公开(公告)号：EP2225921A1

公开(公告)日：2010-09-08

申请号：EP08856222.8

申请日：2008-11-28

Applicant: Hypercom GmbH

Inventor： RUDOLPH, Tom

IPC: H05K1/02 ,  G06F21/00 ,  G08B13/12

CPC classification number: H05K5/0208 ,  G06F21/86 ,  H05K1/0275 ,  H05K2201/09263 ,  H05K2201/0999 ,  H05K2201/10151

Abstract: The invention relates to a safety cap arrangement and a corresponding retaining device, wherein a space 3 to be protected against manipulation is encompassed by a board 5 and a safety cap 9. A protective circuit 13 is present in the space 3 to be protected and is connected to the pattern of conductors provided on the safety cap 9 and can detect a change in the electric characteristics of said conductors. Areas of the safety cap 9 that are particularly sensitive to an attack from the outside are to be additionally secured by a cover element 11 made of a brittle material. The cover element 11 comprises an additional fine pattern of conductors also connected to the protective circuit 3. Due to the brittleness of the carrier material of the cover element 11, said element cannot be attacked using mechanical means without resulting in the breakage of the cover element 11, and thus to an interruption of the conductors present thereon.

公开(公告)号：EP2059100A4

公开(公告)日：2010-07-21

申请号：EP07744769

申请日：2007-06-06

Applicant: NIPPON MEKTRON KK

Inventor： MIYAHARA SEIICHIRO

IPC: H05K1/02

CPC classification number: H05K1/025 ,  H05K1/028 ,  H05K2201/09263 ,  H05K2201/09281

公开(公告)号：EP1768470A4

公开(公告)日：2010-03-03

申请号：EP05751207

申请日：2005-06-09

Applicant: IBIDEN CO LTD

Inventor： MIKADO YUKINOBU ,  SAGISAKA KATSUMI ,  KAWAGUCHI KATSUO ,  MURAKI TETSUYA

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/0281 ,  H05K1/0366 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4691 ,  H05K2201/09263 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/2009 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/31663

公开(公告)号：EP1376736B1

公开(公告)日：2009-08-05

申请号：EP03012278.2

申请日：2003-06-11

Applicant: HARRIS CORPORATION

Inventor： Rumpf, Raymond Charles ,  Killen, William Dean ,  Pike, Randy T.

IPC: H01P1/02

CPC classification number: H01P5/02 ,  H01P1/02 ,  H05K1/024 ,  H05K1/165 ,  H05K2201/0187 ,  H05K2201/09263 ,  H05K2201/09727

公开(公告)号：EP2058861A1

公开(公告)日：2009-05-13

申请号：EP07805967.2

申请日：2007-08-22

Applicant: Daikin Industries, Ltd.

Inventor： SEKIMOTO, Morimitsu ,  HAGA, Hitoshi ,  SAKAKIBARA, Kenichi ,  KAWASHIMA, Reiji ,  MECHI, Abdallah ,  MAEDA, Toshiyuki

IPC: H01L25/07 ,  H01L23/34 ,  H01L25/18 ,  H02M1/00

CPC classification number: H01L25/16 ,  H01L23/647 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/4899 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/141 ,  H05K1/18 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/09972 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2203/081 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In the case where a chip is made of wide band gap semiconductor, a power conversion apparatus is obtained in which a component having a low heat resistant temperature is prevented from receiving thermal damage by heat generated at the chip. In a configuration including: a chip portion (20) including a chip (21) made of wide band gap semiconductor and a member (22, 23) having a heat resistant temperature equal to or higher than that of the chip (21); and a peripheral component (25) arranged in the vicinity of the chip portion (20) and having a heat resistant temperature lower than that of the chip (21). The chip (21) and the peripheral component (25) are thermally insulated from each other so that the temperature of the peripheral component (25) does not exceed the heat resistant temperature of the peripheral component (25).

Abstract translation: 在芯片由宽带隙半导体制成的情况下，可以获得能够防止耐热温度低的部件受到芯片产生的热量的热损伤的电力转换装置。 在包括芯片部分（20）的芯片部分（20）中，包括由宽带隙半导体制成的芯片（21）和具有等于或高于芯片（21）的耐热温度的部件（22,23）; 以及布置在所述芯片部分（20）附近并且具有比所述芯片（21）的耐热温度低的耐热温度的外围部件（25）。 芯片（21）和周边部件（25）彼此绝热，使得周边部件（25）的温度不超过周边部件（25）的耐热温度。

公开(公告)号：EP1676182B8

公开(公告)日：2009-04-01

申请号：EP04770420.0

申请日：2004-10-22

Applicant: VeriFone Systems Ireland Limited

Inventor： COLEMAN, Ronan ,  MARTIN, Michael

IPC: G06F1/00 ,  G08B13/12

CPC classification number: G06F21/86 ,  H05K1/0275 ,  H05K1/144 ,  H05K2201/09263 ,  H05K2201/0999 ,  H05K2201/10151

Abstract: A secure device (1) has a circuit board (2) with various exposed components such as an LCD (4) and keys (40). A secure circuit (10) is housed within an enclosure formed between the board (2) and a cover (11). The cover (11) has, on its inside surface, a security track (23) in a dense serpentine pattern. The board (2) has a security track (52), also in a dense serpentine pattern, is an inner layer. The track (52) is linked to covered surface-level tracks (27) by vias (64). The cover's security track (23) is connected to the board's security tracks (52, 27) via a deformable pad (25) whose conductivity increases with applied compression.

