公开(公告)号：JP2008218833A

公开(公告)日：2008-09-18

申请号：JP2007056247

申请日：2007-03-06

Applicant: Citizen Electronics Co Ltd ,  シチズン電子株式会社

Inventor： IMAI SADATO ,  KIKUCHI SATORU ,  FUKAZAWA KOICHI

IPC: H05K1/11 ,  H01R12/71

CPC classification number: F21V29/70 ,  F21K9/20 ,  F21V29/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01R4/023 ,  H05K1/0203 ,  H05K1/056 ,  H05K1/114 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3421 ,  H05K7/205 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive external connection terminal of a metal core substrate which can be made small and thin at low cost by eliminating the need to mount a connector on the metal core substrate. SOLUTION: Disclosed is the external connection terminal 15 of the metal core substrate 10 which is disposed at a terminal portion of the metal core substrate 10 for mounting an electronic component 17 on at least one surface of top and rear surfaces of a plate type metal substrate 11, and makes an electric connection with the outside. The external connection terminal 15 is composed of a member which has smaller heat conductivity than the metal substrate, and has, on its surface, an electrode pattern portion 16a for soldering and fixing a lead wire to be connected to the outside. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种廉价的金属芯基板的外部连接端子，可以通过消除在金属芯基板上安装连接器的需要，可以以低成本制造得小而薄。 解决方案：公开了金属芯基板10的外部连接端子15，其设置在金属芯基板10的端子部分处，用于将电子部件17安装在板的顶表面和后表面的至少一个表面上 型金属基板11，与外部电连接。 外部连接端子15由与金属基板相比热传导性较差的部件构成，表面上具有用于焊接固定与外部连接的引线的电极图形部分16a。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008160156A

公开(公告)日：2008-07-10

申请号：JP2008073717

申请日：2008-03-21

Applicant: Mitsubishi Cable Ind Ltd ,  三菱電線工業株式会社

Inventor： ANPO TSUGIO ,  FUJIWARA SATORU ,  HASEGAWA YOSHIKATSU ,  NAKAGAWA CHIHIRO ,  ONO TAKESHI ,  URUSHIYA ATSUSHI ,  KASHIOKA TORU ,  SHIMAZAWA KATSUJI

IPC: H05K3/20 ,  H01R9/24 ,  H01R12/58 ,  H02G3/08 ,  H02G3/16 ,  H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  H05K13/00

CPC classification number: H05K3/202 ,  H01R9/2466 ,  H01R12/523 ,  H05K3/041 ,  H05K3/222 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/4611 ,  H05K13/0061 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T428/24917

Abstract: PROBLEM TO BE SOLVED: To manufacture a circuit board which can be used for various electric instruments and has a circuit pattern made of a metal foil. SOLUTION: A copper foil 41 that is the base material of a foil circuit 21 is wound around a roller 42, and reeled out by feeding means 43. Resin plates 20 stacked on a stocker 45 are taken out one by one with being synchronized with transfer of the copper foil 41. The resin plates 20 are placed on a stacking table 46, then risen upward, and pushed up toward the copper foil 41. The stacking plate 46 is three dimensionally position controlled so that anchor pins 20a of the resin plate 20 are inserted into pinholes 21a perforated through the copper foil 41. After being superposed on the resin plate 20, the copper foil 41 is caused so as not to be released from the resin plate 20 by descending a heat press 48 to push and crush the top portions of the anchor pins 20a by heat. The copper foil 41 integrated with the resin plate 20 is punched through into a foil circuit 21 by a punch-through press 49. Manufactured circuit boards 19 are conveyed out and stacked in a stocker 52. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：制造可用于各种电器的电路板，并具有由金属箔制成的电路图案。 作为箔电路21的基材的铜箔41卷绕在辊42上，并由供给装置43卷出。堆放在储带架45上的树脂板20一个接一个地取出， 与铜箔41的转印同步。将树脂板20放置在堆叠台46上，然后向上升起并朝向铜箔41向上推。堆叠板46被三维位置控制，使得锚定销 将树脂板20插入穿过铜箔41的针孔21a中。在叠置在树脂板20上之后，通过下降热压机48使铜箔41不会从树脂板20释放， 通过加热挤压锚销20a的顶部。 与树脂板20一体化的铜箔41通过穿通压机49冲压成箔电路21.制造的电路板19被输出并堆叠在储料器52中。（C）2008年， JPO＆INPIT

