公开(公告)号：EP0575292B1

公开(公告)日：1996-03-13

申请号：EP93810414.8

申请日：1993-06-09

Applicant: DYCONEX PATENTE AG

Inventor： Schmidt, Walter, Dr. ,  Martinelli, Marco

IPC: H05K3/00 ,  H05K3/42

CPC classification number: H05K3/42 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

公开(公告)号：EP0610631A1

公开(公告)日：1994-08-17

申请号：EP93310547.0

申请日：1993-12-24

Applicant: AT&T GLOBAL INFORMATION SOLUTIONS INTERNATIONAL INC. ,  HYUNDAI ELECTRONICS AMERICA ,  SYMBIOS LOGIC INC.

Inventor： Crafts, Harold S. ,  Thornberg, Gary R.

IPC: H01L23/498 ,  H05K1/11

CPC classification number: H05K1/141 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0289 ,  H05K3/4602 ,  H05K2201/049 ,  H05K2201/09945 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2201/10704 ,  H01L2924/00

Abstract: An electrical connector for connecting an integrated circuit (IC) to a receptacle such as a socket includes a base module to which is attached an IC module. The base module contains, on one surface, pins for insertion into the socket, and, on another surface, base pads, which are connected to the pins by conductors located inside the base module. A custom IC module is then formed on the base module. The base pads connect electrically with respective larger pads in the IC module to ensure good electrical contact despite size variations which may exist in the base module. The IC module contains IC pads on an external surface, which connect with the base pads by way of internal interconnections constructed into the IC module. An integrated circuit (IC) is bonded to the IC pads. The base module is formed from a ceramic material and the IC module is formed from a polymer material, such as polyimide.

Abstract translation: 用于将集成电路（IC）连接到诸如插座的插座的电连接器包括附接有IC模块的基座模块。 基座模块在一个表面上包含用于插入插座的插脚，并且在另一个表面上包括基座垫，基座垫通过位于基座模块内部的导线连接到插脚。 然后在基本模块上形成定制IC模块。 基座与IC模块中的相应较大的焊盘电连接以确保良好的电接触，尽管可能存在于基座模块中的尺寸变化。 IC模块在外表面上包含IC焊盘，IC焊盘通过构建到IC模块中的内部互连与基板焊盘连接。 集成电路（IC）粘合到IC焊盘。 基础模块由陶瓷材料形成，并且IC模块由诸如聚酰亚胺的聚合物材料形成。

公开(公告)号：EP0560072A2

公开(公告)日：1993-09-15

申请号：EP93102182.8

申请日：1993-02-11

Applicant: NITTO DENKO CORPORATION

Inventor： Higashi, Kazumi, c/o NITTO DENKO CORPORATION ,  Mochizuki, Amane, c/o NITTO DENKO CORPORATION ,  Maeda, Masako, c/o NITTO DENKO CORPORATION

IPC: H01L23/498 ,  H01L21/48 ,  H01R4/04

CPC classification number: H05K3/321 ,  H01L23/49827 ,  H01L2224/83101 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K2201/0154 ,  H05K2201/09945 ,  H05K2201/10378

Abstract: An anisotropic electrically conductive adhesive film (1) having fine through holes (2) independently electroconductively passing through an insulating film in the thickness direction, at least one end portion of both the end portions of the each through hole on the front and back surfaces of said film being blocked with a bump-form metal projection (4) having a larger base area than the area of the opening portion of the through hole, wherein the insulating film comprises a thermoplastic polyimide resin having a melt viscosity at 400°C of not higher than 1×10⁸ poise is disclosed. The film is interposed between materials to be connected to provide a connection structure.

Abstract translation: 具有在厚度方向独立地通过绝缘膜的细孔（2）的各向异性导电粘合膜（1），前后表面上的每个通孔的两端部的至少一个端部 所述膜被具有比通孔开口部分的面积大的基底面积的凸块状金属突起（4）阻挡，其中绝缘膜包括不在400℃下的熔体粘度的热塑性聚酰亚胺树脂 高于1×10 8泊。 该膜介于待连接的材料之间以提供连接结构。

公开(公告)号：EP0518701A3

公开(公告)日：1993-04-21

申请号：EP92305443.1

申请日：1992-06-12

Applicant: APTIX CORPORATION

Inventor： Osann, Robert, Jr. ,  Shaw, George A., Jr. ,  Mohsen, Amr M.

