公开(公告)号：EP0918355A3

公开(公告)日：2001-04-25

申请号：EP98203298.9

申请日：1998-09-29

Applicant: Delphi Technologies, Inc.

Inventor： Cornell, Ralph Edward ,  Erickson, Curtis A. ,  Vaidyanthan, Aparna

IPC: H01L23/485

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A surface mount circuit device (110), such as a flip chip, of the type which is attached to a conductor pattern (126) with solder bump connections (120). The solder bump connections (120) are formed by reflowing solder on shaped input/output pads (112) on the device (110), with the shape of the pads (112) being tailored to favorably affect optimal distribution, shape and height of the solder bump connections (120) following reflow soldering of the device (110) to the conductor pattern (126). The solder bump connections (120) are preferably characterized by a shape that increases the stand-off height of the device (110). The shaped solder bump connections (120) also promote stress relief during thermal cycling, improve mechanical bonding, allow better penetration of cleaning solutions, and improve flow of encapsulation materials between the device (110) and its substrate (122).

Abstract translation: 一种表面安装电路器件（110），例如倒装芯片，其类型被连接到具有焊料凸点连接（120）的导体图案（126）上。 焊料凸块连接（120）通过在装置（110）上的成形输入/输出垫（112）上回流焊料形成，其中衬垫（112）的形状被定制以有利地影响最佳分布，形状和高度 在器件（110）回流焊接到导体图案（126）之后的焊料凸点连接（120）。 焊料凸点连接（120）的特征在于增加了装置（110）的支座高度的形状。 成形的焊料凸点连接（120）还促进热循环期间的应力消除，改善机械粘合，允许更好地渗透清洁溶液，并改善装置（110）和其基板（122）之间的封装材料的流动。

公开(公告)号：EP1037512A2

公开(公告)日：2000-09-20

申请号：EP00105207.5

申请日：2000-03-13

Applicant: MOLEX INCORPORATED

Inventor： Brunker, David L.

IPC: H05K1/02 ,  H01B7/08

CPC classification number: H05K1/0228 ,  H01B7/0876 ,  H05K1/0219 ,  H05K1/0245 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/097

Abstract: A flexible circuit member includes first and second pseudo-twisted flexible conductors on a flexible dielectric substrate. The first pseudo-twisted conductor is on a first side of the substrate and the second pseudo-twisted conductor is on a second side of the substrate. Each pseudo-twisted conductor includes a periodic pattern with the first pseudo-twisted conductor being shifted longitudinally relative to the second pseudo-twisted conductor by one half of a period of the periodic pattern. A set of first and second additional conductors are also provided on the dielectric substrate. The first additional conductor is on the first side of the substrate and is spaced from and generally follows the shape of the first pseudo-twisted conductor. The second additional conductor is on the second side of the substrate and is spaced from and generally follows the shape of the second pseudo-twisted conductor. These first and second additional conductors may be coupled to reference or ground potential so as to provide a grounding system for the flexible circuit member.

Abstract translation: 柔性电路构件包括在柔性电介质衬底上的第一和第二伪扭绞柔性导体。 第一伪扭绞导体位于衬底的第一侧上，第二伪扭绞导体位于衬底的第二侧上。 每个假捻导体包括周期性图案，其中第一伪扭绞导体相对于第二假捻导体纵向移动周期图案周期的一半。 一组第一和第二附加导体也设置在电介质基片上。 第一附加导体位于衬底的第一侧上，并且与第一假捻导体的形状间隔开并且大致遵循形状。 第二附加导体位于衬底的第二侧上，并且与第二假捻导体的形状间隔开并且大体上遵循第二伪导体的形状。 这些第一和第二附加导体可以耦合到参考或接地电位，以便为柔性电路构件提供接地系统。

公开(公告)号：EP0828291A2

公开(公告)日：1998-03-11

申请号：EP97202495.4

申请日：1997-08-12

Applicant: DELCO ELECTRONICS CORPORATION

Inventor： Drake, Jacquelynn Kay ,  Knigga, Bradley Ray

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L23/49827 ,  H01L21/4803 ,  H01L21/486 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2203/0511

