公开(公告)号：EP3143849A1

公开(公告)日：2017-03-22

申请号：EP15709451.7

申请日：2015-03-05

申请人： Auto-Kabel Management GmbH ,  Tazarine, Wacim ,  Betscher, Simon ,  Gronwald, Frank ,  Rafati, Sohejl

发明人： TAZARINE, Wacim ,  BETSCHER, Simon ,  GRONWALD, Frank ,  RAFATI, Sohejl

IPC分类号： H05K1/14 ,  H05K1/05 ,  H05K1/02 ,  B60R16/03 ,  F02N11/08

CPC分类号： H05K1/14 ,  F02N11/0862 ,  F02N11/087 ,  F02N2011/0874 ,  F02N2250/02 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/0287 ,  H05K1/056 ,  H05K1/09 ,  H05K1/111 ,  H05K1/142 ,  H05K1/145 ,  H05K2201/04 ,  H05K2201/06 ,  H05K2201/07 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272

摘要： Circuit arrangement for motor vehicles, comprising at least one semiconductor component (30) and at least one first metal carrier plate (2a) and one metal printed circuit board (2b). Versatile use is possible when the carrier plate (2a) is electrically insulated and at a distance from the printed circuit boards (2b), and the carrier plate (2a) is electrically connected to at least one of the printed circuit boards (2b) by means of at least one semiconductor component (30), so that the carrier plate (2a) and the printed circuit boards (2b) form an electrical triple pole.

摘要翻译： 具有至少一个半导体元件30和至少一个第一金属载体板2a和金属电路板2b的车辆的电路布置。 如果承载板2a与电路板2b电绝缘并且载体板2a通过至少一个半导体器件30与至少一个电路板2b电连接，则提供了多方面的应用范围，使得载体 板2a和电路板2b形成电三极。

公开(公告)号：EP3134253A2

公开(公告)日：2017-03-01

申请号：EP15818955.5

申请日：2015-04-21

申请人： Cornell University

发明人： MACCURDY, Robert ,  LIPSON, Hod

IPC分类号： B29C67/00

CPC分类号： H05K1/185 ,  A61B17/50 ,  B29C64/00 ,  B29C65/16 ,  B29L2031/34 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01L21/56 ,  H01L21/67115 ,  H01L21/67132 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/112 ,  H01L25/18 ,  H01L25/50 ,  H01L27/01 ,  H01L27/13 ,  H05K1/0287 ,  H05K1/113 ,  H05K1/115 ,  H05K1/117 ,  H05K1/14 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/125 ,  H05K3/284 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4673 ,  H05K3/4697 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10189 ,  H05K2201/10636 ,  H05K2203/107 ,  H05K2203/1327

摘要： A hybrid additive manufacturing approach that incorporates three-dimensional (3D) printing and placement of modules selected from a library of modules to fabricate an electromechanical assembly. By virtue of fabrication of the electromechanical assembly, mechanical properties and electrical properties of the assembly are created. The invention overcomes the material and process limitations of current printable electronics approaches, enabling complete, complex electromechanical assemblies to be fabricated.

摘要翻译： 一种混合添加剂制造方法，其结合从模块库中选择的模块的三维（3D）打印和放置，以制造机电组件。 通过机电组件的制造，产生了组件的机械特性和电性能。 本发明克服了当前可印刷电子方法的材料和工艺限制，使得能够制造完整的复杂机电组件。

公开(公告)号：EP3016140A1

公开(公告)日：2016-05-04

申请号：EP15192107.9

申请日：2015-10-29

申请人： Nichia Corporation

发明人： Nakabayashi, Takuya

IPC分类号： H01L25/075 ,  F21S8/10 ,  H05K1/11 ,  H01L33/38 ,  H01L33/62 ,  H05K1/02

CPC分类号： H01L33/62 ,  B60Q1/1423 ,  B60Q1/16 ,  B60Q2300/42 ,  B60Q2300/45 ,  F21S41/143 ,  F21S41/18 ,  F21S41/663 ,  F21Y2105/10 ,  F21Y2105/12 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/10 ,  H01L33/38 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/0287 ,  H05K1/111 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

摘要： A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.

摘要翻译： 发光器件包括衬底，多个第一布线构件，多个第二布线构件和多个发光元件。 第一布线构件沿第一方向延伸。 第二配线构件沿第二方向延伸。 每个第二布线构件被分割成多个第二布线部分。 发光元件沿第二方向设置。 发光元件的第一电极连接到相应的一个第一布线构件。 发光元件的第二电极具有连接到第一连接部的第一连接部和第二连接部。 第一连接部分和第二连接部分连接到相应的一个第二布线部件，并沿第二方向桥接至少两个分段的第二布线部分。

公开(公告)号：EP2698836A1

公开(公告)日：2014-02-19

申请号：EP12180925.5

申请日：2012-08-17

申请人： Nederlandse Organisatie voor Toegepast -Natuurwetenschappelijk Onderzoek TNO ,  Koninklijke Philips N.V.

