公开(公告)号：EP1774584A2

公开(公告)日：2007-04-18

申请号：EP05766971.5

申请日：2005-07-06

Applicant: EPCOS AG

Inventor： BRUNNER, Sebastian ,  FEICHTINGER, Thomas ,  PUDMICH, Günter ,  SCHLICK, Horst ,  SCHMIDT-WINKEL, Patrick

IPC: H01L21/60

CPC classification number: H05K3/4061 ,  H01L2924/0002 ,  H05K3/248 ,  H05K3/28 ,  H05K2201/035 ,  Y10T29/49155 ,  H01L2924/00

Abstract: The invention relates to a method for the production of an electric component (1). Said method consists of the following steps; A) a ceramic base body (5) which comprises a through-contact (10) and at least one metal surface (20C) which is connected in an electrically conductive manner to the through-contact, is prepared. In step B), one first electrically insulating material is arranged in a layered manner on the surface of the base body and at least over the through-contact, and subsequently in step C) an electrically conductive second material is applied over the through-contact (10). In step D) a soldering contact (30B) is formed by means of hardening, said soldering contact binding, in an electrically conductive manner, the through-contact (10) through the passivation layer (25B) which is formed from a first material by means of sintering.

公开(公告)号：EP1667206A1

公开(公告)日：2006-06-07

申请号：EP05257178.3

申请日：2005-11-22

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Borland, William J.

IPC: H01L21/00 ,  H01G4/12 ,  H05K1/16

CPC classification number: H05K1/162 ,  H01L27/013 ,  H05K1/092 ,  H05K3/1291 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2203/1126 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/49156

Abstract: The invention provides a method of making a capacitor comprising: providing a metallic foil; forming a capacitor dielectric over said metallic foil; forming a first electrode over a portion of said capacitor dielectric, thus forming a component side of said metallic foil; laminating the component side of said metallic foil to a laminate material; and etching said metallic foil outside the boundary of said capacitor dielectric to form a second electrode. Using this method allows the laminate material to prevent etching solutions from coming in contact with and damaging the capacitor dielectric layers.

Abstract translation: 本发明提供一种制造电容器的方法，包括：提供金属箔; 在所述金属箔上形成电容器电介质; 在所述电容器电介质的一部分上形成第一电极，从而形成所述金属箔的部件侧; 将所述金属箔的组件侧层压到层压材料上; 以及在所述电容器电介质的边界之外蚀刻所述金属箔以形成第二电极。 使用该方法允许层压材料防止蚀刻溶液与电容器电介质层接触并损坏电容器电介质层。

公开(公告)号：EP1501104A1

公开(公告)日：2005-01-26

申请号：EP04012945.4

申请日：2004-06-01

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Tanaka, Koichi

IPC: H01C17/22 ,  H01C17/24 ,  H05K1/16

CPC classification number: H01C17/24 ,  H01C17/22 ,  H05K1/167 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/171

Abstract: A circuit board high in reliability and a method for manufacturing the circuit board are provided. The electrical resistance is accurately adjustable without damaging the circuit body even if it is made of resinous material and is free from a change over time. A circuit board in which a resistor (16) consisting of a resistor paste is printed between electrodes (14a) formed on a circuit pattern (14) printed on a printed circuit board (11), wherein a conductor (18) for adjusting the electrical resistance value of the resistor is coated on the surface of the resistor.

