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公开(公告)号：EP1853096A3
公开(公告)日：2009-08-26
申请号：EP06255156.9
申请日：2006-10-05
Applicant: Grote Industries, Inc.
Inventor： Brandt, Bruce B. , Branstetter, Cary D. , Brooks, Timothy W. , Bode, Shane Elizabeth
CPC classification number: H05K3/202 , B60Q2900/10 , F21K9/00 , F21S43/13 , F21S43/14 , F21S43/195 , F21V19/001 , F21Y2115/10 , H05K1/184 , H05K3/326 , H05K2201/0382 , H05K2201/0397 , H05K2201/09118 , H05K2201/10106 , H05K2201/10651
Abstract: Novel arrangements are disclosed that provide for replacement of printed circuit boards useful in regulating current for LEDs. In one embodiment, a conductive track is disclosed that forms a pattern for placement of electrical components. The track can be made out of any suitably conductive material and may be stamped, cut, or formed depending on the material type. The conductive track can conduct both electricity and heat. Portions of the conductive track can be removed creating a gap. Electrical components can be placed along the conductive track spanning the gap to create a circuit path. Other embodiments include wiring harnesses that contain embedded electrical components. The harnesses may occupy less space than some embodiments of the conductive track. An electrical connector may be provided to allow easy replacement of the LED.
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82.发明公开Wiring substrate and semiconductor device and method of manufacturing the same 审中-公开Verdrahtungssubstrat und Halbleitervorrichtung und Verfahren zur Herstellung
公开(公告)号：EP2058859A2
公开(公告)日：2009-05-13
申请号：EP08166935.0
申请日：2008-10-17
Applicant: Shinko Electric Industries Co., Ltd.
Inventor： Sunohara, Masahiro , Machida, Yoshihiro
IPC: H01L23/498
CPC classification number: H01L23/49811 , H01L21/4846 , H01L23/42 , H01L23/49822 , H01L24/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/16152 , H05K1/0271 , H05K1/111 , H05K3/4092 , H05K3/4644 , H05K2201/0133 , H05K2201/0187 , H05K2201/0397 , H05K2201/09036 , H05K2201/10674 , H01L2924/00
Abstract: In a wiring substrate (2) of a semiconductor device (1), a hollow portion (H) is provided under a pad wiring portion (23) including a connection pad (P), and thus a wiring layer (24) has a cantilever structure in which the pad wiring portion (23) is formed as an aerial wiring, and a semiconductor chip (40) is flip-chip connected to the connection pad (P). The pad wiring portion (23) including the connection pad (P) is formed on a sacrifice layer (14) which is filled in a recess portion (C) in an interlayer insulating layer (32) of the wiring substrate (2), then the semiconductor chip (40) is flip-chip connected to the connection pad (P), and then the hollow portion (H) is provided by removing the sacrifice layer (14).
Abstract translation: 在半导体器件（1）的布线基板（2）中，在包括连接焊盘（P）的焊盘布线部分（23）下方设置中空部分（H），因此布线层（24）具有悬臂 结构，其中焊盘布线部分（23）形成为架空布线，并且半导体芯片（40）倒装芯片连接到连接焊盘（P）。 包括连接焊盘（P）的焊盘布线部分（23）形成在填充在布线基板（2）的层间绝缘层（32）中的凹部（C）中的牺牲层（14）上，然后 半导体芯片（40）倒装芯片连接到连接焊盘（P），然后通过去除牺牲层（14）来提供中空部分（H）。
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公开(公告)号：EP1833678A4
公开(公告)日：2009-04-22
申请号：EP05816531
申请日：2005-12-08
Applicant: CANON KK
Inventor： KAWAMURA SHOGO , MORI TOSHIHIRO , FUKAI HISASHI , NAKAJO NAOKI
CPC classification number: H05K3/361 , B41J2/14024 , B41J2/14072 , H05K3/328 , H05K2201/0367 , H05K2201/0397 , H05K2201/10977
Abstract: A liquid discharge recording head includes a recording element with a discharge port for discharging liquid and an electrically connecting portion arranged adjacent to the discharge port and receiving an electric signal for controlling the discharge of the discharge port. The liquid discharge recording head further includes a flexible wiring substrate for covering at least a portion of the recording element. The flexible wiring substrate includes each of a device hole for exposing the discharge port and a bonding hole arranged facing the electrically connecting portion independently. The liquid discharge recording head further includes a sealing agent for covering at least a portion of the electrically connecting portion and filled to at least a portion of the bonding hole. Thus, a liquid discharge recording head that enhances recording performance and that has superior productivity while maintaining reliability of the recording performance is provided.