Abstract: A process for developing fine pitch vias in a dielectric material, such as thick-film and tape dielectrics, and dielectric materials formed thereby. Via formation is particularly amenable to diffusion patterning techniques, in which an imaging material is deposited in the form of complementary interdigitized shapes that maximize image material volume in order to form vias that extend completely through the dielectric material, while also assuring sufficient via spacing to prevent merging of adjacent vias during imaging. A preferred shape for the resulting diffusion-imaged vias, and therefore the deposited imaging material, is triangular, with the orientation of adjacent triangles being such that spacing between the deposited imaging material is comparable to the spacing between conductor traces associated with the resulting vias.

Abstract translation: 如厚膜和磁带介质，以及由此形成的介电材料：一种用于开发在介电材料，彩色细间距的通孔的过程。 通过形成特别适合于扩散图案化技术，在其中成像材料在互补interdigitized形状的形式被沉积做最大化，以便形成通孔并穿过所述介电材料，完全延伸呼叫这样同时确保经由间距，以防止足够的图像材料体积 在成像期间相邻的通孔的合并。 对于所得到的扩散成像导通孔优选的形状，因此所沉积的成像材料，是三角形的，与被检查相邻三角形的取向做沉积成像材料之间的间隔是与用所得到的导通孔相关联的导体迹线之间的间距。

公开(公告)号：EP0650318B1

公开(公告)日：1996-12-27

申请号：EP94402328.2

申请日：1994-10-18

Applicant: SUMITOMO WIRING SYSTEMS, LTD.

Inventor： Nakanishi, Ryuji, c/o Sumitomo Wiring Systems Ltd.

IPC: H05K9/00

CPC classification number: H05K9/0039 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/0262 ,  H05K1/118 ,  H05K1/142 ,  H05K1/144 ,  H05K2201/048 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/09263 ,  H05K2201/097 ,  Y10T29/49124

公开(公告)号：EP0237176A3

公开(公告)日：1988-12-28

申请号：EP87301030

申请日：1987-02-05

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Hagiwara, Yoshichi c/o Minnesota Mining and ,  Hirasawa, Yuji c/o Minnesota Mining and ,  Kimura, Naoya c/o Minnesota Mining and ,  Emori, Kenji c/o Minnesota Mining and ,  Kawamoto, Yoshitaka c/o Minnesota Mining and

IPC: H05K01/11

CPC classification number: H05K3/361 ,  H01R43/007 ,  H05K3/305 ,  H05K2201/097 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: The present invention provides a connector comprising conductive passages which are at least partially of 0.5 mm or less in width, the fine pitched conductive passages are formed on a base film and coated by substantially insulative adhesive melting at lower temperatures than that of the base film. The conductive passages preferably contain fine convexes and concaves on their surfaces and preferably are made of a metallic material. The present invention also provides a method for making electrical connection by heating and pressing two pairs of diametrically opposed connectors of the present invention by use of substantially insulative adhesive by providing the adhesive between diametrically opposed connectors.

公开(公告)号：EP2948074B1

公开(公告)日：2018-09-19

申请号：EP14706985.0

申请日：2014-01-24

Applicant: Medtronic Xomed, Inc.

Inventor： JACOBSEN, Brad ,  BURG, Bruce M. ,  BLOCK, Orey G. ,  BZOSTEK, Andrew ,  DOERR, Vince J. ,  JAIN, Abhishek ,  MERKL, Brandon ,  CILKE, Joseph Thomas

IPC: A61B17/24 ,  A61B34/20 ,  H05K1/03

CPC classification number: H05K3/34 ,  A61B17/24 ,  A61B34/20 ,  A61B2017/00862 ,  A61B2017/00946 ,  A61B2034/2051 ,  H05K1/0245 ,  H05K1/118 ,  H05K2201/051 ,  H05K2201/056 ,  H05K2201/097 ,  H05K2201/10287

