公开(公告)号：EP0848447A2

公开(公告)日：1998-06-17

申请号：EP97310005.0

申请日：1997-12-11

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Somei, Junichi

IPC: H01P3/08

CPC classification number: H01P3/081 ,  H02M2007/53876 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09627 ,  H05K2201/09845

Abstract: There is provided a transmission circuit using a strip line which can be formed in three dimensions with simple construction and low cost and which has high reliability. A first microstrip line is formed by sandwiching a dielectric substrate 1 between a first strip conductor 2 provided on a top surface of the dielectric substrate 1 and a first grounding conductor 3 provided on a bottom surface of the dielectric substrate 1. A second microstrip line is formed by sandwiching the dielectric substrate 1 between a second strip conductor 4 provided on the bottom surface of the dielectric substrate 1 and a second grounding conductor 5 provided on the top surface of the dielectric substrate 1. The first strip conductor 2 and the second strip conductor 4 are electrically connected to each other by a connecting through hole 11 provided in the dielectric substrate 1.

Abstract translation: 提供了一种使用带状线的传输电路，其可以以简单的结构和低成本三维形成，并且具有高可靠性。 通过将电介质基板1夹在设置在电介质基板1的上表面上的第一带状导体2和设置在电介质基板1的底面上的第一接地导体3之间来形成第一微带线。第二微带线是 通过将电介质基板1夹持在设置在电介质基板1的底面上的第二带状导体4和设置在电介质基板1的上表面的第二接地导体5之间而形成。第一带状导体2和第二带状导体 4通过设置在电介质基板1中的连接通孔11彼此电连接

公开(公告)号：EP0766503A2

公开(公告)日：1997-04-02

申请号：EP96115548.8

申请日：1996-09-27

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ohtaki, Toru, c/o Canon K.K. ,  Ichida, Yasuteru, c/o Canon K.K. ,  Takeuchi, Yasushi, c/o Canon K.K.

IPC: H05K1/02 ,  H05K1/16

CPC classification number: H01L23/48 ,  H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K3/3421 ,  H05K2201/09263 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/09772 ,  H05K2201/1006 ,  H05K2201/10689 ,  Y10S257/924 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: In a multi-layered printed circuit board on which an LSI having a plurality of power supply pins and a plurality of signal pins is mounted, and a grid array package which adopts the printed circuit board, some or all of the plurality of power supply pins are connected to a power supply pattern via an inductance pattern, thereby reducing generation of radiation noise.

公开(公告)号：EP0390600A2

公开(公告)日：1990-10-03

申请号：EP90303462.7

申请日：1990-03-30

Applicant: SONY CORPORATION

Inventor： Takao, Nobutaka, c/o Patents Division ,  Yokoya, Satoshi, c/o Patents Division ,  Takagi, Kotaro, c/o Patents Division

IPC: H03H1/00

CPC classification number: H05K1/0243 ,  H03H1/00 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/09809 ,  H05K2201/1006 ,  H05K2201/10356 ,  H05K2201/10371 ,  H05K2201/1053 ,  H05K2201/10969

Abstract: A filter apparatus comprises a multi-layer printed circuit board (7) on which is mounted a shielded filter (4) having input and output terminals (44, 45) protruding from the printed circuit board. The printed circuit board (7) is formed from two insulating substrates (71, 72). A connective conductive pattern (82) is formed on an inner surface of one (72) of the substrates that faces the other substrate (71). Conductive layers (81, 83g) are formed on respective outer surfaces of the substrate opposing the connection conductive pattern (82). At least one of the input and output terminals (44, 45) of the filter (4) is connected to the connective conductive pattern (82) and the conductive layers (81, 83g) are grounded, thereby shielding the connective conductive pattern (82).

