公开(公告)号：EP2012569A1

公开(公告)日：2009-01-07

申请号：EP07742024.8

申请日：2007-04-20

Applicant: Ibiden Co., Ltd.

Inventor： KAWAMURA, Yoichiro ,  TANNO, Katsuhiko

IPC: H05K3/34

CPC classification number: B23K3/0623 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2924/00014 ,  H05K3/3478 ,  H05K3/4644 ,  H05K2201/09481 ,  H05K2203/0195 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/53204 ,  Y10T29/53209 ,  Y10T29/53213 ,  H01L2224/05599

Abstract: This invention provides a solder ball loading apparatus which enables fine solder balls to be loaded on pads while void is blocked from being caught into bump upon reflow. Inactive gas is supplied and the inactive gas is sucked from a loading cylinder located above a ball arrangement mask so as to gather solder balls. The gathered solder balls are rolled on the ball arrangement mask by moving the loading cylinder horizontally and the solder balls are dropped onto connecting pads on a multilayer printed wiring board through openings in the ball arrangement mask. Oxidation of the solder balls and mixture of voids upon reflow are prevented by loading the solder balls in the atmosphere of inactive gas.

Abstract translation: 本发明提供了一种焊球加载装置，其使得能够在焊盘上加载精细的焊球，同时在回流时防止空隙被卡入凹陷中。 提供非活性气体，并且从位于球形布置掩模上方的加载圆筒吸入惰性气体，以便聚集焊球。 通过使装载筒水平移动，将聚集的焊球滚动到球形布置掩模上，并且焊球通过球形布置掩模中的开口落到多层印刷线路板上的连接焊盘上。 通过在不活泼气体的气氛中加载焊球来防止焊球和回流时的空隙混合物的氧化。

公开(公告)号：EP1887846A1

公开(公告)日：2008-02-13

申请号：EP06780770.1

申请日：2006-06-28

Applicant: IBIDEN CO., LTD.

Inventor： KAWAMURA, Yoichiro ,  SAWA, Shigeki ,  TANNO, Katsuhiko ,  TANAKA, Hironori ,  FUJII, Naoaki

IPC: H05K3/34 ,  H01L21/60 ,  H05K3/28

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  B23K2201/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad.
In the printed wiring board, since the at least one conductor pad is aligned at a pitch of 200 µm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is within a range of 1.05 to 1.7, connection reliability and insulation reliability can be easily improved.

Abstract translation: 本发明提供一种印刷线路板，其特征在于，具有至少具备一个导体电路的布线基板，设置在该布线基板的表面上的阻焊层，至少一个导体焊盘，该导体焊盘由从设置于该焊料的开口露出的导体电路的一部分形成 抗蚀剂层和用于将电子部件安装在导体焊盘上的至少一个焊料凸块。 在印刷线路板中，由于至少一个导体焊盘以200μm或更小的间距排列，并且焊料凸点的直径W与形成于其中的开口的开口直径D的比率（W / D） 阻焊层在1.05至1.7的范围内，可以容易地改善连接可靠性和绝缘可靠性。

公开(公告)号：EP0817548A1

公开(公告)日：1998-01-07

申请号：EP96942586.7

申请日：1996-12-19

Applicant: IBIDEN CO., LTD.

Inventor： MORI, Yoji ,  KAWAMURA, Yoichiro

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.

Abstract translation: 印刷电路板，其中存在于作为光电二极管的焊盘周围的开口布置成使其不与焊盘重叠，存在于焊盘周围的开口的面积和另一个开口的面积相等，树脂的量 填充在每个开口中或在整个印刷线路板上均匀化，并且设置从每个开口溢出的树脂量或当树脂在每个开口中填充或均匀时。 根据这样的印刷电路板，当通过布置开口来连接设置在形成在印刷线路板上的层间绝缘板上的电路图案和导体焊盘时，可以实现其中安全连接不会导致断开的可靠的印刷线路板 存在于导体焊盘周围，使得其不与导体焊盘重叠，并且基本上均匀地填充在导体焊盘周围的开口中的树脂的量和填充在另一个开口中的树脂的量。

公开(公告)号：EP0804061A1

公开(公告)日：1997-10-29

申请号：EP96907729.6

申请日：1996-03-29

Applicant: IBIDEN CO, LTD.