公开(公告)号：EP2008345A2

公开(公告)日：2008-12-31

申请号：EP07755200.8

申请日：2007-04-10

Applicant: ADC GMBH

Inventor： HAMMOND, Bernard, Jr. ,  MURRAY, David, P. ,  GEORGE, Ian, R.

IPC: H01R13/719 ,  H04B3/32 ,  H01R24/04

CPC classification number: H01R13/6466 ,  H01R4/2416 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49117 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

公开(公告)号：EP1863130A3

公开(公告)日：2008-04-02

申请号：EP07114627.8

申请日：1998-09-22

Applicant: Rambus, Inc.

Inventor： Perino, Donald V. ,  Garret, Billy Wayne, Jr. c/o Rambus Inc. - Texas office- ,  Liaw, Haw-Jyh c/o Rambus Inc. - Texas office - ,  Nguyen,David c/o Rambus Inc. - Texas office - ,  Nimmagadda, Srinivas c/o Rambus Inc. - Texas office - ,  Gasbarro, James A. ,  Dewitt Crisp, Richard c/o Rambus inc. - Texas office -

IPC: H01R12/04 ,  G11C5/00 ,  G11C5/06

CPC classification number: G11C5/063 ,  G06F13/1684 ,  G06F13/4086 ,  G06F13/409 ,  G06F13/4247 ,  G11C5/04 ,  G11C7/1048 ,  H05K1/023 ,  H05K1/0246 ,  H05K1/0248 ,  H05K1/14 ,  H05K7/1459 ,  H05K2201/044 ,  H05K2201/09263 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10689

Abstract: A high frequency bus system (450) which insures uniform arrival times of high fidelity signals to the devices (510), despite the use of the bus (450) on modules (420) and connectors. The high frequency bus system (450) includes a first bus segment having one or more devices (510) connected between a first and second end. The high frequency bus system (450) also includes a second bus segment which has no devices connected to it. The first end of the first segment and the second end of the second segment are coupled in series to form a chain of segments and when two signals are introduced to the first end of the second bus segment at substantially the same time, they arrive at each device (510) connected to the first bus segment at substantially the same time. Conversely when two signals originate at a device (510) substantially at the same time, they arrive at the first end of the second bus segment at substantially the same time. Uniform arrival times hold despite the use of connectors to couple the segments together, despite the segments being located on modules, without the need for stubs, despite the presence of routing turns in the segments and despite the type of information, such as address, data, or control, carried by the signals.

公开(公告)号：EP1894455A1

公开(公告)日：2008-03-05

申请号：EP06773624.9

申请日：2006-06-21

Applicant: 3M Innovative Properties Company

Inventor： SATO, Yoshiaki ,  KAWATE, Kohichiro ,  WHITE, James R.

IPC: H05K3/36

CPC classification number: H05K3/365 ,  H01L2224/73204 ,  H01L2224/83101 ,  H05K1/117 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49195

Abstract: A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

公开(公告)号：EP1804560A2

公开(公告)日：2007-07-04

申请号：EP06026835.6

申请日：2006-12-22

Applicant: EL-ME Aktiengesellschaft

Inventor： Fischer, Markus ,  Froschermeier, Günther

IPC: H05K1/18

CPC classification number: G06F21/86 ,  H05K1/0268 ,  H05K1/0275 ,  H05K1/162 ,  H05K1/167 ,  H05K1/185 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/10151

Abstract: Ein Elektronik-Sicherheits-Modul umfaßt einen geschützten Bereich (18), in dem sicherheitsrelevante Bauteile (20) untergebracht sind. Das Elektronik-Sicherheits-Modul weist wenigstens eine erste Leiterplatte (10, 12) mit einer elektrisch leitenden Fläche (22) und eine zu dieser Leiterplatte (10, 12) benachbarte zweite Leiterplatte (10, 12) oder eine Abdeckung (38) mit einer elektrisch leitenden Fläche (22) auf. Es ist eine Meßeinrichtung zur Messung einer Kapazität zwischen den beiden Leiterplatten (10, 12) bzw. zwischen der ersten Leiterplatte (10, 12) und der Abdeckung (38) vorgesehen.

Abstract translation: 电子安全模块具有用于安全相关部件的保护区（18），该模块具有与第一电路板相邻的至少一个电路板（10,12）和第二电路板（10,12）。 提供测量装置用于测量两个电路板之间或第一电路板（10,12）和盖（未示出）之间的电容。