKinzie, William E. III.

IPC: H05K1/02

CPC classification number: H01P1/20 ,  H01P1/2005 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0236 ,  H05K1/0239 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09609 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09718 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression of electromagnetic noise.

公开(公告)号：EP1742521A1

公开(公告)日：2007-01-10

申请号：EP06253437.5

申请日：2006-06-30

Applicant: NITTO DENKO CORPORATION

Inventor： Ishimaru, Yasuto ,  Nakamura, Kei

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H01L2924/0002 ,  H05K1/056 ,  H05K1/118 ,  H05K3/0061 ,  H05K2201/09663 ,  H05K2201/2009 ,  H01L2924/00

Abstract: In an outer lead portion (20), outer lead wirings (2a) are provided on one surface of a base insulating layer (1) and a plurality of metal substrates (7) are provided on the opposite surface thereof. The plurality of metal substrates are provided with predetermined spacings therebetween. The outer lead wirings (2a) are not provided on the areas on the surface opposite to the areas on the other surface of the base insulating layer (1) on which the slits (9) are provided between the metal substrates. Metals such as stainless steel, copper or copper alloy can be used for the metal substrates. Coefficient of linear expansion of each metal substrate is preferably equal to that of the base insulating layer.

Abstract translation: 在外引线部分（20）中，外引线配线（2a）设置在基绝缘层（1）的一个表面上，并且在其相对表面上设置多个金属基片（7）。 多个金属基板之间设置有预定间隔。 外引线配线（2a）没有设置在与在金属基板之间设置有狭缝（9）的基底绝缘层（1）的另一个表面上的区域相对的表面上的区域上。 可以将金属如不锈钢，铜或铜合金用于金属基材。 每个金属基底的线性膨胀系数优选等于基底绝缘层的线膨胀系数。

公开(公告)号：EP1630592A1

公开(公告)日：2006-03-01

申请号：EP05107021.7

申请日：2005-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Park, Hee-bum ,  Kim, Ock-jin 204-1303 Raemian 2-cha APT ,  Park, Jin-ho ,  Lee, Kwang-soo

IPC: G02F1/13 ,  H05K3/32

CPC classification number: G02F1/13452 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09663 ,  H01L2924/00

Abstract: A liquid crystal display device includes a liquid crystal panel (211) including a pad electrode (222), a tape circuit substrate and an anisotropic conductive film (130). The pad electrode receives one of a driving signal and a power supply voltage signal. The tape circuit substrate includes a base film (110) made of an insulating material, and a signal line (122) formed on the base film and having a slit at a portion of the signal line which overlaps the pad electrode of the liquid crystal panel. The anisotropic conductive film connects the outer lead with the pad electrode.

Abstract translation: 液晶显示装置包括液晶面板（211），其包括焊盘电极（222），带电路基板和各向异性导电膜（130）。 焊盘电极接收驱动信号和电源电压信号中的一个。 带状电路基板包括由绝缘材料制成的基膜（110）和形成在基膜上的信号线（122），并且在信号线的与液晶板的焊盘电极重叠的部分处具有狭缝 。 各向异性导电膜将外引线与焊盘电极连接。

公开(公告)号：EP1337134A3

公开(公告)日：2005-05-04

申请号：EP03250776.6

申请日：2003-02-07

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Hirose, Yoshitaka, c/o Alps Electric Co., Ltd.

IPC: H05K1/11 ,  H05K3/34 ,  H01L23/498

CPC classification number: H01L23/49816 ,  H01L2224/16 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2203/041 ,  Y02P70/611

Abstract: The present invention intends to provide a terminal structure strong in the peel strength of a land portion and a ball. In a terminal structure according to the invention, a land portion (2) includes a terminal portion for soldering a ball (7) ; a support portion (4) disposed in the neighborhood of an outer periphery portion of the terminal portion; and a link portion (5) for linking the terminal portion and the support portion; and wherein on a base material, with an entirety of the terminal portion including an edge portion located in the outer periphery portion of the terminal portion exposed, an insulating layer (6) is disposed so as to cover the support portion; and with a solder straddled a surface and an edge portion of the terminal portion, the ball is soldered to the terminal portion. Accordingly, the terminal structure that is large in the peel strength of the ball from the terminal portion and of the terminal portion from the base material can be obtained.

公开(公告)号：EP1227578A3

公开(公告)日：2004-09-22

申请号：EP02001173.0

申请日：2002-01-28

Applicant: Kabushiki Kaisha Toshiba

Inventor： Seshita, Toshiki

IPC: H03F1/26 ,  H05K1/02 ,  H03F3/19

CPC classification number: H05K1/0237 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1305 ,  H01L2924/13091 ,  H03F3/601 ,  H05K1/0231 ,  H05K1/114 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A node for commonly supplying a ground potential in an amplification circuit (MMIC11) is formed. The input and output system ground surfaces of a printed wiring board (PWB) on which the amplification circuit (MMIC11) is to be mounted are electrically separated from each other on the printed wiring board (PWB). Since no ground pattern is present on the amplification circuit (MMIC11), the ground node of the amplification circuit (MMIC11) serves as a means for supplying a true ground potential. While a compact package is realized by preventing an increase in number of leads, oscillation is prevented, so a high gain can be realized.

公开(公告)号：EP1430756A1

公开(公告)日：2004-06-23

申请号：EP02773693.3

申请日：2002-09-30

Applicant: INTEL CORPORATION

Inventor： MCCORMICK, Carolyn ,  SATO, Daryl ,  BOGGS, David ,  JESSUP, Rebecca ,  DUNGAN, John

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3436 ,  H01L2924/15151 ,  H05K1/113 ,  H05K1/116 ,  H05K3/0094 ,  H05K2201/09381 ,  H05K2201/0959 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613

Abstract: An apparatus that includes a substrate, one or more via in pads (202) in the substrate; and one or more vents (204) in at least one of the one or more via in pads (202).

公开(公告)号：EP1047146A3

公开(公告)日：2002-03-13

申请号：EP00108262.7

申请日：2000-04-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hidaka, Seiji, c/o (A170) Intell. Prop. Dept. ,  Ota, Michiaki c/o (A170) Intell. Prop. Dept. ,  Abe, Shin c/o (A170) Intell. Prop. Dept.

IPC: H01P1/203 ,  H01P3/08 ,  H01P7/08

CPC classification number: H01P3/081 ,  H01P1/203 ,  H01P1/2039 ,  H01P7/082 ,  H05K1/0239 ,  H05K1/0242 ,  H05K2201/09254 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09781

Abstract: A transmission line, a resonator, a filter, a duplexer, and a communication apparatus efficiently minimize power losses due to edge effects, thereby having superior loss-reduction characteristics. A continuous line (12) and a plurality of thin lines (2) each having a predetermined length and branching from both sides of the continuous line (12) are formed on a dielectric substrate (1). According to this, substantial edges of the individual thin lines (2) do not exist, and losses due to edge effects can be efficiently minimized.

Abstract translation: 传输线具有一条连续线（12）和几根细长线（2），每根细长线从连续线分支，每条线具有预定长度。 细线的分支方向相对于连续线倾斜。 所有细线连接，而连续线连接每条细线的相同部分。