Abstract translation: 滤波器装置包括多层印刷电路板（7），其上安装有从印刷电路板突出的输入和输出端子（44,45）的屏蔽滤波器（4）。 印刷电路板（7）由两个绝缘基板（71,72）形成。 连接导电图案（82）形成在面对另一基板（71）的一个（72）基板的内表面上。 导电层（81,83g）形成在与连接导电图案（82）相对的基板的相应外表面上。 过滤器（4）的输入和输出端子（44,45）中的至少一个连接到连接导电图案（82），并且导电层（81,83g）接地，从而屏蔽连接导电图案（82 ）。

公开(公告)号：EP0125449A3

公开(公告)日：1986-02-05

申请号：EP84103596

申请日：1984-03-31

Applicant: NORTHERN TELECOM LIMITED

Inventor： Znojkiewicz, Maciej Edward

IPC: H03D09/06 ,  H01P05/00

CPC classification number: H05K1/0239 ,  H03B19/18 ,  H03D9/0641 ,  H05K1/0218 ,  H05K1/0272 ,  H05K1/162 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/10174

Abstract: In a microwave device, for example a microwave local oscillator with a harmonic mixer for feedback control, problems of coupling the mixer circuit to the R.F. cavity (10) are overcome by providing a d.c. blocking capacitor of the mixer on a planar surface of a support (20) extending across an aperture (14) in one wall of the cavity. In preferred embodiments the capacitor is a planar device formed by a plurality of interdigitated fingers (26, 28). These fingers (26, 28) are oriented to couple magnetically with the R.F. energy at the aperture in the cavity (10). The support conveniently comprises a printed circuit board having a ground plane (22) on the same surface as the capacitor, which is located in a small opening (24) in the ground plane. A second ground plane (38) is provided on the opposite side of the printed circuit board, overlying the opening. The two ground planes are interconnected by plate-through-holes (40).

公开(公告)号：EP2100783B8

公开(公告)日：2018-02-07

申请号：EP09155248.9

申请日：2009-03-16

Applicant: Guardian Glass, LLC

Inventor： Veerasamy, Vijayen S.

IPC: B60S1/08 ,  B32B17/10 ,  G01D5/24 ,  G01N21/25 ,  H05K1/02

CPC classification number: B60S1/0825 ,  B32B17/10036 ,  B32B17/10174 ,  B32B17/10761 ,  B32B17/10788 ,  B60S1/0822 ,  B60S1/087 ,  G01D5/2405 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09663

Abstract: A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). In certain example embodiments, a plurality of sensing capacitors are supported by a window such as a vehicle windshield, the capacitors each having a different field and/or pattern. A sensing circuit outputs an analog signal that is based on and/or related to the capacitances of one or more of the sensing capacitors. In certain example embodiments, a flexible printed circuit board (PCB) mountable in or on a vehicle window is provided. First and second sensing circuits are formed on opposing sides of the flexible PCB, with each said sensing circuit comprising a plurality of different fractal structures. A ground plane is located between the first and second sensing circuits, with the ground plane being arranged so as to decouple the first and second capacitor arrays and to shield the first capacitor array from fields emanating from the second capacitor array and vice versa. The electronic device is configured to detect moisture on an exterior surface of the vehicle window, humidity on an interior surface of the vehicle window, and EMI.

公开(公告)号：EP3021646A1

公开(公告)日：2016-05-18

申请号：EP14192742.6

申请日：2014-11-11

Applicant: Shenzhen Mindray Bio-Medical Electronics Co., Ltd.

Inventor： Svedmyr, Peter ,  Werner, Johan

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0218 ,  H05K1/0215 ,  H05K9/0018 ,  H05K2201/0723 ,  H05K2201/09336 ,  H05K2201/09509 ,  H05K2201/09536

Abstract: A device, system and method for providing an EMC barrier. The EMC barrier comprises a printed circuit board having at least two inner layers and a first and a second outer layer. Each layer is connected to ground. The first outer layer is connected to at least one of the at least two inner layers by a blind via and the second layer is connected to at least one of the at least two inner layers by a blind via, thereby allowing a signal to be transferred from the first outer layer to the second outer layer.

