公开(公告)号：JP2013078947A

公开(公告)日：2013-05-02

申请号：JP2012208589

申请日：2012-09-21

Applicant: Daikin Industries Ltd ,  ダイキン工業株式会社

Inventor： MURAKAMI TATSUYA ,  YOSHIMOTO HIROYUKI ,  INABA TSUYOSHI ,  SUKEGAWA MASAMICHI ,  YAMAGUCHI YASUYUKI

IPC: B32B15/082 ,  B32B37/00 ,  C08F214/26 ,  C08F216/14 ,  H05K1/03

CPC classification number: H01B13/22 ,  B32B1/08 ,  B32B15/08 ,  B32B15/082 ,  B32B27/08 ,  B32B27/304 ,  B32B27/322 ,  B32B2457/08 ,  C08F114/26 ,  C08F214/262 ,  H05K1/034 ,  H05K3/022 ,  H05K2201/015 ,  Y10T156/10 ,  Y10T428/3154

Abstract: PROBLEM TO BE SOLVED: To provide a laminate body with a metal and a fluorine-containing polymer directly and firmly bonded.SOLUTION: The laminate body has a layer (A) made of a metal and a layer (B) formed on the layer (A). The layer (B) is composed of a copolymer containing a tetrafluoroethylene-based polymerization unit and a perfluoro(alkylvinylether)-based polymerization unit. The copolymer has a carboxyl group at the primary chain terminus, is at least 20 g/10 minutes. in melt flow rate, and is not more than 295°C in melting point. The metal is at least one kind selected from a group consisting of copper, stainless steel, aluminum, iron and alloys of them.

Abstract translation: 要解决的问题：提供一种具有金属和含氟聚合物的层压体，其直接且牢固地结合。 解决方案：层压体具有由金属制成的层（A）和形成在层（A）上的层（B）。 层（B）由含有四氟乙烯系聚合单元和全氟（烷基乙烯基醚）系聚合单元的共聚物构成。 共聚物在一级链末端具有羧基，为至少20g / 10分钟。 熔体流动速率，熔点不高于295℃。 金属是选自由铜，不锈钢，铝，铁及其合金组成的组中的至少一种。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP5124441B2

公开(公告)日：2013-01-23

申请号：JP2008502689

申请日：2007-02-13

Applicant: Agcセイミケミカル株式会社

Inventor： 涼 平林

IPC: B23K35/36 ,  B23K1/00 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K3/3489 ,  B23K35/3613 ,  H05K3/3452 ,  H05K2201/015

公开(公告)号：JP2012243923A

公开(公告)日：2012-12-10

申请号：JP2011112037

申请日：2011-05-19

Applicant: Fujikura Ltd ,  株式会社フジクラ

Inventor： WATANABE HIROTO

IPC: H05K3/46

CPC classification number: H05K1/024 ,  H05K1/0219 ,  H05K1/0393 ,  H05K3/4635 ,  H05K2201/0141 ,  H05K2201/015

Abstract: PROBLEM TO BE SOLVED: To achieve a flexible printed circuit that allows for high density and excellent high-frequency properties by using thermosetting adhesive as interlayer adhesive, and by achieving a wiring board of a specific characteristic impedance at a narrower circuit width with less costs.SOLUTION: A flexible printed circuit 100 is formed by performing thermocompression bonding after first and second unit substrates 1 and 2 are disposed so that surfaces 11a and 21b are opposed to each other, and an adhesive layer 30 is formed by applying epoxy-based thermosetting adhesive to between the surfaces 11a and 21b. A curing temperature of the thermosetting adhesive is set at a lower temperature than melting points of first and second insulation layers 13 and 23. A signal transmission circuit 12 is disposed on an inner layer side so as to achieve a structure that the signal transmission circuit 12 is held between first and second insulation layers 13 and 23 located on an outer layer side. In the case of achieving a specific characteristic impedance, high density can be achieved by decreasing a circuit width than that of those using liquid crystal polymer as the adhesive layer 30.

