公开(公告)号：EP2148393A4

公开(公告)日：2012-03-28

申请号：EP08752686

申请日：2008-05-14

申请人： HITACHI CHEMICAL CO LTD

发明人： KOJIMA KAZUYOSHI ,  KOBAYASHI KOUJI ,  ARIFUKU MOTOHIRO ,  MOCHIZUKI NICHIOMI

IPC分类号： C09J9/02 ,  H01B1/22 ,  H05K3/32

CPC分类号： H05K3/323 ,  C08K7/16 ,  C08K9/02 ,  C09J9/02 ,  C09J11/02 ,  H01B1/02 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/13016 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/2989 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R4/04 ,  H01R12/714 ,  H01R13/03 ,  H05K3/361 ,  H05K2201/0221 ,  Y10T428/2998 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 µm and the thickness of the metal layer being 65-125 nm.

公开(公告)号：EP2416634A1

公开(公告)日：2012-02-08

申请号：EP10171612.4

申请日：2010-08-02

申请人： ATOTECH Deutschland GmbH

发明人： Matejat, Kai-Jens ,  Lamprecht, Sven ,  Ewert, Ingo

IPC分类号： H05K3/34 ,  H01L21/60

CPC分类号： H05K3/3473 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/03825 ,  H01L2224/03826 ,  H01L2224/0401 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/11462 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11622 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13399 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/054 ,  H05K2203/0577 ,  H01L2924/00

摘要： Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate (102) including a permanent resin layer (103) on top of at least one contact area (101) and a temporary resin layer (104) on top of the permanent resin layer (103), ii) contact the entire substrate area including the at least one contact area (101) with a solution suitable to provide a conductive layer (106) on the substrate surface, iii) electroplate a solder deposit layer (107) containing tin or a tin alloy onto the conductive layer (106) and iv) etch away an amount of the solder deposit layer (107) containing tin or a tin alloy sufficient to remove the solder deposit layer (107) from the temporary resin layer (104) area leaving a solder material layer (107) on the at least one contact area (101).

摘要翻译： 描述了一种在基板上形成焊料沉积物的方法，包括以下步骤：i）提供在至少一个接触区域（101）和临时树脂层（104）之上包括永久树脂层（103）的基板（102） ）在所述永久性树脂层（103）的顶部上，ii）使包括所述至少一个接触区域（101）的整个基板区域与适合于在所述基板表面上提供导电层（106）的溶液接触，iii）电镀 包含锡或锡合金的焊料沉积层（107）到所述导电层（106）上并且iv）蚀刻掉足以移除所述焊料沉积层（107）的含锡或锡合金的所述焊料沉积层（107） 从所述临时树脂层（104）区域在所述至少一个接触区域（101）上留下焊料材料层（107）。

公开(公告)号：EP2399284A2

公开(公告)日：2011-12-28

申请号：EP10704716.9

申请日：2010-02-17

申请人： Advanced Micro Devices, Inc.

发明人： SU, Michael ,  KUECHENMEISTER, Frank ,  BRAVO, Jaime

IPC分类号： H01L21/56 ,  H01L23/31

CPC分类号： H01L23/3142 ,  H01L21/563 ,  H01L23/3171 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： Various semiconductor chip reinforcement structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip (15) that has a side (40) and forming a polymer layer (60) on the side (40). The polymer layer (60) has a central portion (65) and a first frame portion (70) spatially separated from the central portion (65) to define a first channel (80).

