Wired Circuit Board
    71.
    发明公开
    Wired Circuit Board 有权
    有线电路板

    公开(公告)号:EP1991040A2

    公开(公告)日:2008-11-12

    申请号:EP08155950.2

    申请日:2008-05-09

    Abstract: The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.

    Abstract translation: 布线电路基板具备金属支承基板,形成在该金属支承基板上的金属箔,以覆盖金属箔的方式形成在金属支承基板上的第一绝缘层,以及形成在第一绝缘层上的导电图案, 多根导线。 金属箔沿着每根电线的长度方向布置,以便不在厚度方向上与电线的一部分相对,并且在厚度方向上与电线的其余部分相对。

    Non-contact communication medium
    74.
    发明公开
    Non-contact communication medium 有权
    Vorrichtung zur kontaktlosenDatenübertragung

    公开(公告)号:EP1416581A1

    公开(公告)日:2004-05-06

    申请号:EP03256530.1

    申请日:2003-10-16

    Inventor: Takei, Yoshiki

    Abstract: The invention seeks to provide a non-contact communication medium suitable for facilitating the production and for preventing cracking in a loop antenna.
    A loop antenna 20 is formed on one side 11 of a circuit board 10 and an IC chip 30 is mounted on the one side 11 of the circuit board 10. An inner end of the loop antenna 20 is connected to an antenna connection terminal 31 of the IC chip 30. An arm part 40 provided with a pad part 41, a pad part 42, and a conducting wire 43 for allowing conduction between the pad part 41 and the pad part 42 is collapsibly provided in such a manner that, when the arm part 40 is collapsed, an outer end of the loop antenna 20 contacts the pad part 41 and an antenna connection terminal 32 of the IC chip 30 contacts the pad part 42.

    Abstract translation: 环形天线(20)的内端连接到设置用于通信的集成电路(IC)芯片(30)的天线连接端子(31)。 提供具有导线(43)以允许焊盘部分(41,42)之间导通的臂部分(40),使得当臂部被折叠时,天线的外端接触焊盘部分(41)和连接 端子接触焊盘部分(42)。

    PLANAR CABLE ARRAY
    77.
    发明授权
    PLANAR CABLE ARRAY 失效
    带状电缆

    公开(公告)号:EP0699354B1

    公开(公告)日:1997-08-06

    申请号:EP94908751.4

    申请日:1994-02-09

    Inventor: SPENCER, Mark

    Abstract: This invention provides a high-density planar contact array capable of interconnecting various electronic devices using a pad to pad approach or pad to pin, and which is capable of accommodating non-coplanarity in the Z axis of printed circuit boards but which still maintains good electrical contact. The array comprises a flat, flexible insulative substrate sheet that has a plurality of parallel conductive lines or an array of circles or polygons of which each has had insulative material surrounding or on at least two sides of the conductive lines or polygons removed in the Z axis. The insulative material is removed in such a way as to create a generally trapezoid shape having a greater lenght side opposite the conductor when viewed through a cross section of the X or Y axis. This trapezoid shape allows free Z axis motion while limiting X and Y axis motion.

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