发明人： Young, Edward Willem Albert ,  Hermes, Dorothee Christine ,  Toonen, Leonardus Maria ,  Lifka, Herbert

IPC分类号： H01L51/52 ,  H05K3/20 ,  H05K1/16 ,  H01L27/32 ,  H05K1/02 ,  H05K1/03

CPC分类号： H01L51/5212 ,  B32B15/04 ,  B32B2307/202 ,  B32B2457/00 ,  B32B2457/12 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/5203 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/56 ,  H01L2251/5338 ,  H01L2251/5361 ,  H05K1/0265 ,  H05K1/0274 ,  H05K1/0287 ,  H05K1/0393 ,  H05K1/16 ,  H05K3/20 ,  H05K2201/0195 ,  H05K2201/09681

摘要： The foil according to the present invention comprises a substrate (10) carrying an electrically conductive structure (20). The electrically conductive structure (20) is embedded in a barrier layer structure (30) having a first inorganic layer (32), a second inorganic layer (34) and an organic layer (36) between said inorganic layers, and the organic layer is partitioned by the electrically conductive structure into organic layer portions (36a). The electrically conductive structure comprises an enclosing mesh (24) and a plurality of mutually insulated electrically conductive elements (22a, 22b). The enclosing mesh (24) encloses mutually separate zones (26a, 26b) wherein respective ones of the mutually insulated electrically conductive elements (22a, 22b) are arranged.

摘要翻译： 根据本发明的箔包括承载导电结构（20）的基底（10）。 导电结构（20）嵌入在所述无机层之间具有第一无机层（32），第二无机层（34）和有机层（36）的阻挡层结构（30）中，有机层为 由导电结构分隔成有机层部分（36a）。 导电结构包括封闭网（24）和多个相互绝缘的导电元件（22a，22b）。 封闭的网状物24包围相互分离的区域26a，26b，其中布置相互绝缘的导电元件22a，22b中的各自的区域。

公开(公告)号：EP2237649A3

公开(公告)日：2012-10-31

申请号：EP10003032.9

申请日：2010-03-23

申请人： Phoenix Contact GmbH & Co. KG

发明人： Kiefer, Arno

IPC分类号： H05K1/02 ,  H03H1/00

CPC分类号： H03H7/427 ,  H03H1/0007 ,  H05K1/023 ,  H05K1/0233 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09954 ,  H05K2201/1003 ,  H05K2201/1006

摘要： Beschrieben und dargestellt ist ein Filter, insbesondere zur Filterung von elektromagnetischen Störungen, mit einem Basiselement (2), mit mindestens einem elektrischen Filterbauelement (3, 4) und mit mindestens zwei Eingangs-Anschlusskontakten (5) und mindestens zwei Ausgangs-Anschlusskontakten (6) zum Anschluss der Leiter einer elektrischen Leitung, wobei die Eingangs-Anschlusskontakte (5) über auf dem Basiselement (2) angeordnete Leiterpfade (7) mit den Ausgangs-Anschlusskontakten (6) verbunden sind.
Bei dem erfindungsgemäßen Filter ist eine einfache Konfiguration und eine flexible Anwendung dadurch sichergestellt, dass in jedem Leiterpfad (7) mindestens zwei Längskontakte (8) vorgesehen sind, über die ein Filterbauelement (3, 4) derart mit einem Leiterpfad (7) elektrisch verbindbar ist, dass die elektrische Verbindung des Leiterpfades (7) zwischen den beiden Längskontakten (8) über das Filterbauelement (3, 4) führt, und dass in den Leiterpfaden (7) jeweils mindestens ein Querkontakt (9) vorgesehen ist, so dass zwei Leiterpfade (7) über ein Filterbauelement (3, 4) elektrisch miteinander verbunden sind, wenn das Filterbauelement (3, 4) mit den Querkontakten (9) der beiden Leiterpfade (7) elektrisch verbunden ist.

公开(公告)号：EP2499886A1

公开(公告)日：2012-09-19

申请号：EP10801586.8

申请日：2010-12-29

申请人： O-Flexx Technologies Gmbh

发明人： ULLAND, Holger, Albert

IPC分类号： H05K3/04 ,  B23C1/04 ,  B44B3/02

CPC分类号： H05K3/043 ,  B23C3/305 ,  H01L35/32 ,  H01L35/34 ,  H05K1/0287 ,  H05K1/16 ,  H05K2201/09681 ,  H05K2201/10219

摘要： The invention relates to a method and device for structuring, in a plurality of separated regions, an electrically conductive layer arranged on an electrically insulating substrate. In order to allow an inexpensive structuring of short process duration of the layer (2) arranged on the substrate (1) both in a movement direction of the substrate (11) and transversely thereto in a plurality of regions separated from each other, according to the invention a relative movement of at least one of the cutting tools (5, 18) in the plane of the layer from which material is to be removed is generated with the aid of a positioning system (20), in that the at least one cutting tool (18) is moved transversely to the movement direction of the substrate, wherein the cutting tool moving transversely to the movement direction of the substrate is moved by the positioning system at the same time as the substrate with a corresponding speed and in a corresponding movement direction.