Abstract translation: 要解决的问题：为了实现通过使用热固性粘合剂作为层间粘合剂而允许高密度和优异的高频特性的柔性印刷电路，并且通过在较窄的电路宽度下实现具有特定阻抗的布线板， 减少成本 解决方案：通过在将第一和第二单元基板1和2布置成使得表面11a和21b彼此相对布置之后进行热压接而形成柔性印刷电路100，并且通过施加环氧树脂 - 基于热固性粘合剂的表面11a和21b之间。 热固性粘合剂的固化温度设定在比第一绝缘层13和第二绝缘层23的熔点低的温度。信号传输电路12设置在内层侧，以实现信号传输电路12 被保持在位于外层侧的第一绝缘层13和第二绝缘层23之间。 在达到特定阻抗的情况下，通过减小电路宽度可以通过使用液晶聚合物作为粘合层30的电路宽度来实现高密度。（C）2013，JPO＆INPIT

公开(公告)号：JP2012106491A

公开(公告)日：2012-06-07

申请号：JP2011233540

申请日：2011-10-25

Applicant: Daikin Industries Ltd ,  ダイキン工業株式会社

Inventor： YAMAMOTO YOSHIHISA ,  YOSHIMOTO HIROYUKI ,  NAKAGAWA HIDETO

IPC: B32B15/092 ,  B32B15/08 ,  B32B15/082 ,  H05K1/03

CPC classification number: H05K1/0393 ,  B32B15/092 ,  B32B37/14 ,  B32B38/10 ,  B32B2270/00 ,  B32B2457/08 ,  C08L63/00 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L27/18

Abstract: PROBLEM TO BE SOLVED: To provide a metal-clad laminate in which a metal foil is firmly bonded with a base material while exhibiting superior electrical characteristics.SOLUTION: The metal-clad laminate includes the metal foil and a first resin layer that is provided on the metal foil. The metal-clad laminate is characterized in that the first resin layer is composed of an epoxy resin and a fluorine-containing polymer that has a curable functional group.

Abstract translation: 要解决的问题：提供一种金属箔与基材牢固地结合在一起而具有优异的电特性的覆金属层压板。 解决方案：覆金属层压板包括金属箔和设置在金属箔上的第一树脂层。 覆金属层压板的特征在于，第一树脂层由环氧树脂和具有可固化官能团的含氟聚合物组成。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP4843214B2

公开(公告)日：2011-12-21

申请号：JP2004331979

申请日：2004-11-16

Applicant: 株式会社東芝

Inventor： 邦康 細田 ,  慎 青木

IPC: H05K3/28 ,  G11B21/02 ,  H05K3/34

CPC classification number: H01L24/32 ,  G11B5/4846 ,  G11B25/043 ,  H01L21/563 ,  H01L24/16 ,  H01L24/28 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/27013 ,  H01L2224/73203 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2224/05599

Abstract: A module substrate includes an insulating substrate, a circuit pattern formed on at least a main surface of the insulating substrate, a protection film formed on the main surface of the insulating substrate including the circuit patter such as to expose a mount region of the circuit pattern, an active element part mounted on the mount region of the circuit pattern, a fluororesin film formed on the protection film at least in a vicinity of the mount region of the active element part, and an underfill filled between the active element part and the mount region of the circuit pattern.

公开(公告)号：JP2011528853A

公开(公告)日：2011-11-24

申请号：JP2011518931

申请日：2009-07-17

Applicant: ワールド プロパティーズ インク.