IPC: G06F15/60 ,  H05K1/00

CPC classification number: H01L23/5382 ,  H01L2224/49171 ,  H01L2924/10253 ,  H05K1/0289 ,  H05K1/112 ,  H05K2201/09945 ,  H05K2201/10689 ,  H05K2203/175 ,  H01L2924/00

Abstract: The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customised pattern of bonding pads is then formed over the one or both surface of the substrate which correspond to the terminal footprints of specific surface mounted packages intended to be mounted on the substrate. A generalised pattern of bonding pads may also be formed on the surface of the substrate for electrically connecting terminals of bare dice thereto by means of thin wire. All bonding pads are electrically connected to one or more vias by direct electrical contact or by a conductive trace extending from the bonding pad to a nearly via.

Abstract translation: 本发明使用具有位于其一个或两个表面上的多个导电和可互连通孔的可编程互连基板。 然后在衬底的一个或两个表面上形成定制的焊盘图案，该表面对应于期望安装在衬底上的特定表面安装封装的端子脚印。 也可以在基板的表面上形成接合焊盘的一般化图案，用于通过细线电连接裸芯片的端子。 所有接合焊盘通过直接电接触或通过从接合焊盘延伸到几乎通孔的导电迹线而电连接到一个或多个通孔。

公开(公告)号：EP0232127A3

公开(公告)日：1988-09-21

申请号：EP87300770

申请日：1987-01-29

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： HAGIWARA, YOSHICHI C/O MINNESOTA MINING AND ,  TANAKA, KENJI C/O MINNESOTA MINING AND ,  KIMURA, NAOYA C/O MINNESOTA MINING AND ,  EMORI, KENJI C/O MINNESOTA MINING AND ,  KAWAMOTO, YOSHITAKA C/O MINNESOTA MINING AND

IPC: H01R11/01 ,  H01R4/04 ,  H05K3/32 ,  H01R23/68 ,  H05K3/40

CPC classification number: H01R4/04 ,  H01R12/7076 ,  H05K3/323 ,  H05K2201/09945 ,  H05K2201/1025

Abstract: The present invention provides an anisotropic electrically-conductive film connector comprising a conductive layer (2) and an adhesive layer (1) provided on at least one surface of the conductive layer, the conductive layer having a plurality of conductive elements (3) electrically independent of each other, wherein, each of the conductive elements comprises a metal material having a substantially uniform thickness.
The present invention also provides an anisotropic electrically-conductive film connector which has a metal material which is uneven on its junction side surface.

公开(公告)号：EP0134623B1

公开(公告)日：1988-08-10

申请号：EP84303778.9

申请日：1984-06-05

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. Minnesota Mining and ,  Thompson, Kenneth C. Minnesota Mining and

IPC: H01L23/48 ,  H01L21/68

CPC classification number: H05K3/323 ,  H01L21/302 ,  H01L23/3737 ,  H01L23/4828 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/27003 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0218 ,  H05K2201/09945 ,  H05K2203/0156 ,  H05K2203/0425 ,  H05K2203/0435 ,  H05K2203/066 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/00014

公开(公告)号：EP0154909A3

公开(公告)日：1986-07-16

申请号：EP85102330

申请日：1985-03-01

Applicant: HOECHST AKTIENGESELLSCHAFT

Inventor： Seibel, Markus, Dr. Dipl.-Chem.

IPC: H05K03/42

CPC classification number: B05D5/12 ,  H05K1/0287 ,  H05K1/05 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/108 ,  H05K3/426 ,  H05K3/427 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2203/1394

Abstract: Es wird ein Verfahren zur Herstellung von durchkontak tierten elektrischen Leiterplatten beschrieben, bei dem eine Platte aus Isolierstoffmaterial mit in rasterartigem Muster angeordneten Durchkontaktierungslöchern versehen wird, deren Wandungen mit einer Metallschicht überzogen wer den und die auf mindestens einer Seite mit einer leitfähigen Metallschicht bedeckt wird. Die Metallschicht wird nach dem Metallisieren der Löcher bildmässig abgedeckt, und die nicht abgedeckten Bereiche der Metallschicht werden entweder durch Metallablagerung verstärkt oder durch Ät zen entfernt. Zugleich mit der Metallschicht wird ein Teil der Löcher in der Weise abgedeckt, dass im fertigen Pro dukt nur der gewünschte Anteil aller Löcher als Leitkontakt wirksam wird. Das Verfahren erlaubt die Fertigung von vor gebohrtem bzw. vorgelochtem und vormetallisiertem Ba sismaterial für gedruckte Schaltungen in Grosserie.