Abstract translation: 一种用于提供EMC屏障的设备，系统和方法。 EMC屏障包括具有至少两个内层和第一外层和第二外层的印刷电路板。 每层连接到地面。 第一外层通过盲通孔连接到至少两个内层中的至少一个，并且第二层通过盲通孔连接到至少两个内层中的至少一个，从而允许信号被转移 从第一外层到第二外层。

公开(公告)号：EP2184964A3

公开(公告)日：2015-03-18

申请号：EP09159298.0

申请日：2003-01-23

Applicant: Mitsubishi Materials Corporation ,  Panasonic Corporation

Inventor： Yamaguchi, Kunio ,  Kimura, Ryouhei ,  Tanaka, Atsushi ,  Morozumi, Kenyu

IPC: H05K1/02 ,  H05K9/00 ,  H03H9/25 ,  H04B1/04 ,  H04B1/10 ,  H04B1/38 ,  H03H9/02 ,  H03H9/10 ,  H03H9/64 ,  H05K1/11

CPC classification number: H05K1/0243 ,  H03H9/0259 ,  H03H9/02913 ,  H05K1/111 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/09336 ,  H05K2201/10083

Abstract: A protective member (315) which has a surface which is coated with, for example, a conductive sheet or the like is carried upon the surface (311A) of the SAW filter (311) which has been mounted in the fitting region (313) upon the printed substrate (312). Here, within the conductive surface of the protective member (315), by surface contact with the surface (311A) of the SAW filter (311), the size of a conductive coating surface (315A) of the protective member which covers this surface (311A) is set so as to be the same as the size of the surface (311A) of the SAW filter (311), or to be smaller than the size thereof.
Furthermore a shield frame member (316) which is shaped as a frame and which is made from a metal (for example from copper or the like) is provided so as to surround the periphery of the fitting region (313) for the SAW filter (311) and moreover a shield lid member (317) which is shaped as a lid and which is made from a metal (for examplefrom copper or the like) is provided so as to be sandwiched from both sides by the printed substrate (312).

公开(公告)号：EP2830405A1

公开(公告)日：2015-01-28

申请号：EP13765103.0

申请日：2013-02-08

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： KADOYA Kiyoomi ,  ISHIDA Ryosuke ,  MAYUZUMI Takuya ,  HOSHINO Kenichi ,  OKADA Yasuhiko ,  SUGIYAMA Yasushi

IPC: H05K9/00

CPC classification number: H05K9/0064 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/0298 ,  H05K5/006 ,  H05K9/0039 ,  H05K2201/09336 ,  H05K2201/10371

Abstract: An object of the present invention is to obtain a highly reliable, low-cost C/U structure that provides increased noise immunity.
Proposed is a C/U that is designed to accomplish the above object. The CU includes a multilayer circuit substrate 8, a resin cover 1, and a metal base 2. Electronic parts are mounted on both surfaces of the multilayer circuit substrate 8 which is covered with the resin cover 1 and the metal base 2. The multilayer circuit substrate 8 includes a signal pattern 4, a GND pattern 5, an important signal pattern 6, and a multilayer circuit substrate insulating layer 7. The GND pattern 5 is electrically connected to the metal base 2 through a screw 3. The GND pattern is disposed on the side of the resin cover 1 in order to shield the important signal pattern 6 against electromagnetic waves penetrating the resin cover 1 to enter a housing and electromagnetic waves incident from the metal base 2 side. The important signal pattern 6 is disposed so that it is covered with the GND pattern 5 and the metal case 2.

Abstract translation: 本发明的一个目的是获得高度可靠的，低成本的C / U结构，其提供增强的噪声免疫性。 建议设计一个C / U来完成上述目的。 该CU包括多层电路基板8，树脂盖1和金属基底2.电子部件安装在多层电路基底8的两个表面上，该表面被树脂盖1和金属基底2覆盖。多层电路 基板8包括信号图案4，GND图案5，重要信号图案6以及多层电路基板绝缘层7.GND图案5通过螺钉3与金属基座2电连接.GND图案配置 在树脂盖1的侧面上，以便屏蔽重要信号图案6免受穿透树脂盖1的电磁波进入壳体和从金属基座2侧入射的电磁波。 重要的信号图案6被布置为被GND图案5和金属壳2覆盖。

公开(公告)号：EP2795717A1

公开(公告)日：2014-10-29

申请号：EP12816584.2

申请日：2012-12-21

Applicant: Andrew LLC

Inventor： ZIMMERMAN, Martin

IPC: H01P5/02 ,  H01L23/48 ,  H01Q1/24 ,  H05K3/32

CPC classification number: H03H7/004 ,  H01L2924/0002 ,  H01P5/028 ,  H01Q1/246 ,  H05K1/0225 ,  H05K1/0239 ,  H05K3/28 ,  H05K3/40 ,  H05K2201/0175 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/09872 ,  H01L2924/0001