公开(公告)号：JP2008016225A

公开(公告)日：2008-01-24

申请号：JP2006183699

申请日：2006-07-03

Applicant: Canon Inc ,  キヤノン株式会社

Inventor： MORIYA MASAFUMI ,  ISHIWATARI KAZUYA

IPC: H01J1/316 ,  H01J9/02 ,  H01J31/12

CPC classification number: H05K3/4685 ,  H01J17/04 ,  H01J29/04 ,  H05K3/107 ,  H05K2201/09245 ,  H05K2201/10287 ,  H05K2203/0315 ,  Y10T29/49162

Abstract: PROBLEM TO BE SOLVED: To provide an electron source equipped with a wiring board in which a resistance value of a wire itself will not change with time. SOLUTION: The electron source is provided with a board having a groove on the surface, a wiring board equipped with a conductive wire with at least a part of it arranged in the groove and a wiring arranged on the wire so as to cross the same, and a plurality of electron emission elements arranged on the wiring board and electrically connected with the conductive wire as well as with the wiring. The surface of the wire is covered with a coating layer made of oxide of a material constituting the wire. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种配备有其中电线本身的电阻值不会随时间变化的布线板的电子源。 解决方案：电子源设置有在表面上具有凹槽的板，配备有至少一部分布置在凹槽中的导线的布线板和布置在导线上的布线以便交叉 以及布置在布线板上并与导线以及布线电连接的多个电子发射元件。 电线的表面覆盖有由构成导线的材料的氧化物制成的涂层。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007335719A

公开(公告)日：2007-12-27

申请号：JP2006167267

申请日：2006-06-16

Applicant: Hitachi Ltd ,  株式会社日立製作所

Inventor： KOYAMA KAZUHIRO ,  MORI MUTSUHIRO ,  SAITO KATSUAKI ,  KOIKE YOSHIHIKO

IPC: H01L25/07 ,  H01L25/18

CPC classification number: H05K1/144 ,  H01L23/24 ,  H01L25/072 ,  H01L25/16 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/147 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/10287 ,  H05K2201/10318 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor power module by preventing deterioration of breakdown voltage of a semiconductor power module and characteristic variation of a semiconductor chip. SOLUTION: A printed substrate 102 is formed to an elastic structure for absorbing stress received from a silicone gel 101 passing through the printed substrate 102 by the printed substrate 102. Additionally, the printed substrate 102 is made narrow for escaping stress. Meanwhile, wiring whereto a high voltage is applied is patterned to different printed substrates, and discharge whose path is the same printed substrate surface is prevented. Consequently, it is possible to airproof a power module, to prevent permeation of moisture and contaminant, and to prevent displacement deformation and cracks of a lid plate 105. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：通过防止半导体功率模块的击穿电压的劣化和半导体芯片的特性变化来提供高可靠性的半导体功率模块。 解决方案：印刷基板102形成为用于吸收通过印刷基板102穿过印刷基板102的硅凝胶101接收的应力的弹性结构。另外，印刷基板102变窄以避免应力。 同时，施加高电压的布线被图案化成不同的印刷基板，并且防止其路径相同印刷基板表面的放电。 因此，可以对功率模块进行防水，防止水分和污染物的渗透，并且防止盖板105的位移变形和裂纹。（C）2008年，JPO和INPIT

公开(公告)号：JP2006160243A

公开(公告)日：2006-06-22

申请号：JP2005253180

申请日：2005-09-01

Applicant: Michelin Rech & Technic Sa ,  Soc D Technologie Michelin ,  ソシエテ ドゥ テクノロジー ミシュラン ,  ミシュラン ルシェルシェ エ テクニク ソシエテ アノニム

Inventor： SINNETT JAY C ,  METCALF ARTHUR R ,  MYATT DAVID J

IPC: B60C23/04 ,  H05K7/00 ,  B29D30/06 ,  B60C19/00 ,  H01R4/02 ,  H01R4/20 ,  H01R13/58 ,  H01R43/02 ,  H02G11/00 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R4/02 ,  B29D2030/0072 ,  B60C23/0493 ,  H01Q1/2241 ,  H01Q1/40 ,  H01R4/20 ,  H01R12/53 ,  H01R13/58 ,  H01R13/5808 ,  H01R13/5845 ,  H01R43/0256 ,  H01R2201/02 ,  H01R2201/26 ,  H05K3/301 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/1194