公开(公告)号：EP2387477A1

公开(公告)日：2011-11-23

申请号：EP10700308.9

申请日：2010-01-04

申请人： Robert Bosch GmbH

发明人： RITTNER, Martin ,  GUENTHER, Michael

IPC分类号： B22F1/00 ,  H01L21/60

CPC分类号： B22F1/0014 ,  B22F1/0003 ,  B22F1/007 ,  B22F2998/10 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29384 ,  H01L2224/29387 ,  H01L2224/294 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/33181 ,  H01L2224/83138 ,  H01L2224/83203 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10338 ,  H01L2924/12043 ,  H01L2924/15787 ,  Y10T428/25 ,  B22F1/0062 ,  B22F1/025 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/053 ,  H01L2924/01015 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： The invention relates to a sintered material comprising metallic structure particles provided with an organic coating. It is envisaged in accordance with the invention that metallic and/or ceramic auxiliary particles (7) with a non-organic coating, which do not outgas in the course of the sintering process, are provided. The invention further relates to a sintered bond (1) and to a process for producing a sintered bond (1).

公开(公告)号：EP2380415A1

公开(公告)日：2011-10-26

申请号：EP09835798.1

申请日：2009-12-22

申请人： Megica Corporation

发明人： LIN, Mou-shiung ,  LEE, Jin-Yuan

IPC分类号： H05K3/42

CPC分类号： H01L23/5329 ,  H01L23/642 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T307/406 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/04953 ,  H01L2924/01004

摘要： Chip packages having power management integrated circuits are described. Power management integrated circuits can be combined with on-chip passive devices, and can provide voltage regulation, voltage conversion, dynamic voltage scaling, and battery management or charging. The on-chip passive devices can include inductors, capacitors, or resistors. Power management using a built-in voltage regulator or converter can provide for immediate adjustment of the voltage range to that which is needed. This improvement allows for easier control of electrical devices of different working voltages and decreases response time of electrical devices. Related fabrication techniques are described.

摘要翻译： 描述具有功率管理集成电路的芯片封装。 电源管理集成电路可与片上无源器件相结合，可提供电压调节，电压转换，动态电压调节，电池管理或充电。 片上无源器件可以包括电感器，电容器或电阻器。 使用内置电压调节器或转换器的电源管理可以立即调整电压范围至所需电压范围。 这种改进允许更容易地控制不同工作电压的电气装置并减少电气装置的响应时间。 描述相关的制造技术。

公开(公告)号：EP2343734A1

公开(公告)日：2011-07-13

申请号：EP09807568.2

申请日：2009-06-12

申请人： Panasonic Corporation

发明人：

IPC分类号： H01L21/52 ,  H01L23/48

CPC分类号： C22C1/002 ,  H01L23/49513 ,  H01L23/49562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/48739 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/00012

摘要： A semiconductor device includes a die pad having a surface on which a first solder bonding layer is formed, and made of metal; and a semiconductor element fixed on the first solder bonding layer on the die pad by a solder material made mostly of bismuth. The first solder bonding layer is made of a softer material than the solder material, a recess is formed in a part of the first solder bonding layer by pressing the solder material against the first solder bonding layer, and the solder material partially fills the recess.

摘要翻译： 一种半导体器件，包括：管芯焊盘，具有形成有第一焊料接合层的表面并由金属制成; 以及通过主要由铋制成的焊料材料固定在管芯焊盘上的第一焊料结合层上的半导体元件。 所述第一焊料接合层由比所述焊料材料更软的材料制成，通过将所述焊料材料压向所述第一焊料接合层而在所述第一焊料接合层的一部分中形成凹部，并且所述焊料材料部分地填充所述凹部。

公开(公告)号：EP1843280B1

公开(公告)日：2011-04-13

申请号：EP07075543.4

申请日：2001-02-21

申请人： TORAY ENGINEERING CO., LTD.

发明人： Akita, Masanori ,  Ito, Koji ,  Mori, Toshihiro ,  Nogami, Yoshio ,  KURAMOTO, Yoshio

IPC分类号： G06K19/077

CPC分类号： G06K19/07722 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/05155

公开(公告)号：EP1810338A4

公开(公告)日：2011-02-23

申请号：EP05817063

申请日：2005-10-21

申请人： SILICONIX TECHNOLOGY C V

发明人： CARTA ROSSANO ,  BELLEMO LAURA ,  MERLIN LUIGI

IPC分类号： H01L29/15 ,  H01L23/31

CPC分类号： H01L29/872 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/12 ,  H01L24/15 ,  H01L24/34 ,  H01L24/37 ,  H01L29/0619 ,  H01L29/1608 ,  H01L29/402 ,  H01L29/417 ,  H01L29/47 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/37124 ,  H01L2224/37599 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10272 ,  H01L2924/12032 ,  H01L2924/13032 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP2012352A1

公开(公告)日：2009-01-07

申请号：EP07738740.5

申请日：2007-03-15

申请人： Murata Manufacturing Co. Ltd.