Inventor： ジェイ クリストファー カッセ ,  エム ダーク バース ,  サンカー ポール ,  エフ アレン ホーン

IPC: H05K3/46

CPC classification number: H05K1/0373 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T156/10 ,  Y10T428/24612 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257

Abstract: 導電金属層と、誘電率が約３．５未満であり誘電正接が約０．００６未満である誘電体複合材料とを含む回路基板積層体であり、誘電体複合材料は、ポリマー樹脂と、酸化鉄含有量が３重量パーセント以下である、約１０〜約７０体積パーセントのセノスフェアとを含む。

公开(公告)号：JP4798237B2

公开(公告)日：2011-10-19

申请号：JP2009055533

申请日：2009-03-09

Applicant: 株式会社デンソー

Inventor： 卓哉 孝谷

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3511 ,  H05K1/034 ,  H05K1/181 ,  H05K1/183 ,  H05K3/4632 ,  H05K2201/015 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2203/049 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A printed IC board has a multilayer printed wiring board and one or more bare IC chips. The multilayer printed wiring board has insulation layers made of PTFE, and wiring patterns formed on the insulation layers which are stacked to make a lamination structure. Electrode parts as parts of the wiring patterns are electrically connected to the bare IC chip. A copper member which serves as a reinforcing member is laid in a region formed in the insulation layers other than a first insulation layer. the region is formed directly below the electrode parts. The region is formed in a direction Z along a thickness of the stacked insulation layers. The region formed directly below the electrode parts in the insulation layers in the insulation layers other than the first insulation layer has a higher rigidity than the insulation layers.

公开(公告)号：JP4630120B2

公开(公告)日：2011-02-09

申请号：JP2005132574

申请日：2005-04-28

Applicant: ジャパンゴアテックス株式会社

Inventor： 裕之 大幡

IPC: B29C43/18 ,  H05K1/03

CPC classification number: H05K3/281 ,  B29C43/18 ,  B29C43/203 ,  B29K2105/0854 ,  H05K2201/0116 ,  H05K2201/0141 ,  H05K2201/015

公开(公告)号：JP4621778B2

公开(公告)日：2011-01-26

申请号：JP2009018759

申请日：2009-01-29

Applicant: 株式会社東芝

Inventor： 展大 山本

IPC: H05K3/28 ,  H05K1/18

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/19041 ,  H05K3/0094 ,  H05K3/28 ,  H05K3/305 ,  H05K2201/015 ,  H05K2201/0959 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/304 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: According to an aspect of the present invention, there is provided an electronic apparatus including: a housing; a circuit board that is housed in the housing; a semiconductor package that includes a first surface on which solder balls are provided and a second surface opposite to the first surface and that is mounted on the circuit board so as to be electrically connected to the circuit board through the solder balls; a protective film that has a water repellency and that is applied on the circuit board so as to expose around the semiconductor package mounted on the circuit board; and a joint member that joins at least a part of a side surface of the semiconductor package and the circuit board.

公开(公告)号：JP2010087107A

公开(公告)日：2010-04-15

申请号：JP2008252775

申请日：2008-09-30

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： INOUE SEIICHI

IPC: H05K3/28 ,  H05K1/09 ,  H05K3/10 ,  H05K3/22 ,  H05K9/00

CPC classification number: H05K3/246 ,  H05K1/0256 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2201/09036 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/1147 ,  H05K2203/1173 ,  Y10T29/49155

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming wiring, capable of solving problems caused from a conventional technique, and giving high reliability i.e. preventing the generation of migration without high-temperature sintering. SOLUTION: The method of forming wiring includes: jetting a colloidal metal solution onto a receptive layer base material having a porous receptive type layer formed on the surface thereof by an inkjet system based on image data of a conductive pattern and drawing; and then executing migration-proof treatment for applying a migration-proof solution to form a wiring having the conductive pattern. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种形成布线的方法，其能够解决由常规技术引起的问题，并且提供高可靠性，即防止在没有高温烧结的情况下产生迁移。 形成布线的方法包括：基于导电图案和图形的图像数据，通过喷墨系统将胶体金属溶液喷射到具有形成在其表面上的多孔接受型层的接受层基材上; 然后执行防迁移处理以应用防迁移解决方案以形成具有导电图案的布线。 版权所有（C）2010，JPO＆INPIT