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公开(公告)号：EP2757613B1
公开(公告)日：2015-11-18
申请号：EP13183848.4
申请日：2013-09-11
Applicant: Samsung SDI Co., Ltd.
Inventor： Yi, Sang-Il , Kang, Moon-Gil
CPC classification number: H01M2/34 , H01M2/105 , H01M2/204 , H01M10/425 , H05K3/3426 , H05K3/4015 , H05K2201/0394 , H05K2201/10037 , H05K2201/1031 , H05K2201/10462 , H05K2201/10515 , H05K2201/1053 , H05K2201/10916 , H05K2201/10946 , Y02P70/611 , Y02P70/613
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32.发明公开Electronic component and printed circuit board with RFID tag 审中-公开Elektronische Komponente und Leiterplatte mit RFID-Etikett
公开(公告)号：EP2750487A1
公开(公告)日：2014-07-02
申请号：EP13185597.5
申请日：2013-09-23
Applicant: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd. , Hon Hai Precision Industry Co., Ltd.
Inventor： Sun, Zong-Yuan , Xiao, Da-Hua
IPC: H05K1/02 , G05B19/418 , H05K1/18
CPC classification number: G06K19/07758 , G05B19/4183 , H05K1/0266 , H05K1/181 , H05K2201/10098 , H05K2201/1053
Abstract: A printed circuit board (PCB) includes a base board 10, a number of electronic components 30, 50 and at least one radio frequency identification (RFID) tag 70. The electronic components are mounted on the base board. The at least one RFID tag is attached to one or more of the electronic components, and is programmed with identification information of the PCB.
Abstract translation: 印刷电路板（PCB）包括基板10，多个电子部件30,50和至少一个射频识别（RFID）标签70.电子部件安装在基板上。 至少一个RFID标签被附接到一个或多个电子部件，并且被编程为PCB的识别信息。
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33.发明公开ELEKTRISCHE BAUELEMENTANORDNUNG MIT VARISTOR UND HALBLEITERBAUELEMENT 有权ELEKTRISCHE BAUELEMENTANORDNUNG MIT VARISOR UND HALBLEITERBAUELEMENT
公开(公告)号：EP2289075A1
公开(公告)日：2011-03-02
申请号：EP09749929.7
申请日：2009-05-22
Applicant: Epcos AG
Inventor： FEICHTINGER, Thomas , ENGEL, Günter , PECINA, Axel
CPC classification number: H01C1/084 , H01C7/10 , H01C7/12 , H01L2224/48091 , H05K1/0203 , H05K1/181 , H05K2201/10022 , H05K2201/10106 , H05K2201/10515 , H05K2201/1053 , H05K2201/10674 , Y02P70/611 , H01L2924/00014
Abstract: The invention relates to an electric component assembly comprising a semiconductor component (1) and a carrier, said carrier containing a highly thermally conductive ceramic and being connected to a varistor element. Heat from the semiconductor component can be at least partially dissipated via the varistor element to the carrier (3).
Abstract translation: 规定了包括半导体部件（1）和载体的电气部件组件，其中，所述载体包含高导热性陶瓷，并且连接到压敏电阻体。 来自半导体部件的热可以通过可变电阻体至少部分地耗散到载体（3）。
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34.发明授权
公开(公告)号：EP1294023B1
公开(公告)日：2008-06-18
申请号：EP02003595.2
申请日：2002-02-15
Applicant: Hitachi, Ltd.
IPC: H01L25/10 , H01L25/16 , H01L25/065 , H01L23/58
CPC classification number: H05K1/181 , H01L23/13 , H01L23/24 , H01L23/3128 , H01L23/367 , H01L23/467 , H01L23/552 , H01L24/48 , H01L24/49 , H01L25/105 , H01L25/162 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01047 , H01L2924/01074 , H01L2924/01083 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H05K1/0262 , H05K1/141 , H05K2201/10515 , H05K2201/1053 , H05K2201/10689 , H05K2201/10734 , Y02P70/611 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
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公开(公告)号：EP1667227A1
公开(公告)日：2006-06-07
申请号：EP05703870.5
申请日：2005-01-20
Applicant: Matsushita Electric Industries Co., Ltd.
Inventor： Nakatani, Seiichi , Mitani Tsutomu
CPC classification number: H05K1/02 , H01L23/3128 , H01L23/552 , H01L23/66 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L25/18 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2225/1005 , H01L2225/1023 , H01L2225/107 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H01L2924/19104 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H05K1/181 , H05K2201/10098 , H05K2201/1053 , H01L2924/00012 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module (1) includes a substrate (12) and a plurality of semiconductor packages (11a, 11b), each including a semiconductor chip (10), mounted on the substrate (12). Each of the plurality of semiconductor packages (11a, 11b) includes a first radio communication element (16) for transmitting and receiving a signal between the semiconductor chips (10) in the plurality of semiconductor packages (11a, 11b) by radio communication, and the first radio communication element (16) is constituted independently of the semiconductor chip (10).
