Abstract:
The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.
Abstract:
The present invention provides an electric connector for an endoscope, an endoscope, and a method for assembling an electric connector which make it possible to simplify work operations such as operation checks and repairs of the endoscope, as well as to reduce the time for the work operations. An endoscope in accordance with the present invention has an insertion portion, an operation portion provided at a proximal end portion of the insertion portion, and a connection cable connected to the operation portion and having an electric connector at a proximal end thereof. The endoscope has a cable wire which is inserted through the endoscope and extends from the electric connector toward a distal end and a connector to which an end portion of the cable wire is releasably connected.
Abstract:
The invention relates to the throughplating of flexible printed boards, wherein two electrically conductive layers (2, 3) located on surfaces opposite each other are electrically connected to one another, wherein the printed board (1) is cut through using a simple cutting tool with the purpose of producing an opening (7, 8). A defined amount of a conductive material is then optionally placed in the through hole (7, 8).
Abstract:
The invention seeks to provide a non-contact communication medium suitable for facilitating the production and for preventing cracking in a loop antenna. A loop antenna 20 is formed on one side 11 of a circuit board 10 and an IC chip 30 is mounted on the one side 11 of the circuit board 10. An inner end of the loop antenna 20 is connected to an antenna connection terminal 31 of the IC chip 30. An arm part 40 provided with a pad part 41, a pad part 42, and a conducting wire 43 for allowing conduction between the pad part 41 and the pad part 42 is collapsibly provided in such a manner that, when the arm part 40 is collapsed, an outer end of the loop antenna 20 contacts the pad part 41 and an antenna connection terminal 32 of the IC chip 30 contacts the pad part 42.
Abstract:
A rechargeable type small electric appliance including a rechargeable battery supplied by a charging circuit, both within a casing, having a battery outlet covered by a lid is described. Means are provided for preventing operation of the charging circuit whilst it is open. In one embodiment this is by relative positioning of the power supply socket and the lid so as to prevent simultaneous charging and opening of the lid, whilst in other embodiments it is by physical integration of the power supply socket and the lid, or location of a power supply switch which must be "OFF" in order to remove the lid.
Abstract:
A rechargeable type small electric appliance including a rechargeable battery supplied by a charging circuit, both within a casing, having a battery outlet covered by a lid is described. Means are provided for preventing operation of the charging circuit whilst it is open. In one embodiment this is by relative positioning of the power supply socket and the lid so as to prevent simultaneous charging and opening of the lid, whilst in other embodiments it is by physical integration of the power supply socket and the lid, or location of a power supply switch which must be "OFF" in order to remove the lid.
Abstract:
This invention provides a high-density planar contact array capable of interconnecting various electronic devices using a pad to pad approach or pad to pin, and which is capable of accommodating non-coplanarity in the Z axis of printed circuit boards but which still maintains good electrical contact. The array comprises a flat, flexible insulative substrate sheet that has a plurality of parallel conductive lines or an array of circles or polygons of which each has had insulative material surrounding or on at least two sides of the conductive lines or polygons removed in the Z axis. The insulative material is removed in such a way as to create a generally trapezoid shape having a greater lenght side opposite the conductor when viewed through a cross section of the X or Y axis. This trapezoid shape allows free Z axis motion while limiting X and Y axis motion.
Abstract:
A process is disclosed for manufacturing printed circuit boards, printed circuit foils and semifinished products for printed circuit boards and printed circuit foils from blanks with electroconductive layers (7, 8) that may be structured into conductive patterns and substrates (4) that may be structured for forming connecting means (V), profiles (K) and conductive patterns (L). The connecting means (V), profiles (K) and conductive patterns (L) are structured at the same time or in the same process steps on the blanks. The connecting means (V) and the profiles (K) are part of the structured substrate (4) of the blanks. The electric or mechanical connecting means (V) are placed in a position in which they may be connected and the finished conductive patterns (L) may be detached around the profiles (K).
Abstract:
Bei einem Gerät (1) mit mindestens einer an einer Leiterplatte (14) angebrachten Batterie (12, 13) weist die Leiterplatte (14) von derselben wegbrechbare Trägerbereiche (23, 24, 25, 26) auf, mit denen von den Polen (15, 16, 17, 18) der Batterie (12, 13) abstehende Lötfahnen (19, 20, 21, 22) über je eine Lötverbindung (27) fest verbunden sind. Hierbei ist jeder Trägerbereich (23, 24, 25, 26) der Leiterplatte (14) von der übrigen Leiterplatte (14) ringsum umgeben und ist zwischen jedem Trägerbereich (23, 24, 25, 26) und der übrigen Leiterplatte (14) ein den betreffenden Trägerbereich (23, 24, 25, 26) teilweise umschließender Durchbruch (28, 29, 30, 31) vorgesehen und ist jeder Trägerbereich (23, 24, 25, 26) über einen zwischen den beiden Enden (32, 33, 34, 35, 36, 37, 38, 39) eines Durchbruches (28, 29, 30, 31) liegenden Verbindungsabschnitt (40, 41, 42, 43) der Leiterplatte (14) mit der übrigen Leiterplatte (14) verbunden.