Abstract: A blind-mate capacitive coupling interconnection between a main module enclosure one or more sub-module enclosures has coupling surfaces each with a ground portion and an aperture, an inner element provided in the aperture, spaced away from the ground portion. The coupling surfaces may be provided, for example, as traces on a printed circuit board. To accommodate a degree of mis-alignment, one of the inner elements may be provided larger than the other. Capacitive coupling between the coupling surfaces occurs when the coupling surfaces are mated together, retained in position, for example, by a mechanical fixture.

Abstract translation: 一个或多个子模块外壳之间的主模块外壳之间的盲配电容耦合互连具有各自具有接地部分和开口的耦合表面，设置在孔中的内部元件，与接地部分间隔开。 耦合表面可以例如设置在印刷电路板上的迹线上。 为了适应一定程度的不对准，内部元件中的一个可以被提供为大于另一个。 耦合表面之间的电容耦合发生在耦合表面配合在一起时，例如通过机械夹具保持在适当位置。

公开(公告)号：EP2728976A1

公开(公告)日：2014-05-07

申请号：EP13190224.9

申请日：2013-10-25

Applicant: STMicroelectronics S.r.l. ,  Freescale Semiconductor, Inc.

Inventor： Rotigni, Mario ,  Moseley, Richard ,  Bhatt, Piyush ,  Edgington, Gregory C.

IPC: H05K1/02

CPC classification number: H05K1/0231 ,  H05K1/0262 ,  H05K1/0298 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09336 ,  H05K2201/09345

Abstract: It is described a printed circuit board (50). The board comprises a first outer layer (23), a second outer layer (20) and an integrated circuit (2) mounted on the second outer layer. The integrated circuit has a single exposed pad (1) electrically connected to a ground reference, it has a first supply pin (5) electrically connected to a first power supply (VCC1) and it has a second supply pin (105) electrically connected to a second power supply, wherein the first power supply is configured to generate a first supply current with frequency components higher than the frequency components of a second supply current generated by the second power supply. The board further comprises a first decoupling capacitor (3) mounted on the second outer layer in the proximity of the first supply pin (5), the first decoupling capacitor having a first terminal (8) electrically connected with the first supply pin (5) and having a second terminal (9), it comprises an inner layer (21) interposed between the first outer layer (23) and the second outer layer (20), the inner layer comprising a metal layer (4) electrically connected to said ground reference, it comprises a first Via (7-1) configured to electrically connect the exposed pad (1) with the metal layer (4) of the inner layer, it comprises a second Via (6) configured to electrically connect the second terminal (9) of the first decoupling capacitor with the metal layer (4) of the inner layer and it comprises a second decoupling capacitor (173) having a first pin (278) electrically connected to the second power supply and having a second pin (279) electrically connected to said ground reference.

Abstract translation: 描述了印刷电路板（50）。 板包括安装在第二外层上的第一外层（23），第二外层（20）和集成电路（2）。 集成电路具有电连接到接地基准的单个裸露焊盘（1），其具有电连接到第一电源（VCC1）的第一电源引脚（5），并且其具有电连接到 第二电源，其中所述第一电源被配置为产生具有高于由所述第二电源产生的第二电源电流的频率分量的频率分量的第一电源电流。 该板还包括安装在第二外层附近的第一电源引脚（5）的第一去耦电容器（3），第一去耦电容器具有与第一电源引脚（5）电连接的第一端子（8） 并且具有第二端子（9），其包括介于所述第一外层（23）和所述第二外层（20）之间的内层（21），所述内层包括电连接到所述地面的金属层（4） 参考，它包括被配置为将暴露的焊盘（1）与内层的金属层（4）电连接的第一通孔（7-1），其包括构造成电连接第二端子的第二通孔（6） 第一去耦电容器与内层的金属层（4）的第二去耦电容器（173），并且其包括第二去耦电容器（173），其具有电连接到第二电源并具有第二引脚（279）的第一引脚（278） 电连接到所述接地基准。