Inventor： YASUE, Toshihiko ,  HIRAMATSU, Yasuji ,  YANO, Hideki ,  ISHITANI, Yoshifumi ,  KAWAMURA, Yoichiro ,  MURASE, Hideki ,  SUZUKI, Ayumi ,  KAWADE, Masato

IPC: H05K3/46

CPC classification number: H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an insulating layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

Abstract translation: 提供一种具有优异的分辨率，层间绝缘性能和耐冷热冲击性的多层印刷电路板，而不会在表面上形成不均匀性，并且即使树脂绝缘层的厚度较薄，也降低剥离强度。 本发明提出了一种多层印刷电路板，包括上导体电路层，下导体电路层和电绝缘两个导体电路层的树脂绝缘层，其中树脂绝缘层是由绝缘层构成的复合层， 难以溶于作为下层的酸或氧化剂的耐热树脂和由耐热树脂作为上层制成的用于化学镀的粘合剂层，如果需要，树脂填充在导体 电路，以使表面进入与导体电路的表面相同的平面。

公开(公告)号：EP0804061B1

公开(公告)日：2009-05-13

申请号：EP96907729.6

申请日：1996-03-29

Applicant: IBIDEN CO, LTD.

Inventor： YASUE, Toshihiko ,  HIRAMATSU, Yasuji ,  YANO, Hideki ,  ISHITANI, Yoshifumi ,  KAWAMURA, Yoichiro ,  MURASE, Hideki ,  SUZUKI, Ayumi ,  KAWADE, Masato

IPC: H05K3/46

CPC classification number: H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

Abstract: A multilayered printed wiring board having a smooth surface, which can be improved in resolution, interlayer insulating property, or thermal shock resistance without lowering its peel strength even if its insulating resin layer is thin. In the printed wiring board in which the conductor circuits of upper and lower layers are electrically insulated from each other by means of the insulating resin layer, the insulating layer is constituted of a composite layer composed of a lower layer made of a heat-resistant resin which is hardly soluble in an acid or oxidizing agent and an upper layer made of a bonding agent for electroless plating composed of a heat-resistant resin and, as necessary, a recessed section formed between conductor circuits of the lower layer is filled with a resin to the level corresponding to the surfaces of the conductor circuits.

公开(公告)号：EP0883173B1

公开(公告)日：2007-09-12

申请号：EP96930376.7

申请日：1996-09-12

Applicant: IBIDEN CO., LTD.

Inventor： ASAI, Motoo ,  KAWAMURA, Yoichiro ,  MORI, Yoji

IPC: H01L23/12 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49833 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01R12/523 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/114 ,  H05K3/184 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0212 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09727 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A circuit board for mounting electronic parts, which includes first connecting terminal groups (12A and 12B) composed of a plurality of connecting terminals densely formed on the front surface (S1) of a base substrate (2) having through holes (6) and a second connecting terminal group (13) composed of a plurality of connecting terminals formed in at least outer peripheral section on the rear surface (S2) of the substrate (2). The first groups (12A and 12B) are connected to the second group (13) through the holes (6). On the front surface of the substrate (2), build-up multilayered wiring layers (B1 and B2) having via holes (11) are formed and the first groups (12A and 12B) are connected to the second group (13) through the wiring layers (B1 and B2) and through holes (6). In another example, each signal line (52) on the surfaces of the wiring layers (B1 and B2) is composed of a plurality of wiring patterns (58 and 59) having different line widths and a tapered pattern (60) which connects the wiring patterns (58 and 59) to each other and the width of which continuously varies. The line width of the signal line (52) in an area where the wiring density is relatively high is made narrower than that in another area where the wiring density is relatively low.

公开(公告)号：EP0800336A1

公开(公告)日：1997-10-08

申请号：EP96935417.4

申请日：1996-10-23

Applicant: IBIDEN CO., LTD.

Inventor： KAWAMURA, Yoichiro ,  MURASE, Hideki ,  ASAI, Motoo

IPC: H05K3/46

CPC classification number: H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

Abstract: As an object of proposing a resin filler a resin filler suitable for filling in the concave portion created on the surface of the wiring substrate or the through-hole formed in the substrate and a construction of a build-up multilayer printed circuit board having an excellent reliability obtained by smoothening the surface of the substrate filled with the resin filler, this invention proposes a solvent-free resin filler filled in the concave portion created on the surface of the wiring substrate or in the through-holes formed in the substrate, which comprises a bisphenol type epoxy resin as a resin component and an imidazole curing agent as a curing agent, and if necessary, inorganic particles as an additive component, and a build-up multilayer printed circuit board using this resin filler.

