公开(公告)号：EP0083503A2

公开(公告)日：1983-07-13

申请号：EP82306966.1

申请日：1982-12-24

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. ,  Berg, James G.

IPC: H01R4/04

CPC classification number: H05K3/323 ,  H01L2924/0002 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/09945 ,  H05K2201/1025 ,  H05K2203/1189 ,  H01L2924/00

Abstract: A sheet material for providing electrical connections is provided which gives the needed degree of stability and low resistance with simplicity of application. Electrically conducted elements are dispersed in a polymeric layer and an adhesive is provided which is either the material of the layer or a coating over the elements which adhesive is non-tacky at room temperature but softens upon heating while reverting to a nonflowable condition on cooling. The electrically conductive elements can protrude above the surface of the polymer in which they are embedded. Electrically conductive layers can be provided over portions of the sheet with the polymeric layer containing electrically conductive elements extending over the whole of the sheet or over only those portions having electrically conductive lower layers.

Abstract translation: 提供一种用于提供电连接的片材，其提供了所需的稳定性和低电阻，并且应用简单。 电导体元件分散在聚合物层中，并且提供粘合剂，其是层的材料或元件上的涂层，所述粘合剂在室温下是非粘性的，但在加热时软化，同时在冷却时还原为不可流动的状态。 导电元件可以突出在其嵌入其中的聚合物的表面之上。 可以在片材的一部分上提供导电层，聚合物层包含在整个片材上延伸的导电元件，或仅在具有导电下层的那些部分上。

公开(公告)号：EP3386278A1

公开(公告)日：2018-10-10

申请号：EP17382183.6

申请日：2017-04-06

Applicant: Valeo Iluminacion

Inventor： ROLDAN, Jose-David ,  LARA-CABEZA, Juan ,  MARTINEZ-PEREZ, Jose-Ramon ,  BORREGO, Maria-Luisa

IPC: H05K1/02 ,  F21S8/10

CPC classification number: H05K1/0295 ,  F21S41/141 ,  H05K1/0206 ,  H05K2201/09945 ,  H05K2201/10106

Abstract: This invention relates to a printed circuit board (1) for an automated vehicle lighting device (10). This printed circuit board (1) comprises a first face (11), a second face (12) opposite to the first face (11), a first connection point (3) and a second connection point (4). The first connection point (3) is located on the first face (11) and is suitable for installing a light source (2), and the second connection point (4) is located on the second face (12) and is suitable for installing a light source (2).

公开(公告)号：EP3054543B1

公开(公告)日：2018-06-20

申请号：EP14860440.8

申请日：2014-10-15

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： HACHIYA, Yoshikazu

IPC: H02G3/08 ,  B60R16/03 ,  H05K1/02 ,  H05K3/46 ,  B60R16/023 ,  H05K3/10 ,  H05K3/22 ,  H05K3/24

CPC classification number: B60R16/03 ,  B60R16/0239 ,  H02G3/081 ,  H02G3/088 ,  H05K1/0256 ,  H05K1/0265 ,  H05K3/103 ,  H05K3/24 ,  H05K3/4617 ,  H05K3/4626 ,  H05K2201/09063 ,  H05K2201/09945 ,  H05K2201/10272

Abstract: Provided is an electrical junction box having a novel structure capable of preventing vehicle fire after the infiltration of water without depending on a waterproofing structure of the electrical junction box. An electrical junction box (10) includes a bus bar circuit unit (12) obtained by arranging a plurality of bus bars (28a to 28g) including a power source-side bus bar (28c) to be connected to a power source line and a ground-side bus bar (28d) to be connected to a ground line on insulated boards (26a, 26b). In the electrical junction box (10), the power source-side bus bar (28c) and the ground-side bus bar (28d) are arranged adjacent to each other, and an oxide deposition inhibiting structure (42) is provided in exposed portions (44a to 44c) of the insulated board (26a) exposed through a gap between the power source-side bus bar (28c) and the ground-side bus bar (28d).

公开(公告)号：EP0691660B1

公开(公告)日：2006-11-15

申请号：EP95303147.3

申请日：1995-05-10

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Goto, Yasushi ,  Tsukagoshi, Isao ,  Ohta, Tomohisa

IPC: H01B1/22 ,  C09J7/02

CPC classification number: H01R13/2414 ,  C09J7/20 ,  C09J9/02 ,  H01B1/22 ,  H01L2224/11003 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01R4/04 ,  H05K3/102 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09945 ,  H05K2203/0307 ,  H05K2203/0338 ,  H01L2924/00

Abstract: Anisotropically electroconductive resin film material, produced by adhering electroconductive particles to an adhering layer formed on a support and fixing therein, and introducing a film-forming resin incompatible with the adhering material between the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

公开(公告)号：EP0709886B1

公开(公告)日：2000-06-28

申请号：EP95402404.8

申请日：1995-10-26

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： Caillat, Patrice

IPC: H01L23/498 ,  H01L23/492

CPC classification number: H01L21/6835 ,  H01L23/4922 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/4038 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/0733 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2848 ,  H01L2924/00

公开(公告)号：EP0863550A3

公开(公告)日：1999-01-07

申请号：EP98300813.7

申请日：1998-02-04

Applicant: W.L. GORE & ASSOCIATES, INC.

Inventor： Meola, Carmine G. ,  Johnson, Daniel D. ,  Banks, Donald R. ,  Ameen, Joseph G.