Abstract: A surgical instrument (100) is disclosed having an elongated body portion (126) having a proximal end and a distal end. The body portion is formed from a plastically deformable material such that the body portion can be bent between the proximal and distal ends from a first configuration to a second bent configuration and maintains the bent configuration. A flexible circuit sheet (232) having at least a pair of lead wires (236) disposed around the body portion. The pair of lead wires are configured to conform to the bent configuration of the body portion such that they do not break during bending of the body portion. A tracking device (84) adapted to cooperate with a navigation system (10) to track the distal end of the instrument (100) is coupled to the flexible circuit.

公开(公告)号：EP2608643A1

公开(公告)日：2013-06-26

申请号：EP11250939.3

申请日：2011-12-23

Applicant: British Telecommunications public limited company

Inventor： The designation of the inventor has not yet been filed

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/02 ,  H01B7/08 ,  H01P3/04

CPC classification number: H01B7/0846 ,  H05K1/0242 ,  H05K1/0245 ,  H05K3/103 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/097 ,  H05K2203/1545

Abstract: The present invention discloses a new and inventive cable structure and a method for manufacturing such a cable. The cable (100) has a planar form and comprises one or more pairs of carbon nanotube wires (120). The cable has an adhesive surface such that it can be readily installed (and subsequently repositioned) within a domestic, or commercial, premises. Such a cable would enable in premises transmission of very high bit-rate data without the disadvantages associated with structured cables and wiring.

Abstract translation: 本发明公开了一种新的和本发明的电缆结构及其制造方法。 电缆（100）具有平面形式并且包括一对或多对碳纳米管线（120）。 电缆具有粘合剂表面，使得其可以容易地安装（并随后重新定位）在家庭或商业场所内。 这样的电缆将能够实现非常高比特率数据的处理传输，而没有与结构化电缆和布线相关联的缺点。

公开(公告)号：EP2566307A2

公开(公告)日：2013-03-06

申请号：EP12005825.0

申请日：2012-08-10

Applicant: Eppendorf AG

Inventor： Reichmuth, Burkardt

IPC: H05K1/02 ,  B01L3/02 ,  G01F11/02 ,  H05K1/03

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument (200) with a cable holding space (185) in which a printed circuit board cable device (100) is arranged, more particularly to a dispenser or a pipette. The printed circuit board cable device has at least one printed circuit board (102), which has a first and a second side of the board, and, arranged in succession, at least one first printed circuit board section (A), at least one second printed circuit board section (B) and at least one third printed circuit board section (C), with the printed circuit board having a number of conductor tracks (121,122) which, at least in sections, are arranged parallel with respect to one another on the printed circuit board and extend from a first track section, which is arranged in the first printed circuit board section, via the second printed circuit board section to the third printed circuit board section, in which a second track section is arranged, wherein, in the second printed circuit board section, at least one conductor track (121a, 122a) is arranged on the first side of the board and at least one conductor track (121b, 122b) is arranged on the second side of the board.

Abstract translation: 本发明涉及具有电缆保持空间（185）的实验室样品仪器（200），其中布置有印刷电路板电缆装置（100），更具体地涉及一种分配器或移液器。 所述印刷电路板电缆装置具有至少一个印刷电路板（102），所述印刷电路板具有所述板的第一和第二侧，并且依次配置有至少一个第一印刷电路板部分（A），至少一个 第二印刷电路板部分（B）和至少一个第三印刷电路板部分（C），其中印刷电路板具有多个导体轨道（121,122），其至少部分地相对于彼此平行布置 在印刷电路板上并且经由第二印刷电路板部分从布置在第一印刷电路板部分中的第一轨道部分延伸到布置有第二轨道部分的第三印刷电路板部分， 在第二印刷电路板部分中，至少一个导体轨道（121a，122a）布置在板的第一侧上，并且至少一个导体轨道（121b，122b）布置在板的第二侧上。

公开(公告)号：EP2259312A1

公开(公告)日：2010-12-08

申请号：EP09164685.1

申请日：2009-07-06

Applicant: Walton Advanced Engineering Inc.