Abstract translation: 作为树脂填料的目的，提供一种适于填充在布线基板的表面上形成的凹部的树脂填料或形成在基板中的通孔，以及具有优异的积层多层印刷电路板的结构 通过使填充有树脂填料的基板的表面平滑化获得的可靠性，本发明提出了填充在形成在布线基板的表面上或形成在基板中的通孔中的凹部中的无溶剂树脂填料，其包含 作为树脂成分的双酚型环氧树脂和作为固化剂的咪唑固化剂，以及必要时作为添加剂成分的无机粒子，以及使用该树脂填料的积层多层印刷电路板。

公开(公告)号：EP0817548B1

公开(公告)日：2006-04-05

申请号：EP96942586.7

申请日：1996-12-19

Applicant: IBIDEN CO., LTD.

Inventor： MORI, Yoji ,  KAWAMURA, Yoichiro

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: A printed wiring board (1) such that openings (8L) formed around a pad (12L) which is a photo-via land do not overlap a pad (12L) and the area of each of the openings (8L) around the pad (12L) is equal to that of each of the other openings (8), the amount of resin (13) with which each of the openings (8, 8L) is filled is equal to that with which each of the openings (8L) is filled over the whole wiring board (1), and the amounts of resin (13) overflowing from the openings (8, 8L) are equal to each other. The circuit pattern provided on the upper surface of an interlayer insulating layer formed on the printed wiring board can be connected to a conductor pad area without causing any defective connection, providing a highly-reliable printed wiring board.

公开(公告)号：EP0800336B1

公开(公告)日：2004-09-15

申请号：EP96935417.4

申请日：1996-10-23

Applicant: IBIDEN CO., LTD.

Inventor： KAWAMURA, Yoichiro ,  MURASE, Hideki ,  ASAI, Motoo

IPC: H05K3/46

CPC classification number: H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

公开(公告)号：EP0883173A1

公开(公告)日：1998-12-09

申请号：EP96930376.7

申请日：1996-09-12

Applicant: Ibiden Co., Ltd.

Inventor： ASAI, Motoo ,  KAWAMURA, Yoichiro ,  MORI, Yoji

IPC: H01L23/12 ,  H05K1/03

CPC classification number: H01L23/49833 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01R12/523 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/114 ,  H05K3/184 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0212 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09727 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A board for mounting electronic circuit parts includes a first connection terminal group including a plurality of connection terminals densely formed on the top surface of a substrate having through holes formed therein, and a second connection terminal group including a plurality of connection terminals formed at at least the peripheral portion of a back surface of the substrate. The first connection terminal group is connected to the second connection terminal group by way of the through holes. A build-up multilayer interconnection layer having via holes is formed on the top surface of the substrate, so that the first connection terminal group is connected to the second connection terminal group through the build-up multilayer interconnection layer and the through holes. According to another aspect, each signal line on the top surface of the build-up multilayer interconnection layer comprises a plurality of wiring patterns having different widths and a taper-shaped pattern that connects those wiring patterns together and whose width continuously changes. Each signal line has a smaller width at an area having a relatively high wiring density than at an area having a relatively low wiring density.

Abstract translation: 用于安装电子电路部件的板包括：第一连接端子组，包括密实地形成在其上形成有通孔的基板的顶表面上的多个连接端子，以及包括至少形成有多个连接端子的第二连接端子组 衬底的背面的周边部分。 第一连接端子组通过通孔连接到第二连接端子组。 在基板的顶面形成有具有通孔的积层多层互连层，使得第一连接端子组通过积层多层互连层和通孔与第二连接端子组连接。 根据另一方面，积层多层互连层的顶表面上的每个信号线包括具有不同宽度的多个布线图案和将这些布线图案连接在一起并且其宽度连续变化的锥形图案。 每个信号线在具有比布线密度相对较低的区域具有相对高的布线密度的区域上具有较小的宽度。