公开(公告)号：EP2117082B1

公开(公告)日：2016-05-18

申请号：EP06822495.5

申请日：2006-10-27

Applicant: Asahi Denka Kenkyusho Co., Ltd.

Inventor： MIZOGUCHI, Masanori

IPC: H01R12/77 ,  H01R12/78 ,  H01R12/79 ,  H05K3/32 ,  H05K3/36 ,  H01R12/58 ,  H01R12/62 ,  H01R12/59 ,  H01R12/61 ,  H05K1/11 ,  H05K3/40

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

公开(公告)号：EP2223581B1

公开(公告)日：2014-09-17

申请号：EP08862410.1

申请日：2008-10-29

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： VERILHAC, Jean-Marie ,  BABLET, Jacqueline ,  BORY, Cécile

IPC: H05K3/46 ,  H01L21/768 ,  H05K3/40 ,  H05K3/00

CPC classification number: H05K3/4084 ,  H01L21/76885 ,  H05K3/0017 ,  H05K3/4647 ,  H05K3/4664 ,  H05K2201/091 ,  H05K2201/09909 ,  H05K2203/107 ,  H05K2203/1173 ,  H05K2203/128

公开(公告)号：EP2127508B1

公开(公告)日：2013-06-26

申请号：EP07847875.7

申请日：2007-12-06

Applicant: Robert Bosch GmbH

Inventor： KIMMICH, Peter

IPC: H05K3/32

CPC classification number: H05K3/326 ,  H01R12/62 ,  H01R13/24 ,  H05K1/0313 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/091

公开(公告)号：EP2187717B1

公开(公告)日：2012-06-20

申请号：EP08829892.2

申请日：2008-09-03

Applicant: Murata Manufacturing Co. Ltd.

Inventor： FUKUDA, Yutaka

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01L21/48 ,  H01L21/60 ,  H01L23/13 ,  H01L23/498 ,  H01L23/16

CPC classification number: H05K1/183 ,  H01L21/481 ,  H01L21/4853 ,  H01L23/13 ,  H01L23/16 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/245 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2203/0278 ,  H05K2203/308 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49165 ,  Y10T156/10 ,  Y10T156/1052 ,  H01L2924/00 ,  H01L2224/0401

Abstract: There is provided a thin circuit substrate and circuit module that include a protruding terminal, and a method for manufacturing the circuit substrate. A circuit module (60) includes an IC (50) mounted on a circuit substrate (10). IC (50) includes an IC body (52) and an solder bump (54) formed on a mounting surface of the IC body (52). The circuit substrate (10) includes a substrate (12) having a recess (15) formed by recessing part of a mounting surface of the substrate on which the IC (50) is to be mounted, and a terminal (14) protruding from the mounting surface of the substrate (12). The terminal (14) is to be electrically connected to the solder bump (54).

Abstract translation: 本发明提供一种具有突出端子的低高度电路基板，电路模块以及电路基板的制造方法。 在电路模块（60）中，IC（50）安装在电路板（10）上。 IC（50）包括IC主体（52）和形成在IC主体（52）的安装表面上的焊料凸块（54）。 电路基板（10）具备：基板主体（12），其具有凹部（15）和端子（14），该凹部（15）是通过挖空安装IC（50）的安装面的一部分而形成的， 所述焊料凸块（54）形成在所述凹部（15）中以从所述基板主体（12）的安装表面突出。

公开(公告)号：EP1661053A4

公开(公告)日：2012-06-13

申请号：EP04780522

申请日：2004-08-06

Applicant: SHAPIRA SHMUEL

Inventor： SHAPIRA SHMUEL

IPC: H01F7/06 ,  A61F13/15 ,  A61F13/42 ,  B44C5/04 ,  H05K1/16 ,  H05K3/04 ,  H05K3/10 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/041 ,  H05K1/165 ,  H05K3/107 ,  H05K3/28 ,  H05K3/386 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156

公开(公告)号：EP2229280A4

公开(公告)日：2012-05-16

申请号：EP08859872

申请日：2008-12-01

Applicant: HEWLETT PACKARD DEVELOPMENT CO

Inventor： DORAN JOHN

IPC: B41J2/175

CPC classification number: B41J2/17546 ,  B41J2/1753 ,  B41J2/17553 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2203/163