Inventor： Yu, Hong-Chi

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01R13/2442 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/097 ,  H05K2201/10189 ,  H05K2201/10424 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An inversely alternate stacked structure of integrated circuit (IC) modules includes at least one IC module (10), and at least a spring strip set (20). The IC module contains a substrate (11), at least an IC chip and a molding body, in which the substrate has an inner surface (111) and an outer surface (112), at least an external contact pad (113) is provided on one end of the outer surface, and at least a switch contact pad (114) is provided on the other end of the outer surface, the external contact pad and the switch contact pad are disposed in an inversely symmetrical manner. The spring strip set (20) has at least a non-flat structure (21). The external contact pad (113) of an IC module is electrically connected with the switch contact pad (114) of another IC module via the electrical contact of the non-flat structure (21) so that the IC modules are integrated to form an inversely alternate stacked structure.

Abstract translation: 集成电路（IC）模块的反交替层叠结构包括至少一个IC模块（10）和至少一个弹簧条组（20）。 IC模块包含至少一个IC芯片和成型体的基片（11），其中基片具有内表面（111）和外表面（112），至少提供一个外部接触垫（113） 在外表面的一端上，并且在外表面的另一端上设置至少一个开关接触垫（114），外部接触垫和开关接触垫以相反对称的方式设置。 弹簧带组20至少具有非平面结构21。 IC模块的外部接触焊盘（113）经由非平面结构（21）的电接触与另一个IC模块的开关接触焊盘（114）电连接，使得IC模块被集成以形成反向 交替堆叠结构。

公开(公告)号：EP1865757A1

公开(公告)日：2007-12-12

申请号：EP06290932.0

申请日：2006-06-06

Applicant: Alcatel Lucent

Inventor： Fossion, Marc Jean Joseph ,  Fossion, Stéphanie Cécile Marie

IPC: H05K1/02

CPC classification number: H05K1/0228 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/097

Abstract: A Printed Circuit Board PCB provided with several pairs (P1; P2) of parallel wires (1a, 1b; 2a, 2b) carrying differential signals and following a same path from a start area (A) to an end area (B) on the PCB. The wires (1a, 1b) of at least one (P1) of the differential pairs are constituted by several consecutive sections (S1 to S5) and between each consecutive sections, the two wires of the pair are twisted on the PCB. In a first implementation of the invention, the two wires of the differential pair are located on a same layer (L1) of the PCB. In that case, a first (1a) of the two wires crosses the second wire (1b) by means of a bypass or via (V1 - V4) on a second layer (L2) of the PCB, alternatively between each consecutive sections (S1 - S5). In a variant or second implementation of the invention, the first wire (1a) and the second wire (1b) of a same pair (P1) are located on distinct layers (L1, L2) of said PCB. in that case, each wire changes of layer at each consecutive section intersection.

Abstract translation: 印刷电路板PCB，其具有承载差分信号的数个对（P1; P2）的并行线（P1; P2），并沿着与起始区域（A）到端部区域（B）相同的路径 PCB。 差分对的至少一个（P1）的导线（1a，1b）由几个连续的部分（S1至S5）构成，并且在每个连续的部分之间，该对的两条线在PCB上扭曲。 在本发明的第一实施方案中，差分对的两条导线位于PCB的同一层（L1）上。 在这种情况下，两条线中的第一（1a）通过PCB上第二层（L2）上的旁路或通路（V1-V4）交替穿过第二线（1b），或者在每个连续的部分（S1 - S5）。 在本发明的变型或第二实施方案中，同一对（P1）的第一线（1a）和第二线（1b）位于所述PCB的不同层（L1，L2）上。 在这种情况下，每条线在每个连续的部分交点处改变层。