Abstract translation: 提供了高可靠性的电路板和制造电路板的方法。 电阻精确可调，即使是由树脂材料制成，也不会随时间变化而损坏电路体。 一种电路板，其中，在印刷在印刷电路板（11）上的电路图案（14）上形成的电极（14a）之间印刷由电阻膏组成的电阻器（16），其中，用于调节电气 电阻器的电阻值涂覆在电阻器的表面上。

公开(公告)号：EP0609861B1

公开(公告)日：2004-10-06

申请号：EP94101559.6

申请日：1994-02-02

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Nakamura, Yoshifumi ,  Bessho, Yoshihiro ,  Yuhaku, Satoru ,  Hakotani, Yasuhiko ,  Itagaki, Minehiro ,  Miura, Kazuhiro

IPC: H01L21/48

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L21/4867 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/035 ,  H05K2201/0367 ,  Y10T29/49163 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00014

公开(公告)号：EP1278405A4

公开(公告)日：2004-09-15

申请号：EP01270088

申请日：2001-12-04

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： TAKENAKA TOSHIAKI ,  NISHII TOSHIHIRO ,  SUGITA YUICHIRO ,  NAKAMURA SHINJI ,  KOMODA HIDEAKI ,  KONDO TOSHIKAZU

IPC: B05D7/00 ,  B05C11/04 ,  B05D7/24 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4069 ,  H05K1/095 ,  H05K3/1233 ,  H05K3/247 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2203/1461 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multi-layer circuit board producing method comprising a hole-forming step in which a sheet-like board material (1) is formed with through or non-through holes and a filling step in which the through or non-through holes (3) formed in the hole- forming step are filled with a paste (7) by use of a filling means, wherein in the filling step, the paste is supplemented with a second paste (11) for supplementary purposes by using a paste supplementing means, whereby the viscosity of the paste is stabilized to improve the fillability of paste into the through or non-through holes.

公开(公告)号：EP1426978A1

公开(公告)日：2004-06-09

申请号：EP02765342.7

申请日：2002-08-21

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： YORITA, Jun c/o SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  INAZAWA, Shinji c/o SUMITOMO ELECTRIC IND. LTD. ,  MAJIMA, Masatoshi c/o SUMITOMO ELECTRIC IND., LTD. ,  KASHIHARA, Hideki c/o SUMITOMO ELECTRIC IND., LTD. ,  SAKAMOTO, Toshihiro c/o SUMITOMO ELECTRIC IND. LTD ,  TOSHIOKA, Hideaki c/o SUMITOMO ELECTRIC IND., LTD.

IPC: H01B1/22 ,  H01B5/00 ,  H01B5/16 ,  H01L21/283 ,  H01L21/288 ,  C25D1/08 ,  C25D7/00

CPC classification number: H05K3/205 ,  C25D1/08 ,  C25D1/10 ,  C25D5/022 ,  H01L21/283 ,  H01L21/2885 ,  H05K3/202 ,  H05K3/323 ,  H05K2201/035

Abstract: The present invention provides with a conductive paste capable of further reducing the electrical resistance of a conductive film or the like, a conductive film having an anisotropic conductivity, a plating method for forming a plated coating having a uniform crystal structure throughout, and a production method of producing a fine metal component having good properties.
A conductive paste is such that metal powder having the form of fine metal particles being linked in a chain shape is blended. A conductive film is such that chain-shaped metal powder having paramagnetism is oriented in a constant direction by applying a magnetic filed to a coating film by the application of the conductive past. A plating method grows a plated coating by electroplating on the conductive film made of the conductive paste. A production method of a fine metal component which selectively grows a plated coating 4' on a conductive film 1 exposed at a portion of a fine pass-hole pattern in a mold 3 to product a fine metal component.

Abstract translation: 本发明的具有能够进一步降低一个导电电影等，具有各向异性导电性，用于形成在整个具有均匀晶体结构的镀膜的镀敷方法，和制造方法的导电膜的电阻的导电膏提供 生产的具有良好性能的细金属组分。 的导电性糊剂是寻求做具有金属微粒的形式在链形状被链接金属粉末混合。 导电膜正寻求做链形，具有顺磁性金属粉末在一定方向通过施加磁场到涂膜通过导电过去的面向应用的。 的电镀方法通过电镀在由所述导电浆料的导电电影生长的镀膜。 细金属部件，其选择性地生长在导电膜-1中的模具3以细通孔图案的一部分暴露于产品的精细金属成分的镀膜4”的制造方法。

