公开(公告)号：EP2000013B1

公开(公告)日：2010-10-13

申请号：EP07723814.5

申请日：2007-03-30

Applicant: ATOTECH Deutschland GmbH

Inventor： REENTS, Bert ,  ROELFS, Bernd ,  MAGAYA, Tafadzwa ,  YOUKHANIS, Markus ,  WENZEL, René ,  KIM, Soungsoo

IPC: H05K3/42 ,  H05K3/18 ,  C25D3/00 ,  C25D5/00

CPC classification number: H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

Abstract: Disclosed is an electroplating method for filling cavities, through holes, pocket holes, or micropocket holes of a workpiece with metals. According to said method, the workpiece containing cavities, through holes, pocket holes, or micropocket holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the workpiece and at least one anode such that a current flow is fed to the workpiece. The inventive method is characterized in that the electrolyte encompasses a redox system.

公开(公告)号：EP1858307A4

公开(公告)日：2010-08-11

申请号：EP06781086

申请日：2006-07-07

Applicant: IBIDEN CO LTD

Inventor： TAKAHASHI MICHIMASA ,  MIKADO YUKINOBU ,  NAKAMURA TAKENOBU ,  AOYAMA MASAKAZU

IPC: H05K3/46 ,  H05K1/11

CPC classification number: H01L23/48 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/00 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49124 ,  H01L2924/00

公开(公告)号：EP2173147A1

公开(公告)日：2010-04-07

申请号：EP07790805.1

申请日：2007-07-13

Applicant: Ibiden Co., Ltd.

Inventor： TAKAHASHI, Michimasa ,  AOYAMA, Masakazu

IPC: H05K3/46

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0035 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2203/1536

Abstract: A wiring board 19 is structured by laminating first substrate 1, second substrate 2 having a smaller mounting area than that of first substrate 1, and base substrate 3 positioned between first substrate 1 and second substrate 2, where at least a portion of the periphery is made thinner than the central portion. Vias 44 are formed in at least either first substrate 1 or second substrate 2. In base substrate 3, the thickness of the portion bonded only to first substrate 1 is less than that of the portion sandwiched between first substrate 1 and second substrate 2.

Abstract translation: 布线板19通过层叠第一基板1，安装面积小于第一基板1的第二基板2和位于第一基板1和第二基板2之间的基板3而构成，其中至少一部分周边是 比中央部分薄。 在第一基板1或第二基板2中的至少一个中形成通路44.在基板3中，仅与第一基板1接合的部分的厚度小于夹在第一基板1与第二基板2之间的部分的厚度。

公开(公告)号：EP1962566A3

公开(公告)日：2010-01-20

申请号：EP08250573.6

申请日：2008-02-19

Applicant: SIIX Corporation

Inventor： Matsushima, Yoshihiko

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/112 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/3484 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2203/0455 ,  H05K2203/1581 ,  Y10T428/24273 ,  H01L2924/00014

Abstract: A surface mount circuit board includes: an insulating substrate (1) having through holes each extending from front to rear surfaces of the insulating substrate; high thermal conductive members (12) each filing a different one of the though holes; lands (13) each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the front surface around the peripheral edge of the corresponding through hole; and heat receiving members (14) each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the rear surface around the peripheral edge of the corresponding through hole. Each land may be made of solder cream filled into and flashed out of the through hole. Alternatively to the high thermal conductive members, wire rods may be fitted into the respective through holes.

Abstract translation: 一种表面安装电路板包括：绝缘性通孔（1）的基片，每从前方到所述绝缘基板的后表面延伸; 高导热构件（12），每个备案虽然孔的不同的一个; 焊盘（13），每个设置在所述高导热性构件的不同的一个的端部表面，以覆盖并因此覆盖围绕通孔的相应的周缘的前表面的一部分; 和热接收部件（14），每个设置成覆盖孔结束的高导热性构件的一个不同的表面，从而覆盖周围通过相应的周缘的后表面的一部分。 每个国家可以由填充到焊料膏并闪蒸出的通孔的。 可替代地，以高导热部件，线材可以是通孔安装到respectivement。

公开(公告)号：EP1030544B1

公开(公告)日：2009-12-30

申请号：EP98947819.3

申请日：1998-10-12

Applicant: IBIDEN CO., LTD.

Inventor： ASAI, Motoo ,  SHIMADA, Kenichi ,  NODA, Kouta ,  KARIYA, Takashi ,  SEGAWA, Hiroshi

IPC: H05K3/46

CPC classification number: B32B3/00 ,  H05K3/0094 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10S428/901 ,  Y10T428/24917

Abstract: Over a board in which through-holes are formed, conductor circuits are formed on interlayer resin insulating layers. The through-holes have roughed inner walls and are filled with filling material. The parts where the filling material are exposed are covered with through-hole covering conductor layers. Further, via-holes formed directly above the through-hole covering conductor layers are connected to the conductor layers. The filling material is not separated from the through-holes, the connection reliability between the through-holes and the internal layer circuits is high and, further, high density wiring can be realized.