Abstract translation: 描述了一种用于制造通孔电镀印刷电路板的方法，其中绝缘材料的基板设置有以栅格图案布置的电镀通孔，并且其壁被涂覆有导电 金属层。 该板在其至少一侧覆盖有导电金属层。 在金属化孔之后，金属层被成像地覆盖，未被覆盖的金属层的区域通过金属沉积或通过蚀刻去除而增强。 与金属层一起，部分孔被覆盖，使得只有所有孔的所需部分用作最终产品中的导电连接。 本发明的方法允许大规模制造用于印刷电路的预钻孔或预先预先金属化的基底材料。

公开(公告)号：EP0134623A2

公开(公告)日：1985-03-20

申请号：EP84303778.9

申请日：1984-06-05

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. Minnesota Mining and ,  Thompson, Kenneth C. Minnesota Mining and

IPC: H01L23/48 ,  H01L21/68

CPC classification number: H05K3/323 ,  H01L21/302 ,  H01L23/3737 ,  H01L23/4828 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/27003 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0218 ,  H05K2201/09945 ,  H05K2203/0156 ,  H05K2203/0425 ,  H05K2203/0435 ,  H05K2203/066 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/00014

Abstract: The adhesive layer of the novel transfer tape contains electrically and thermally conductive particles such as silver which are preferably spherical and are larger than the thickness of the adhesive between particles. When used to bond two rigid substrates together, pressure is applied to the substrates to flatten the particles to the thickness of the adhesive between particles, thus making good electrical and thermal connection between the substrates through each particle.

Abstract translation: 新型转移带的粘合剂层包含优选为球形且比颗粒之间的粘合剂的厚度大的导电和导热颗粒，例如银。 当将两个刚性基板粘合在一起时，将压力施加到基板上以将颗粒平坦化到颗粒之间的粘合剂的厚度，从而通过每个颗粒在基板之间形成良好的电和热连接。

公开(公告)号：EP2997627A4

公开(公告)日：2017-02-22

申请号：EP14797227

申请日：2014-05-14

Applicant: MC10 INC

Inventor： HSU YUNG-YU ,  WORK JOHN ,  DOWLING KEVIN J

IPC: H05K1/02 ,  A61B5/00 ,  H01L23/14 ,  H01L23/538 ,  H05K1/18

CPC classification number: H05K1/0283 ,  A61B5/0059 ,  A61B5/6846 ,  A61B2562/164 ,  H01L23/145 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2924/15791 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945

公开(公告)号：EP3054543A4

公开(公告)日：2016-12-21

申请号：EP14860440

申请日：2014-10-15

Applicant: AUTONETWORKS TECHNOLOGIES LTD ,  SUMITOMO WIRING SYSTEMS ,  SUMITOMO ELECTRIC INDUSTRIES

Inventor： HACHIYA YOSHIKAZU

IPC: H02G3/08 ,  B60R16/023 ,  B60R16/03 ,  H05K1/02 ,  H05K3/10 ,  H05K3/22 ,  H05K3/24 ,  H05K3/46

CPC classification number: B60R16/03 ,  B60R16/0239 ,  H02G3/081 ,  H02G3/088 ,  H05K1/0256 ,  H05K1/0265 ,  H05K3/103 ,  H05K3/24 ,  H05K3/4617 ,  H05K3/4626 ,  H05K2201/09063 ,  H05K2201/09945 ,  H05K2201/10272

Abstract: Provided is an electrical junction box having a novel structure capable of preventing vehicle fire after the infiltration of water without depending on a waterproofing structure of the electrical junction box. An electrical junction box (10) includes a bus bar circuit unit (12) obtained by arranging a plurality of bus bars (28a to 28g) including a power source-side bus bar (28c) to be connected to a power source line and a ground-side bus bar (28d) to be connected to a ground line on insulated boards (26a, 26b). In the electrical junction box (10), the power source-side bus bar (28c) and the ground-side bus bar (28d) are arranged adjacent to each other, and an oxide deposition inhibiting structure (42) is provided in exposed portions (44a to 44c) of the insulated board (26a) exposed through a gap between the power source-side bus bar (28c) and the ground-side bus bar (28d).