IPC: H01L23/498

CPC classification number: H05K3/3436 ,  H01L23/145 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K3/4038 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09945 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24826 ,  Y10T428/249958 ,  Y10T428/31544

Abstract: A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of the substrate to the other side. Each conductive pathway terminates in a solder covered surface area.

公开(公告)号：EP0855049A1

公开(公告)日：1998-07-29

申请号：EP97938107.0

申请日：1997-08-01

Applicant: LOCTITE (IRELAND) LIMITED ,  LOCTITE CORPORATION

Inventor： MCARDLE, Ciaran, B. ,  BURKE, Joseph ,  WELCH, Edward, K.

IPC: G03F7 ,  H01R4 ,  H05K3

CPC classification number: H05K3/323 ,  G03F7/34 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01R4/04 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/0769 ,  H05K2203/104 ,  Y10T428/26 ,  H01L2924/00

Abstract: The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses, as well as films containing such arrays and recesses. The present invention also relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable or non-curing/non-solidifiable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between leads or pads.

公开(公告)号：EP0619935B1

公开(公告)日：1998-05-13

申请号：EP93902885.8

申请日：1992-12-30

Applicant: TESSERA, INC.

Inventor： DISTEFANO, Thomas, H. ,  KHANDROS, Igor ,  GRUBE, Gary, W. ,  EHRENBERG, Scott, G.

IPC: H05K1/00 ,  H05K3/02 ,  H01K3/10 ,  H01L23/538 ,  H05K3/46

CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0298 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2203/175 ,  H01L2924/00

Abstract: A multi-layer circuit panel assembly is formed by laminating circuit panels (10) with interposers (12) incorporating flowable conductive material (48) at interconnect locations and a flowable dielectric material (30, 38) at other locations. Excess materials are captured in reservoirs (20) in the circuit panels. The flowable materials and reservoirs allow the interposers to compress and take up tolerances in the components. The stacked panels may have contacts (538) on their top surfaces, through conductors (527) extending between top and bottom and terminals (530) connected to the bottom end of each through conductor. The terminals and contacts are nonselectively connected to one another at each interface so that wherever a terminal and contact an adjacent panels are aligned with one another, these are connected to one another. This forms composite vertical conductors extending through a plurality of the panels. The selective treatment of the panel top and bottom surfaces provides selective interruptions in the vertical conductors.

公开(公告)号：EP0737375A1

公开(公告)日：1996-10-16

申请号：EP95901946.0

申请日：1994-11-15

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： KOSKENMAKI, David, C. ,  CALHOUN, Clyde, D.

IPC: H01R11 ,  H01R4 ,  H01R13 ,  H05K3

CPC classification number: H01R13/2414 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/104 ,  Y10T428/1452 ,  Y10T428/25 ,  Y10T428/28

Abstract: The present invention provides electrically conductive sheet materials (10) that contain columns of electrically conductive particles aligned to form continuous columns (19) between lateral faces of the conductive sheet material (10). The particle columns (19) are arranged so that the sheet is conductive through the thickness, but is electrically insulating in lateral directions. The present invention also provides methods by which such electrically conductive sheet materials (10) can be made. The present invention is able to provide conductive pathways in a precise, regular array, at a very fine pitch.

公开(公告)号：EP0620702A2

公开(公告)日：1994-10-19

申请号：EP94810179.5

申请日：1994-03-23

Applicant: DYCONEX PATENTE AG

Inventor： Schmidt, Walter ,  Martinelli, Marco

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K1/0287 ,  H05K3/0041 ,  H05K3/06 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/068 ,  H05K2203/1476

Abstract: Der erfindungsgemässe Kern für elektrische Verbindungssubstrate, insbesondere für Leiterplatten und Folienleiterplatten, weist eine Innenschicht (I) mit einer Säulenstruktur auf und beidseitige, metallische Deckschichten (A, A'), wobei die Säulenstruktur der Innenschicht (I) aus vorteilhafterweise regelmässig angeordneten, voneinander und von den Deckschichten (A, A') beabstandeten, quer zur flächigen Ausdehnung des Kerns gerichteten Säulen (9.1, 9.2) aus einem elektrisch leitenden Material in einer Matrix (6) aus einem elektrisch isolierenden Material besteht. Die Deckschichten (A, A') weisen beispielsweise elektrische Anschlüsse (16, 16', 17, 17') in Form von durchplattierten Sacklöchern (13, 14) an ausgewählte Säulen (9) der Innenschicht (I) auf und sind derart strukturiert, dass sie ein regelmässiges Muster von Anschlüssen (16, 16') an die gegenüberliegende Deckschicht und Anschlüssen (17, 17') an von den Deckschichten isolierte Durchsteiger aufweisen. Dieses Rastermuster kann ein Rastermass in der Gegend von 0,5 mm aufweisen.

Abstract translation: 芯雅丁到本发明的用于电互连衬底，爱特别是对于印刷电路板和柔性印刷电路板，具有内层（I），其具有柱状结构和金属覆盖层（A，A“）上bothsides，列结构 这有利地规则地排列在内层（I）组成的柱（9.1，9.2）的，彼此并从覆盖层（A，A“）相对于横向于所述芯的平面范围间隔开的 并且由在由电绝缘材料制成的基体（6）的导电材料制成。 覆盖层（A，A '）有，例如，电连接（16，16'，17，17“）在镀通盲孔的形式（13，14）在所述内的选择的列（9） 层（I）和在寻求一种方式thatthey具有连接（16，16“），以相反的覆盖层和连接（17，17”）的规则图案被构造成通过连接器其由（由）的绝缘 覆盖层。 这种网格图案可以有大约0.5毫米的网格大小。