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84.发明公开Leiterplatte zur Bestückung mit oberflächenmontierten Bauteilen sowie Verfahren dazu 审中-公开Le u u u u u u u u u u u u u u u u u u u u u u u
公开(公告)号：EP1876872A1
公开(公告)日：2008-01-09
申请号：EP06014089.4
申请日：2006-07-07
Applicant: Delphi Technologies, Inc.
Inventor： Reischl, Erik , Leng, Peter
CPC classification number: H05K1/141 , H01H11/0056 , H01H15/005 , H05K1/0263 , H05K3/202 , H05K2201/0397 , H05K2201/049 , H05K2201/09118 , H05K2201/10053 , Y10T29/49121
Abstract: Eine Leiterplatte (3) zur Bestückung mit oberflächenmontierten Bauteilen wird gleichzeitig mit einem Stanzgitter (1) versehen, das dreidimensional ausgeformt und von einem Kunststoff (2) ummantelt ist.
Abstract translation: 板（3）具有由塑料（2）涂覆并布置在板上的三维按压格栅（1）。 接触表面形成在加载高强度电流的按压格栅的表面。 按压格栅受到引导单元的限制，例如 斜面，用于滑动切换单元，并且承载接触销，该接触销布置在与板形成为单件的插入凸缘中。 法兰由塑料制成，斜坡与弹性接触臂一起工作，用于提升和接合接触表面。 还包括用于安装表面安装装置的方法的独立权利要求。
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公开(公告)号：EP1853096A2
公开(公告)日：2007-11-07
申请号：EP06255156.9
申请日：2006-10-05
Applicant: Grote Industries, Inc.
Inventor： Brandt, Bruce B. , Branstetter, Cary D. , Brooks, Timothy W. , Bode, Shane Elizabeth
CPC classification number: H05K3/202 , B60Q2900/10 , F21K9/00 , F21S43/13 , F21S43/14 , F21S43/195 , F21V19/001 , F21Y2115/10 , H05K1/184 , H05K3/326 , H05K2201/0382 , H05K2201/0397 , H05K2201/09118 , H05K2201/10106 , H05K2201/10651
Abstract: Novel arrangements are disclosed that provide for replacement of printed circuit boards useful in regulating current for LEDs. In one embodiment, a conductive track is disclosed that forms a pattern for placement of electrical components. The track can be made out of any suitably conductive material and may be stamped, cut, or formed depending on the material type. The conductive track can conduct both electricity and heat. Portions of the conductive track can be removed creating a gap. Electrical components can be placed along the conductive track spanning the gap to create a circuit path. Other embodiments include wiring harnesses that contain embedded electrical components. The harnesses may occupy less space than some embodiments of the conductive track. An electrical connector may be provided to allow easy replacement of the LED.
Abstract translation: 公开了提供用于更换用于调节LED电流的印刷电路板的新颖布置。 在一个实施例中，公开了形成用于放置电气部件的图案的导电轨道。 轨道可以由任何适当导电的材料制成，并且可以根据材料类型被冲压，切割或形成。 导电轨道可以传导电和热。 可以移除导电轨道的部分，从而产生间隙。 电气部件可以沿着跨越间隙的导电轨道放置以产生电路路径。 其他实施例包括包含嵌入式电气部件的线束。 与导电轨道的一些实施例相比，线束可占据更少的空间。 可以提供电连接器以允许容易地更换LED。
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Patent Agency Ranking86.发明公开Socket and method for connecting electronic components 失效Sockel und Elektronikbauteil-Verbindungsmethode
公开(公告)号：EP1447846A3
公开(公告)日：2007-10-17
申请号：EP04010749.2
申请日：1995-11-13
Applicant: FormFactor, Inc.
Inventor： Khandros, Igor Y. , Mathieu, Gaetan L. , Eldridge, Benjamin, N. , Grube, Gary, W. , Dozier, Thomas, H.
CPC classification number: H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
Abstract: According to the invention a socket is provided for removably connecting a first electronic component (304) to a second electronic component (302). The socket comprises a plurality of elongate, resilient contact structures (320) extending away from a first surface (310a) of a support substrate (310), contact regions (320b) of said elongate, resilient contact structures (320) deflecting to form pressure connections with terminals (308) of the first electronic component (304); and a plurality of contact structures (314) disposed on the opposing surface (310b) of the support substrate (310), the plurality of contact structures permanently connected to terminals of the second electronic component (302), selected ones of the contact structures (314) are connected through the support substrate (310) to selected ones of the elongate, resilient contact structures (320). Each of the plurality of elongate contact structures of the socket comprises an elongate element (122) of a first material; and a second material (124) deposited on the first material, wherein the second material has a yield strength that is greater than a yield strength of the first material. Further a method for removably connecting a first electronic component (304) to a second electronic component (302) is provided.