公开(公告)号：EP1848257A4

公开(公告)日：2009-11-25

申请号：EP06712597

申请日：2006-01-30

Applicant: IBIDEN CO LTD

Inventor： WU YOUHONG ,  TAMAKI MASANORI

IPC: H05K3/46 ,  H05K3/18

CPC classification number: H05K1/115 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09627

公开(公告)号：EP1845762A4

公开(公告)日：2009-11-18

申请号：EP06712598

申请日：2006-01-30

Applicant: IBIDEN CO LTD

Inventor： WU YOUHONG

IPC: H01R12/51 ,  H05K3/46 ,  H05K3/18

CPC classification number: H05K1/115 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09627 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

公开(公告)号：EP2111087A2

公开(公告)日：2009-10-21

申请号：EP09008814.7

申请日：2000-07-04

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin

IPC: H05K3/46

CPC classification number: H05K3/423 ,  C25D3/38 ,  H05K1/113 ,  H05K3/108 ,  H05K3/3457 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09563 ,  Y10T29/49155

Abstract: A multilayer printed circuit board comprising a substrate (1) bearing conductor circuits (4) on both sides and having a plated-through hole (9) which connects the conductor circuits (4) and, as serially layered thereon, a resin insulating layer (2) and a conductor circuit (4,5) in an alternate fashion and in repetition, wherein the conductor circuits (4, 5) neighboring in up and down direction are connected through a via-hole (7),
characterized in that said plated-through hole (9) has a land (9a), that the via-hole (7) on the land (9a) is filled with a metal, that the upper face of said via-hole (7) and the upper face of said conductor circuit (5) in the same layer are kept in the substantially same plane, and that the distance from the bottom face to the upper face of said via-hole (7) is about 2 to 7 times as long as the thickness of said conductor circuit (5).

Abstract translation: 一种多层印刷电路板，包括在两侧承载导体电路（4）并具有连接导体电路（4）的电镀通孔（9）的基板（1），并且连续地层叠有树脂绝缘层（ 2）和导体电路（4,5），其中沿上下方向相邻的导体电路（4,5）通过通孔（7）连接，其特征在于，所述电镀 贯通孔（9）具有用于将上述通孔（7）的上表面和上述通孔（9）的上表面（9）的上表面 同一层中的所述导体电路（5）保持在基本相同的平面中，并且从所述通孔（7）的底面到上表面的距离为所述通孔（7）的厚度的约2至7倍 所述导体电路（5）。

公开(公告)号：EP2086300A1

公开(公告)日：2009-08-05

申请号：EP09156841.0

申请日：2000-05-25

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo ,  Wang, Dongdong ,  Mori, Takahiro

IPC: H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed.

Abstract translation: 金属层18被夹在绝缘层14之间和20，从而没必要的强度得以保持。 因此它遵循，芯的DASS模具厚度基片30可以减小，因此，多层印刷电路板的厚度可以减小。 非贯通孔22，其在绝缘层14和20到达金属层18的形成是简单地需要。 因此，小的非贯通孔22能够容易地通过施加激光束形成的。 因此，通过具有小直径的每个孔36可以被形成。

公开(公告)号：EP1903842A3

公开(公告)日：2009-05-06

申请号：EP08000185.2

申请日：1999-06-23

Applicant: IBIDEN CO., LTD.

Inventor： Nishiwaki, Yoko ,  Noda, Kouta

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4626 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/0094 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  Y10T29/49155

Abstract: A multilayer printed wiring board having a structure that outer conductor circuit patterns (5) are formed on a core substrate (1) having inner conductor circuit patterns (4) formed thereon through interlaminar resin insulating layers (2), and through-holes (9) are formed in the substrate for electrically connecting the inner conductor circuit patterns (4) to each other. A filler (10) is filled in the through-hole (9). The same kind of roughened layers (11) are formed on the inner conductor circuit pattern (4) on the substrate (1) over a full surface including a side surface thereof. The interlaminar resin insulating layer (2) formed covering the inner conductor circuit patterns (4) is flat. The outer conductor circuit pattern (5) is comprised of an electroless plated layer (12) formed on the interlaminar resin insulating layer (2) and an electrolytic plated layer (13) formed on the electroless plated layer (12).

Abstract translation: 一种多层印刷线路板，其具有这样的结构：在其上通过层间树脂绝缘层（2）形成内部导体电路图案（4）的核心基板（1）上形成外部导体电路图案（5） ）形成在基板中，用于将内部导体电路图案（4）彼此电连接。 填充物（10）填充在通孔（9）中。 在包括其侧表面的整个表面上，在基板（1）上的内部导体电路图案（4）上形成相同种类的粗糙层（11）。 形成为覆盖内部导体电路图案（4）的层间树脂绝缘层（2）是平坦的。 外导体电路图案（5）由形成在层间树脂绝缘层（2）上的非电镀层（12）和形成在非电镀层（12）上的电解电镀层（13）组成。