Abstract: PROBLEM TO BE SOLVED: To provide a distortion-endurable electric connection structure and its forming method. SOLUTION: A conductive lead such as wire is connected with an electric circuit in such a form as to generate a connection assuring excellent endurance against a mechanical stress caused by a motion of the lead relative to the electric circuit, a rotation, etc. A material to produce a region as decreasing the deflecting compliance or heightening the stiffness in the area near the connection point is formed around the lead and near the connection point to the electric circuit. According to one embodiment, the lead may assume a coil form or a shape capable of heightening still more the endurance against the mechanical stress. In another example of embodiment, it is also considerable of installing additionally an element which assists controlling the stiffness of the area around the connection point. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供耐扭曲的电连接结构及其成形方法。 解决方案：诸如导线的导电引线以电路连接，以便产生连接，确保针对引线相对于电路的运动，旋转等导致的机械应力具有优异的耐久性 在引线周围以及靠近电路的连接点附近形成用于产生区域的材料，以减少偏转顺应性或提高连接点附近的区域的刚度。 根据一个实施例，引线可以呈现能够相对于机械应力提高耐力的线圈形式或形状。 在实施例的另一示例中，还可以额外安装有助于控制连接点周围区域的刚度的元件。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006135175A

公开(公告)日：2006-05-25

申请号：JP2004323940

申请日：2004-11-08

Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

Inventor： YAMANO KOJI

IPC: H01L23/32

CPC classification number: H01L21/76898 ,  H01L21/76879 ,  H01L23/481 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K3/007 ,  H05K3/205 ,  H05K3/4046 ,  H05K3/423 ,  H05K3/4605 ,  H05K3/4608 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2224/0401

Abstract: PROBLEM TO BE SOLVED: To provide a substrate having a through via penetrating a basic material and wiring being connected with the through via in which generation of void in the through via is suppressed and electrical connection reliability of the wiring and the through via can be enhanced, and to provide its production process. SOLUTION: The through via 55 is constituted of a through portion 57, a wiring joint 56 provided at one end of the through portion 57 and wider than the diameter R1 at the through portion 57, and a connection pad 59 provided at the other end of the through portion 57 and wider than the diameter R1 at the through portion 57, and a conductive core material 58 located substantially on the central axis D of the through hole 52, and the through via 55 is formed by depositing conductive metal by using the conductive core material 58 as a power supply layer. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种具有穿过基本材料的通孔的基板和与通孔中通孔的产生被抑制的通孔连接的布线，以及布线和通孔的电连接可靠性 可以加强，并提供其生产过程。 贯通通路55由贯通部57，设置在贯通部57的一端的布线接头56和贯通部57的直径R1构成，连接垫59 贯穿部分57的另一端并且比通孔部分57处的直径R1宽，并且基本上位于通孔52的中心轴线D上的导电芯材料58，并且通孔55通过沉积导电金属由 使用导电芯材料58作为电源层。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP3115597U

公开(公告)日：2005-11-10

申请号：JP2005006431

申请日：2005-08-09

Applicant: Uro電子工業株式会社

Inventor： 川 雄 二 市 ,  川 朝 夫 石

IPC: H01F27/29 ,  H03H7/48

CPC classification number: H01F27/292 ,  H01F19/04 ,  H01F27/2828 ,  H01F2017/067 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09172 ,  H05K2201/1003 ,  H05K2201/10287

Abstract: 【課題】プリント配線板の配線パターンの構成に影響を与えることなく取り付け得る面実装用トランスを提供すること。
【解決手段】フェライトコアに巻線が巻装されて構成されたトランス本体１０と、前記トランス本体を載置するのに必要な大きさを有する絶縁基板２１の少なくとも一面に配線パターンが形成され、かつ前記絶縁基板の周囲に巻線の端部を接続するための接続用端子２２が形成された台座２０とをそなえた面実装用トランス。
【選択図】図１

公开(公告)号：JP3493659B2

公开(公告)日：2004-02-03

申请号：JP2000169662

申请日：2000-06-06

Applicant: 船井電機株式会社

Inventor： 秀樹 久米 ,  輝明 曽川 ,  高之 村上

IPC: H05K7/00 ,  H05K3/34

CPC classification number: H05K3/3405 ,  H05K3/3447 ,  H05K2201/09145 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10356