发明人： FUNAKI, Tatsuya Murata Manufacturing Co., Ltd.

IPC分类号： H01L21/60

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0331 ,  H01L2224/03505 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/1131 ,  H01L2224/11332 ,  H01L2224/11505 ,  H01L2224/1155 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/16501 ,  H01L2224/245 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/76155 ,  H01L2224/81055 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81379 ,  H01L2224/81594 ,  H01L2224/81639 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/8284 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/19041 ,  Y10S977/779 ,  H01L2924/00014 ,  H01L2924/0543 ,  H01L2924/20107 ,  H01L2924/01014

摘要： There are provided an electronic element having a connection portion at which an electrode having a surface composed of at least Al or an alloy and a metal nanoparticle sintered body is connected to each other, an electronic element device using the same, and a manufacturing method thereof.
In an electronic element including an electronic element base and electrodes each of which has a first electrode having a surface composed of at least Al or an Al alloy and a second electrode composed of a metal nanoparticle sintered body and bonded to the first electrode, a bonding interface between the first electrode and the second electrode has a multilayer structure including, from the side of the first electrode to the side of the second electrode, (a) a first layer primarily composed of Al, (b) a second layer primarily composed of an Al oxide, (c) a third layer primarily composed of an alloy of Al and a constituent element of metal nanoparticles, and (d) a fourth layer primarily composed of the constituent element of the metal nanoparticles.

摘要翻译： 提供一种具有连接部分的电子元件，其中具有至少包含Al或合金的表面的电极和金属纳米颗粒烧结体彼此连接，使用该连接部分的电子元件装置及其制造方法 。 在包括电子元件基底和电极的电子元件中，每个电极具有至少具有Al或Al合金的表面的第一电极和由金属纳米颗粒烧结体组成并结合到第一电极的第二电极， 所述第一电极和所述第二电极之间的界面具有多层结构，所述多层结构包括从所述第一电极侧到所述第二电极侧，（a）主要由Al组成的第一层，（b）主要由 Al氧化物，（c）主要由Al和金属纳米颗粒的构成元素的合金组成的第三层，以及（d）主要由金属纳米颗粒的构成元素组成的第四层。

公开(公告)号：EP1746868A1

公开(公告)日：2007-01-24

申请号：EP06014910.1

申请日：2006-07-18

申请人： SEIKO EPSON CORPORATION

发明人： Hashimoto, Nobuaki, c/o Seiko Epson Corp.

IPC分类号： H05K1/16

CPC分类号： H05K3/061 ,  H01L23/5228 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13644 ,  H01L2224/13666 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01066 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K2203/063 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method for an electronic substrate (121), includes: preparing a substrate (121) and a mask (22) having a predetermined region; forming a wiring pattern (20,21) on the substrate (121); forming an aperture portion (22a) in the predetermined region of the mask (22); affixing the mask (22) on the substrate (121); and removing at least a part of the wiring pattern (20,21) through the aperture portion (22a) of the mask (22) thereby forming the electronic element on the substrate (121).

摘要翻译： 在用于电子基板的制造方法（121），包括：制备具有预定区域的衬底（121）和掩膜（22）; 形成在基板（121）的布线图案（20,21）; 在掩模的规定区域开口部分（22a）的形成（22）; 在基板（121）上粘贴掩模（22）; 和除去至少通过所述掩模（22）的开口部分（22a）的布线图案（20,21）的一部分，从而形成在基板（121）的电子元件。