公开(公告)号：EP1981315A3

公开(公告)日：2010-11-03

申请号：EP08154136.9

申请日：2008-04-07

Applicant: VALEO VISION

Inventor： Biarne, Vincent ,  Billot, Gérard

IPC: H05K1/02 ,  F21S8/10

CPC classification number: H05K1/189 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: Support électronique flexible équipé, supportant au moins une diode électroluminescente, et procédé de fabrication associé.
La présente invention propose concerne un projecteur de véhicule automobile comprenant un support électronique flexible équipé (300) qui comprend :
- un support isolant souple plan (302) équipé sur une première face (306) d'une pluralité de pistes conductrices (303) plates;
- au moins une source lumineuse de type diode électroluminescente (101) disposée sur la première face du support isolant souple ;

dans lequel une deuxième face (307) du support isolant souple est recouverte par une couche (301) de matériau thermiquement conducteur pour dissiper la chaleur produite par les diodes électroluminescentes, ladite couche comprenant une zone de contact avec la dite diode et une zone prolongée s'étendant hors de cette zone de contact, la dissipation de la chaleur s'effectuant essentiellement au niveau de cette zone prolongée.

Abstract translation: 柔性板（300）具有一个扁平柔性绝缘支承件（302）包括面部（306）具有平坦的导电路径。 的LED（101），即 功率LED，被布置在脸部和连接到所述路径中的一个。 导热材料E.G. 塑料或铜，层（301）具有在所述LED和所述支撑，并延长了接触区外延长的区域之间的连接的水平的接触区。 该层覆盖在用于消散由LED在延长区中产生的热量的延长区域中的支撑件的另一个面（307）。

公开(公告)号：EP2236017A1

公开(公告)日：2010-10-06

申请号：EP08868524.3

申请日：2008-12-29

Applicant: Nederlandse Organisatie voor Toegepast -Natuurwetenschappelijk Onderzoek TNO

Inventor： MEINDERS, Erwin Rinaldo ,  GELINCK, Gerwin Hermanus

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4638 ,  H05K1/0393 ,  H05K3/4069 ,  H05K3/4635 ,  H05K2201/051 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T156/1039

Abstract: The invention relates to a method of aligning a flexible foil sheet having a general first foil sheet length direction to form stacked foil sheet layers on a reel having a reel diameter. The method comprises providing multiple alignment markers in the foil sheet, distanced conform the reel diameter and each having an mark length direction transverse to the first foil sheet length direction, to form protrusions and corresponding recesses on opposite faces of the foil sheet; winding the foil sheet on the reel in the first foil sheet length direction of the foil sheet; and co-aligning the alignment markers to have protrusions of one mark matching with a recess of another mark, so as to block relative movement of the stacked foil sheet layers in the first foil sheet length direction. Preferably, the foil sheet layers are provided with device functionality to form a stacked foil sheet layered device.

公开(公告)号：EP2223581A1

公开(公告)日：2010-09-01

申请号：EP08862410.1

申请日：2008-10-29

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： VERILHAC, Jean-Marie ,  BABLET, Jacqueline ,  BORY, Cécile

IPC: H05K3/46

CPC classification number: H05K3/4084 ,  H01L21/76885 ,  H05K3/0017 ,  H05K3/4647 ,  H05K3/4664 ,  H05K2201/091 ,  H05K2201/09909 ,  H05K2203/107 ,  H05K2203/1173 ,  H05K2203/128

Abstract: The invention relates to a method for making an electric interconnection between two conducting layers (2, 5) separated by at least one insulation or semi-conducting layer (4), that comprises forming a stud (3) extending at least between the lower conducting layer (2) and the upper conducting layer (5), wherein the nature and/or the shape of said stud impart non-wettability properties to said stud relative to the material used for the separating layer (4).

公开(公告)号：EP2206419A1

公开(公告)日：2010-07-14

申请号：EP08806763.2

申请日：2008-10-17

Applicant: Novalia Ltd

Inventor： STONE, Kate

IPC: H05K1/00

CPC classification number: F21V21/14 ,  H05K1/0266 ,  H05K1/028 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/113 ,  H05K3/12 ,  H05K3/32 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09936 ,  H05K2201/10674 ,  H05K2203/1545 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T428/24273

Abstract: A method of fabricating packaging for a product comprises forming a plurality of conductive tracks on a sheet of material and forming a physical barrier, such as a hole,for impeding fluid flow between adjacent conductive tracks.The method may furthercomprise depositing first and second regions conductive fluid onto adjacent first and second conductive tracks either sideof the physical barrier and mounting an electronic device having first and second terminals such that the electronic device forms a bridge over the physical barrier and the first ands second terminals contact the first and second conductive adjacent tracks.