公开(公告)号：EP0845807B1

公开(公告)日：2003-01-29

申请号：EP97120112.4

申请日：1997-11-17

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Sato, Tomotoshi

IPC: H01L21/60 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/3457 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L24/98 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/81191 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0445 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP1100298A1

公开(公告)日：2001-05-16

申请号：EP00917296.6

申请日：2000-04-12

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： SEGAWA, Shigetoshi ,  OCHI, Hiroshi

IPC: H05K3/40 ,  H05K1/11 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24

CPC classification number: H01L21/486 ,  H05K1/0306 ,  H05K3/248 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/035

Abstract: A method of manufacturing a ceramic board includes two process steps; applying a first conductor paste in a recess occurred in each via-hole of the ceramic substrate after conductor materials are filled in the via-holes and fired, and forming a surface circuit by printing a second conductor paste for forming the surface circuit. A viscosity of the first conductor paste is lower than that of the second conductor paste. With the prevent invention, there is good conduction between the surface circuit and the conductor in each via-hole, and further a printing pattern of the surface circuit around each via-hole has high accuracy. As a result, the highly reliable ceramic circuit board, which is adequate to a high-density circuit, can be provided.

Abstract translation: 制造陶瓷板的方法包括两个工艺步骤： 在将导体材料填充到通孔中之后，在陶瓷基板的每个通孔中施加第一导体膏在凹部中发生烧结，并通过印刷用于形成表面电路的第二导体糊形成表面电路。 第一导体糊的粘度低于第二导体糊的粘度。 通过防止发明，每个通孔中的表面电路和导体之间具有良好的导通性，并且每个通孔周围的表面电路的印刷图案也具有高精度。 结果，可以提供足够高密度电路的高度可靠的陶瓷电路板。

公开(公告)号：EP1081990A2

公开(公告)日：2001-03-07

申请号：EP00250275.5

申请日：2000-08-11

Applicant: Micro-Tec Company, Ltd.

Inventor： Sano, Yasushi, c/o Micro-Tec Company, Ltd.

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/1132 ,  H01L2224/11901 ,  H01L2924/00013 ,  H05K3/1216 ,  H05K3/3452 ,  H05K2201/035 ,  H05K2203/043 ,  H01L2224/29099

Abstract: This invention provides screen printing for forming a higher solder ball (bump). In first printing step, a first solder layer is printed. After drying in drying step, a second solder layer is printed on the first solder layer in second printing step. Then, in re-flow processing step, re-flow processing is performed, and the first solder layer and the second solder layer are melted. Finally, the melted layer is solidified in a ball shape to form the solder ball (bump). Since solder paste is printed in layers, an amount of the solder paste can be increased. Hence, a higher solder ball (bump) can be formed.

Abstract translation: 本发明提供了用于形成较高焊球（凸块）的丝网印刷。 在第一印刷步骤中，印刷第一焊料层。 在干燥步骤中干燥后，在第二印刷步骤中将第二焊料层印刷在第一焊料层上。 然后，在再流程处理工序中，进行再流程处理，第一焊料层和第二焊料层熔融。 最后，将熔融层固化成球状，形成焊球（凸块）。 由于焊膏被分层印刷，所以可以增加焊膏的量。 因此，可以形成更高的焊球（凸起）。

公开(公告)号：EP0815591A4

公开(公告)日：1999-01-07

申请号：EP96923183

申请日：1996-02-06

Applicant: GRUMMAN AEROSPACE CORP

Inventor： KOH WEI H ,  MCCAUSLAND CONNIE S

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H01L21/60 ,  H01L23/04 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0094 ,  H05K3/4061 ,  H05K2201/035 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present upon the substrate prevents degradation of the thin conductive film. Subsequent processing of the gold paste assures the integrity and reliability thereof. Thus, the gold paste provides enhanced conductivity and improved reliability, as compared to contemporary thin-film vias.