Abstract translation: 探针卡组件（500）包括探针卡（502）和具有安装到其表面上的端子（522）并且在其表面上从端子（522）延伸的弹性接触结构（524）的空间变换器（506）。 插入器（504）设置在空间变换器和探针卡之间。 空间变压器和插入器堆叠在探针卡上，并且可以布置弹性接触结构以优化整个晶片的探测。
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87.发明公开Method for making a probe card with multiple contact tips for testing integrated circuits 失效用于具有多个接触点用于集成电路的测试的探针卡制造方法
公开(公告)号：EP1408338A3
公开(公告)日：2007-09-26
申请号：EP03027449.2
申请日：1995-11-13
Applicant: FormFactor, Inc.
Inventor： Khandros, Igor Y. , Mathieu, Gaetan L. , Eldridge, Benjamin N. , Grube, Gary W.
CPC classification number: H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
Abstract: A method of producing a tested semiconductor device comprising: providing a probe card assembly, said probe card assembly including a probe card having a plurality of electrical contacts, a probe substrate having a plurality of elongate, resilient probe elements, and a compliant interconnection structure electrically connecting ones of said electrical contacts with ones of said probe elements; providing a plurality of semiconductor devices, each of said semiconductor devices including electrical contact pads; bringing said probe elements into contact with said electrical contact pads of said semiconductor device; and testing said semiconductor devices.
Abstract translation: 探针卡组件（500）包括：探针卡（502），并具有弹性接触结构（524）的空间变换器（506），其安装到和从在其表面上的端子（522）延伸。 内插器（504）的样品在空间转换器和卡之间布置。 空间转换和内插器被堆叠的探针卡上，并且弹性接触结构可被布置成优化整个晶片的探测。
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公开(公告)号：EP1833678A1
公开(公告)日：2007-09-19
申请号：EP05816531.7
申请日：2005-12-08
Applicant: CANON KABUSHIKI KAISHA
Inventor： KAWAMURA, Shogo c/o CANON KABUSHIKI KAISHA, , MORI, Toshihiro c/o CANON KABUSHIKI KAISHA, , FUKAI, Hisashi c/o CANON KABUSHIKI KAISHA, , NAKAJO, Naoki c/o CANON KABUSHIKI KAISHA,
CPC classification number: H05K3/361 , B41J2/14024 , B41J2/14072 , H05K3/328 , H05K2201/0367 , H05K2201/0397 , H05K2201/10977
Abstract: A liquid discharge recording head includes a recording element with a discharge port for discharging liquid and an electrically connecting portion arranged adjacent to the discharge port and receiving an electric signal for controlling the discharge of the discharge port. The liquid discharge recording head further includes a flexible wiring substrate for covering at least a portion of the recording element. The flexible wiring substrate includes each of a device hole for exposing the discharge port and a bonding hole arranged facing the electrically connecting portion independently. The liquid discharge recording head further includes a sealing agent for covering at least a portion of the electrically connecting portion and filled to at least a portion of the bonding hole. Thus, a liquid discharge recording head that enhances recording performance and that has superior productivity while maintaining reliability of the recording performance is provided.
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公开(公告)号：EP1408337A3
公开(公告)日：2007-09-19
申请号：EP03027450.0
申请日：1995-11-13
Applicant: FormFactor, Inc.
Inventor： Khandros, Igor Y. , Mathieu, Gaetan L. , Eldridge, Benjamin N. , Grube, Gary W.
IPC: G01R1/073
CPC classification number: H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
Abstract: A probe card assembly comprising: a probe card comprising a plurality of electrical contacts; a probe substrate having a plurality of elongate, resilient probe elements; a second substrate disposed between and spaced from said probe card and said probe; and a plurality of elongate interconnection elements providing compliant electrical connections through said second substrate between said probe card and said probe substrate and thereby electrically connecting ones of said electrical contacts with ones of said probe elements.
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公开(公告)号：EP1524691A3
公开(公告)日：2007-04-18
申请号：EP04023965.9
申请日：2004-10-07
Applicant: Tyco Electronics Raychem GmbH
Inventor： Frisch, Michael
IPC: H01L23/367
CPC classification number: H05K1/0204 , H01L23/3677 , H01L2924/0002 , H05K2201/0397 , H05K2201/09054 , H05K2201/10166 , H01L2924/00
Abstract: The present invention relates to a power unit comprising at least one power electronics module (106), a circuit carrier (102), which is connected to said power electronics module, and at least one heat sink (114), which is connected to said power electronics module, in order to dissipate heat. The invention also relates to an associated heat sink and a corresponding assembly method. In order to provide a power unit (100) and an associated assembly method which allows improved dissipation of air heat, as well as adequate electrical insulation of the power modules and simplified implementation, the circuit carrier (102) comprises at least one through hole (108). At least one contact extension (118), which is at least partially received by the through hole (108), is moulded onto the heat sink (114), and the contact extension (118) of the heat sink (114) is thermally contacted with the power electronics module (106) by means of a heat-conductive material.
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