公开(公告)号：EP0130430B1

公开(公告)日：1988-03-16

申请号：EP84106836.4

申请日：1984-06-15

Applicant: International Business Machines Corporation

Inventor： Willie, Goff, Jr.

IPC: H05K3/46 ,  H05K3/08

CPC classification number: H05K3/08 ,  H05K1/09 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/0323 ,  H05K2201/09609 ,  H05K2201/10378 ,  Y10T29/49004 ,  Y10T29/49126

公开(公告)号：EP0086961A3

公开(公告)日：1986-03-19

申请号：EP83100521

申请日：1983-01-21

Applicant: MUPAC CORPORATION

Inventor： Leary, Burton ,  Silverio, Shaun

IPC: H05K03/46 ,  H01R23/72

CPC classification number: H05K3/4641 ,  H05K1/0231 ,  H05K1/0287 ,  H05K1/162 ,  H05K3/222 ,  H05K2201/0191 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2201/10333

Abstract: A panel board has a first voltage layer sandwiched between two ground layers at a close spacing to produce a large distributed capacitance; the two ground layers are connected by plated-through conductive holes spaced regularly across the board; a second (exposed) voltage layer is connected by regularly spaced plated-through holes to the first voltage layer, increasing the current carrying capacity of, and reducing the resistance across, the board; the plated-through holes are arranged in rows and columns in a pattern permitting the mounting of decoupling capacitors, at any point on the board, in a position parallel to the rows or parallel to the columns; and a socket terminal can be electrically connected directly to the exposed voltage layer or to the exposed ground layer using a ring connector.

公开(公告)号：EP0074303B1

公开(公告)日：1986-02-26

申请号：EP82401565.5

申请日：1982-08-23

Applicant: Rouge, François

Inventor： Rouge, François

IPC: H05K1/00 ,  H05K3/46

CPC classification number: H05K1/0287 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/09609 ,  H05K2201/09945

公开(公告)号：EP0137694A2

公开(公告)日：1985-04-17

申请号：EP84305874.4

申请日：1984-08-29

Applicant: UNISYS CORPORATION

Inventor： Barrow, Michael

IPC: H05K3/46 ,  H01P3/08 ,  H05K3/30

CPC classification number: H01P3/081 ,  H01P3/088 ,  H05K1/0237 ,  H05K1/024 ,  H05K1/0289 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/0191 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09609

Abstract: A multilayer printed circuit board for TTL logic components provides an approximate 100 ohm characteristic impedance between external microstrip signal lines and internal ground and voltage planes. The addition of two internal microstrip signal plane lines permits a much greater interconnectability capability and also saves a large percentage of spatial area for component mounting while still maintaining the 100 ohm impedance characteristic.

Abstract translation: 用于TTL逻辑元件的多层印刷电路板在外部微带信号线和内部接地和电压平面之间提供约100欧姆的特性阻抗。 两条内部微带信号平面线的添加允许更大的互连能力，并且还可以节省用于部件安装的大部分空间面积，同时仍保持100欧姆的阻抗特性。

公开(公告)号：EP2809135B1

公开(公告)日：2017-07-19

申请号：EP14170461.9

申请日：2014-05-29

Applicant: Mavel S.r.l. ,  IFP Énergies nouvelles

Inventor： Bettoni, Davide ,  Stirano, Giorgio

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0204 ,  H05K1/0206 ,  H05K1/0265 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/42 ,  H05K2201/09236 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2201/0979 ,  H05K2201/10022 ,  H05K2201/10053 ,  H05K2201/10166

Abstract: What is described is an electronic device (1) comprising a power component (3) and a printed circuit board (2) . The power component comprises a main body (30) and a lead (31) . The printed circuit board comprises at least two conductive layers (21) parallel to a plane xy, a mounting element (23) and a conductor (24) . The mounting element and the conductor respectively comprise first (23b) and second (24b) conductive tubes, which elongate through a thickness of the printed circuit board along a direction z substantially perpendicular to the plane xy. The main body of the power component is fixed to the mounting element, while the lead thereof is fixed to the conductor.

Abstract translation: 所描述的是包括功率部件（3）和印刷电路板（2）的电子设备（1）。 功率元件包括主体（30）和引线（31）。 印刷电路板包括至少两个平行于平面xy的导电层（21），安装元件（23）和导体（24）。 安装元件和导体分别包括第一导电管（23b）和第二导电管（24b），其沿着基本上垂直于平面xy的方向z延伸穿过印刷电路板的厚度。 功率元件的主体固定在安装元件上，而其引线固定在导体上。