公开(公告)号：JPS61105811A

公开(公告)日：1986-05-23

申请号：JP22746884

申请日：1984-10-29

Applicant: Sanyo Electric Co Ltd ,  Tokyo Sanyo Electric Co Ltd

Inventor： MIURA YOSHIO

IPC: H01F27/06 ,  H01F27/29 ,  H01F41/04 ,  H05K3/32

CPC classification number: H01F27/292 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2203/0285

Abstract: PURPOSE:To form an inductance element without going through a heating process by forming an insulating coil into an inductance element directly on an insulating substrate with a supersonic bonding device after soldering other circuit elements. CONSTITUTION:After conductive routes 2 and 2' are formed on a circuit substrate 1 and a desired circuit element 3 is soldered, a bobbin 5 is arranged on the circuit substrate 1. An end of a coil 7 is supersonically bonded on the conductive route 2 of the substrate 1 with a supersonic bonding device, the insulating coil 7 is wound on a bobbin 5 through revolving the circuit substrate 1, and another end of the insulating coil 7 is supersonically bonded to another conductive route 2'. As, thus, an inductance element can be built in on the circuit substrate 1 besides an IC, a transistor, a chip condenser o a circuit element 3 of chip resistance, external parts can be almost unnecessary, the inductance element is built in after a heating process of soldering, a short circuit never occurs because of heating the insulating coil 7.

Abstract translation: 目的：通过在焊接其它电路元件之后，通过用超声波接合装置在绝缘基板上直接形成绝缘线圈，将绝缘线圈形成电感元件，形成电感元件而不进行加热处理。 构成：在导电路径2和2'形成在电路基板1上并且所需的电路元件3被焊接之后，线圈架5布置在电路基板1上。线圈7的端部被超声波接合在导电路径2上 通过超声波接合装置将基板1的绝缘线圈7通过旋转电路基板1卷绕在线轴5上，绝缘线圈7的另一端被超声波接合到另一导电路径2'。 因此，除了IC，晶体管，芯片电阻的芯片电容器，电路元件3之外，还可以在电路基板1上内置电感元件，外部部件几乎不需要，电感元件在加热后内置 焊接过程由于加热绝缘线圈7而不会发生短路。

公开(公告)号：JPS6197807A

公开(公告)日：1986-05-16

申请号：JP21994284

申请日：1984-10-18

Applicant: Sanyo Electric Co Ltd ,  Tokyo Sanyo Electric Co Ltd

Inventor： MIURA YOSHIO

IPC: H01F27/29 ,  H01F41/04 ,  H01F41/10 ,  H05K3/32

CPC classification number: H01F27/292 ,  H01F41/10 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2203/0285

Abstract: PURPOSE:To obtain the inductance elements of extremely small size and low price and to form the elements in an arbitrary position of an insulating substrate continuously by forming the elements on the insulating substrate directly by use of a supersonic bonding device of insulating wires. CONSTITUTION:After a copper foil is stuck to the overall surface of one of the main planes of an insulating substrate 1, the copper foil is etched selectively to form the conductive paths of desired pattern. A winding frame body 3 is placed and fixed on the insulating substrate 1 with being close to the conductive paths by an adhesive 4. The winding frame body 3 has a function of winding the wire for forming an inductance element. One end of a wire 5 is supersonic- bonded on one of the conductive paths 2 by use of a supersonic bonding device. The insulating wire 5 is wound on the winding frame body 3 by providing a capillary chip 9 around the body 3. During this process, the insulating wire 5 is wound on the body 3 only by the predetermined number of tuns in one direction into a coil from thereby obtaining the inductance element of desired value.

Abstract translation: 目的：为了获得极小尺寸和低价格的电感元件，并通过使用绝缘导线的超声波接合装置直接形成绝缘基板上的元件，从而连续地形成绝缘基板的任意位置的元件。 构成：在将铜箔粘贴在绝缘基板1的主面的整个表面之后，铜箔被选择性地蚀刻以形成所需图案的导电路径。 卷绕框架体3通过粘合剂4靠近导电路径放置并固定在绝缘基板1上。卷绕框架体3具有卷绕用于形成电感元件的导线的功能。 电线5的一端通过使用超音速键合装置超声波结合在一个导电路径2上。 绝缘线5通过在主体3周围设置毛细管芯片9而卷绕在绕线框架体3上。在此过程中，绝缘线5仅沿着一个方向缠绕在主体3上， 从而获得所需值的电感元件。