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Patent Agency Ranking36.发明公开Capacitor-built-in-type printed wiring substrate, printed wiring substrate, and capacitor 有权印刷电路板具有内置电容器，衬底印刷电路和电容器
公开(公告)号：EP1041631A3
公开(公告)日：2003-11-26
申请号：EP00302581.4
申请日：2000-03-29
Applicant: NGK Spark Plug Company Limited
Inventor： Ogawa, Kouki , Kodera, Eiji
CPC classification number: H01L23/642 , H01G4/232 , H01G4/236 , H01L23/13 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/16265 , H01L2224/16268 , H01L2224/73253 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/19106 , H05K1/0231 , H05K1/183 , H05K3/4602 , H05K2201/10515 , H05K2201/1053 , H05K2201/10674 , H05K2201/10734 , H05K2203/047
Abstract: The aim of the disclosed invention is to provide a capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attains extremely low resistance and low inductance involved in connection between an IC chip and the capacitor and to provide a printed wiring substrate and a capacitor used in the same. To achieve this object, a capacitor-built-in-type printed wiring substrate (100) on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate (110) and an IC chip (101) mounted on the capacitor-built-in-type printed wiring substrate (110). A printed wiring substrate (120) includes a number of connection-to-IC substrate bumps (152) and a closed-bottomed capacitor accommodation cavity (121) formed therein. A capacitor (130) is disposed in the cavity (121) and includes a pair of electrode groups (133E and 133F) and a number of connection-to-IC capacitor bumps (131) connected to either one of the paired electrode groups (133E and 133F). The connection-to-IC capacitor bumps (131) are flip-chip-bonded to corresponding connection-to-capacitor bumps (103) on the IC chip. The connection-to-IC substrate bumps (152) are flip-chip-bonded to corresponding connection-to-substrate bumps (104) on the IC chip.
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公开(公告)号：EP1037328B1
公开(公告)日：2003-10-22
申请号：EP00202137.6
申请日：1996-02-07
Applicant: JOHNSTECH INTERNATIONAL CORPORATION
Inventor： Johnson, David A. , Kline, Eric V.
CPC classification number: H01R13/2464 , H01L23/64 , H01L23/642 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R13/2407 , H01R13/6464 , H01R13/6471 , H01R13/6473 , H01R13/6608 , H01R13/719 , H05K1/023 , H05K1/0231 , H05K1/025 , H05K7/1092 , H05K2201/0792 , H05K2201/10325 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10689 , Y02P70/611 , H01L2924/00
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38.发明公开
公开(公告)号：EP1294023A2
公开(公告)日：2003-03-19
申请号：EP02003595.2
申请日：2002-02-15
Applicant: Hitachi, Ltd.
IPC: H01L25/10
CPC classification number: H05K1/181 , H01L23/13 , H01L23/24 , H01L23/3128 , H01L23/367 , H01L23/467 , H01L23/552 , H01L24/48 , H01L24/49 , H01L25/105 , H01L25/162 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01047 , H01L2924/01074 , H01L2924/01083 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H05K1/0262 , H05K1/141 , H05K2201/10515 , H05K2201/1053 , H05K2201/10689 , H05K2201/10734 , Y02P70/611 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
Abstract: In the past, a power supply distance between a power source and an LSI package could not be shortened and power supply variations could easily produce an adverse effect. In the present invention, a power supply module 11 is mounted on the surface of an LSI package 13 . The power supply distance between the LSI 19 and power supply module 11 can be shortened. As a result, the power source noise can be reduced, the efficiency and response rate of the power source unit are high, and the generated electromagnetic field can be reduced. Moreover, since each LSI package has a power supply module required therefor, the number of required power source types (voltage types) on the substrate with the package mounted thereon can be decreased. As a result, the mounting efficiency can be increased and the substrate can be manufactured at a low cost.
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公开(公告)号：EP1284094A2
公开(公告)日：2003-02-19
申请号：EP01939055.8
申请日：2001-05-15
Applicant: Infineon Technologies North America Corp.
Inventor： VANDOORN, Schelto
IPC: H05K1/18
CPC classification number: H05K1/181 , H05K2201/10083 , H05K2201/1053 , H05K2201/10689 , H05K2201/10734 , Y02P70/611
Abstract: Apparatus and methods of electrically connecting integrated circuits (40-50) and transducers (28-38) are described. In particular, a transducer (60) includes a base (62) mountable on a substrate (64) (e.g., a printed circuit board), and an input/output (I/O) lead (66) configured to contact an I/O lead (68) of an integrated circuit (70) mounted on the substrate (64). The transducer (60) may be mounted on the substrate (64) to contact the transducer I/O lead (66) to the integrated circuit I/O lead (68). The transducer I/O lead (66) is configured to electrically connect to the integrated circuit I/O lead (68) independently of any electrically conductive path of the substrate (64). The direct electrical connection between the transducer (60) and the integrated circuit (70) provides a high-speed communication channel that avoids the parasitic and high-inductance limitations generally associated with conventional metallic printed circuit board traces. At the same time, the transducer (60) is compatible with existing printed circuit board technologies and integrate circuit technologies and, therefore, may be readily integrated into existing computer systems.
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公开(公告)号：EP1063733A2
公开(公告)日：2000-12-27
申请号：EP00203339.7
申请日：1996-02-07
Applicant: JOHNSTECH INTERNATIONAL CORPORATION
Inventor： Johnson, David A. , Kline, Eric V.
IPC: H01R13/66
CPC classification number: H01R13/2464 , H01L23/64 , H01L23/642 , H01L2924/0002 , H01L2924/3011 , H01R12/57 , H01R13/2407 , H01R13/6464 , H01R13/6471 , H01R13/6473 , H01R13/6608 , H01R13/719 , H05K1/023 , H05K1/0231 , H05K1/025 , H05K7/1092 , H05K2201/0792 , H05K2201/10325 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10689 , Y02P70/611 , H01L2924/00
Abstract: The invention concerns an electrical connector apparatus for transmitting a signal between a first terminal (18), for connection to a first device, and a second terminal (20), for connection to second device, characterised in that it comprises:
a rigid contact for electro-mechanically interconnecting the first terminal to the second terminal, said contact comprising electrical affecting means (10) for electrically affecting the signal as the signal is transmitted between the first terminal and the second terminal, said electrical affecting means comprising a controlled impedance formed between two components within said connector.
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