公开(公告)号：EP2801123A4

公开(公告)日：2015-10-21

申请号：EP12864500

申请日：2012-11-01

Applicant: CRAY INC

Inventor： KIM HYUNJUN ,  CONGER JEFFREY SCOTT ,  SCOTT GREGORY ERWIN

IPC: H05K1/02 ,  H01R12/57

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165

公开(公告)号：EP2829163A2

公开(公告)日：2015-01-28

申请号：EP13711574.7

申请日：2013-03-19

Applicant: Giesecke & Devrient GmbH

Inventor： BALDISCHWEILER, Michael ,  BOHN, Carsten

IPC: H05K1/11 ,  H05K3/40 ,  G06K19/077 ,  H05K1/09 ,  H05K1/16 ,  H05K3/12 ,  H05K3/00

CPC classification number: H05K1/116 ,  G06K19/0772 ,  G06K19/07754 ,  H05K1/092 ,  H05K1/165 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/4069 ,  H05K2201/0266 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/09854 ,  H05K2201/10098 ,  H05K2203/1453

Abstract: A substrate (1) for a portable data carrier (10) comprises an electrical component (2, 3), such as an antenna, which has two parts applied on mutually opposite surfaces of the substrate (1). The parts of the electrical component (2, 3) comprise an electrically conductive material and are electrically conductively connected to one another in through-plating regions (4, 5, 6, 7) of the substrate (1) through perforations (8, 13) of the substrate (1). The perforations (8, 13) are produced by means of a laser and have a maximum width of a maximum of 20 μm. A through-plating region (4, 5, 6, 7) preferably has a multiplicity of perforations (8, 13) distributed over the through-plating region (4, 5, 6, 7).

Abstract translation: 用于便携式数据载体（10）的基板（1）包括诸如天线的电气部件（2,3），其具有施加在基板（1）的相互相对的表面上的两个部分。 电气部件（2,3）的部件包括导电材料，并且通过穿孔（8,13）在基板（1）的穿镀区域（4,5,6,7）中彼此导电地连接 ）的基板（1）。 穿孔（8,13）通过激光产生，最大宽度最大为20um。 穿透区域（4,5,6,7）优选地具有分布在通镀区域（4,5,6,7）上的多个穿孔（8,13）。

公开(公告)号：EP2628065A1

公开(公告)日：2013-08-21

申请号：EP10778850.7

申请日：2010-10-13

Applicant: Sony Ericsson Mobile Communications AB

Inventor： MORÄN, Jonas ,  KLEVERMAN, Mats

IPC: G06F3/02 ,  H03K17/96 ,  H05K3/42

CPC classification number: G06F3/0202 ,  H03K17/9645 ,  H05K1/0275 ,  H05K1/053 ,  H05K1/115 ,  H05K1/116 ,  H05K1/162 ,  H05K1/167 ,  H05K3/0026 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/445 ,  H05K2201/0108 ,  H05K2201/0376 ,  H05K2201/09545 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/0999 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/107

Abstract: An electronic device comprises a housing having an outer face and an inner face. A key is provided on the housing, which comprises a micro hole formed in the housing and a conductive material extending within the micro hole to the outer face of the housing. A sensor is coupled to the conductive material to detect whether an object is brought into contact or out of contact with the micro hole at the outer face.

Abstract translation: 一种电子设备，包括具有外表面和上内面的壳体。 一个关键的设置在外壳，它包括一个微孔在壳体和导电材料的微孔到所述外壳的外表面内延伸而形成上。 传感器被耦合到所述导电材料以检测被接触或不与在外表面上的微孔接触的是否为对象。

公开(公告)号：EP2454781A4

公开(公告)日：2013-01-16

申请号：EP09847410

申请日：2009-07-14

Applicant: SAAB AB

Inventor： VICKES HANS-OLOF ,  KRISTIANSSON SIMON

IPC: H01P1/203 ,  H01P5/02 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0251 ,  H01P1/20372 ,  H01P5/028 ,  H05K1/0222 ,  H05K1/0227 ,  H05K1/0239 ,  H05K2201/09609 ,  H05K2201/0979

Abstract: A filter unit and a corresponding printed circuit board. The filter unit and the printed circuit board have been equipped with modified end portions being matched such that a number of filter units can be used on the printed circuit board without changing the printed circuit board.

公开(公告)号：EP2146557B1

公开(公告)日：2012-05-16

申请号：EP09164411.2

申请日：2009-07-02

Applicant: Thales Holdings UK Plc

Inventor： Lawson, Graham ,  Loiselet, Emmanuel

IPC: H05K1/02

CPC classification number: H05K1/0222 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/09236 ,  H05K2201/09481 ,  H05K2201/09536 ,  H05K2201/09609 ,  H05K2201/09618 ,  H01L2924/00014

Abstract: An hermetically sealed integrated microwave circuit comprising a coplanar waveguide on a PCB (3, 4) electrically connected on one major surface to an IC, and thermally and electrically connected to a BGA (5) on its opposite major surface, in which the PCB has at least first and second printed layers, a microwave signal path extends from a ball of the BGA through a through-hole in both printed layers to the coplanar wave guide, and plural ground paths extend from balls (51) of the BGA (5) through first through-holes in the first printed layer of the PCB and through second through-holes of the second printed layer of the PCB, the first and second through-holes being non-coincident, to allow for an hermetic seal across the PCB whilst introducing a predetermined impedance in the PCB between the signal and ground paths.