公开(公告)号：EP1653787B1

公开(公告)日：2011-08-10

申请号：EP05292274.7

申请日：2005-10-27

申请人： JTEKT Corporation

发明人： Temba, Koji, c/o Koyo Seiko Co., Ltd.

IPC分类号： H05K1/00

CPC分类号： H01L21/485 ,  H01L23/5382 ,  H01L2924/0002 ,  H05K1/0287 ,  H05K1/0289 ,  H05K3/328 ,  H05K2201/09681 ,  H05K2201/09945 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00

公开(公告)号：EP2069842A1

公开(公告)日：2009-06-17

申请号：EP07814735.2

申请日：2007-09-07

申请人： 3M Innovative Properties Company

发明人： AELING, Ellen O. ,  DAVID, John R. ,  MEIS,Michael A. ,  STEELMAN, Ronald S.

IPC分类号： G02B6/12 ,  G02B6/42

CPC分类号： F21V19/0015 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21K9/90 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/60 ,  H05K1/0287 ,  H05K1/11 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/063 ,  Y10T156/10

摘要： The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

摘要翻译： 本公开一般涉及照明装置及其制造方法。 该器件特别地包括第一导体层，第一绝缘体层，其设置在第一导体层上，并且具有通过第一绝缘体层限定在其中的至少一个第一孔;第二导体层，设置在第一绝缘体层上并具有 至少一个第二孔，通过第二导体层限定在其中并被定位成与至少一个第一孔对准;以及光操纵层，其设置在第二导体层上并且具有通过光操纵层限定在其中的至少一对孔，包括 第三孔和第四孔，其中所述第三孔定位成与所述至少一个第二孔和第一孔对准。

公开(公告)号：EP0766907B1

公开(公告)日：1999-11-17

申请号：EP95923890.8

申请日：1995-06-16

申请人： Sheldahl, Inc.

发明人： ROBERTS, Sidney, J. ,  SELBITSCHKA, Eugene, T. ,  GENGEL, Glenn, W. ,  SWEITZER, Brent, N.

IPC分类号： H05K1/00 ,  H05K3/42

CPC分类号： H05K3/426 ,  H05K1/0287 ,  H05K1/0393 ,  H05K3/0017 ,  H05K3/022 ,  H05K3/064 ,  H05K3/388 ,  H05K3/4076 ,  Y10S428/901 ,  Y10T29/49167 ,  Y10T428/24273 ,  Y10T428/24347 ,  Y10T428/264 ,  Y10T428/31681 ,  Y10T428/31688

摘要： A metallized laminate material (10) for the manufacture of high performance, high density printed wiring boards and the like includes an ordered distribution of via holes (25) electrically interconnecting opposing conductive layers (32, 34) on a dielectric polymeric film substrate (20). Furthermore, opposing photoresist layers (42, 44) substantially cover the conductive layers and vias. The conductive material in the conductive layers (32, 34) and the vias (35) is bonded adhesivelessly to the substrate (20) to provide a high degree of delamination resistance. The production of metallized laminate material (10) is preferably carried out in a roll-to-roll process suitable for high volume, low cost production. In use, an end user may manufacture customized printed wiring boards in small volume runs from the laminate material (10) with a reduced amount of equipment, expertise and cost.

公开(公告)号：EP0875936A3

公开(公告)日：1999-05-26

申请号：EP98303441.4

申请日：1998-05-01

申请人： SHINKO ELECTRIC INDUSTRIES CO. LTD.

发明人： Horiuchi, Michio, c/o Shinko Electric Ind. Co. Ltd ,  Takeuchi, Yukiharu, Shinko Electric Ind. Co. Ltd

IPC分类号： H01L23/498 ,  H01L21/48

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/13 ,  H01L23/15 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32188 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0287 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A wiring substrate is provided in which a common core member is used and the cost can be reduced. Diameters of the penetrating filled vias (18) are the same and not more than 300 µm, and the penetrating filled vias (18) are formed on a core substrate (20) into a matrix-shape at regular intervals of not more than 2 mm. On the surface of the core substrate (20), a plane wiring pattern (17) is formed through an insulating layer (16). Each pad portion on the wiring pattern (17) is electrically connected with each corresponding via of the filled vias (18) by one to one through a connecting via (28) which penetrates the insulating layer (16), and some of the filled vias (18) are not connected with the wiring pattern (17).