公开(公告)号：JP4542203B2

公开(公告)日：2010-09-08

申请号：JP2009524506

申请日：2008-07-24

Applicant: 新日鉄マテリアルズ株式会社 ,  株式会社日鉄マイクロメタル

Inventor： 智裕 宇野 ,  晋一 寺嶋 ,  隆 山田 ,  圭一 木村 ,  景仁 西林

IPC: H01L21/60 ,  H01B5/02

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

公开(公告)号：JP2010212697A

公开(公告)日：2010-09-24

申请号：JP2010073297

申请日：2010-03-26

Applicant: Nippon Steel Materials Co Ltd ,  Nittetsu Micro Metal:Kk ,  新日鉄マテリアルズ株式会社 ,  株式会社日鉄マイクロメタル

Inventor： UNO TOMOHIRO ,  KIMURA KEIICHI ,  TERAJIMA SHINICHI ,  YAMADA TAKASHI ,  NISHIBAYASHI KAGEHITO

IPC: H01L21/60 ,  C22C5/02 ,  C22C5/04 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C19/03 ,  C22C27/04 ,  C22C27/06 ,  C22F1/00 ,  C22F1/08

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

Abstract: PROBLEM TO BE SOLVED: To provide a bonding wire for a semiconductor device in which copper is a main constituent and reduction of defects in a heat cycle test is achieved in addition to conventional basic performance. SOLUTION: The bonding wire includes: a core material in which copper is a main component; the core material provided on the core material; and an external layer containing copper and metal M in which either or both of a component and composition are different. The thickness of the external layer is 0.021 to 0.12 μm; the carbon concentration of the top surface of the external layer is in a range of 15 to 80 mol% by comparing concentrations between a metallic element and total of respective elements of carbon, oxygen, and nitrogen; and the thickness of an area that is in a range of 5 to 80 mol% in carbon concentration in a depth direction from the surface is 0.0004 to 0.01 μm. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种半导体器件的接合线，其中铜是主要成分，除了常规的基本性能之外，还实现了热循环测试中的缺陷的减少。 解决方案：接合线包括：芯材，其中铜是主要成分; 芯材上提供的芯材; 以及含有铜和金属M的外层，其中组分和组合物中的任一种或两者不同。 外层的厚度为0.021〜0.12μm; 通过比较金属元素与碳，氧和氮的各元素的总量之间的浓度，外层的顶表面的碳浓度在15至80摩尔％的范围内; 在距离表面的深度方向上的碳浓度为5〜80摩尔％的范围的面积的厚度为0.0004〜0.01μm。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010153917A

公开(公告)日：2010-07-08

申请号：JP2010073298

申请日：2010-03-26

Applicant: Nippon Steel Materials Co Ltd ,  Nittetsu Micro Metal:Kk ,  新日鉄マテリアルズ株式会社 ,  株式会社日鉄マイクロメタル

Inventor： UNO TOMOHIRO ,  KIMURA KEIICHI ,  TERAJIMA SHINICHI ,  YAMADA TAKASHI ,  NISHIBAYASHI KAGEHITO

IPC: H01L21/60

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

Abstract: PROBLEM TO BE SOLVED: To provide a copper-based semiconductor device bonding wire which has defects reduced in thermal cycle test in addition to having conventional basic performance. SOLUTION: The semiconductor device bonding wire is provided with a core material having copper as a main component, and an outer layer, which is arranged on the core material and contains a metal M having one of or both of the components and composition different from those of the core material, and copper. The semiconductor device bonding wire is characterized in that the thickness of the outer layer is 0.021-0.12 μm. The outermost surface of the outer layer has an oxygen concentration of 1 to 25 mol% and the thickness of a region wherein the oxygen concentration is 0.25 to 25 mol% on the surface of the outer layer is 0.0005-0.007 μm with respect to concentrations of a metal-based element, carbon, oxygen, and nitrogen compared with the total of the respective elements. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供除具有常规基本性能之外还具有热循环试验中减少的缺陷的铜基半导体器件接合线。 解决方案：半导体器件接合线设置有以铜为主要成分的芯材，外层设置在芯材上并含有金属M，金属M具有一种或两种成分和组成 不同于核心材料和铜。 半导体器件接合线的特征在于外层的厚度为0.021-0.12μm。 外层的最表面的氧浓度为1〜25摩尔％，外层表面的氧浓度为0.25〜25摩尔％的区域的厚度相对于外层的浓度为0.0005-0.007μm 金属元素，碳，氧和氮，与各元素的总量相比。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JPWO2014054429A1

公开(公告)日：2016-08-25

申请号：JP2014503887

申请日：2013-09-19

Applicant: 日本エレクトロプレイテイング・エンジニヤース株式会社

Inventor： 純子 露木 ,  純子 露木 ,  伊東　正浩 ,  正浩 伊東

IPC: C25D3/48 ,  C25D5/02 ,  C25D7/12

CPC classification number: C25D3/48 ,  C25D3/62 ,  C25D5/022 ,  C25D5/50 ,  C25D7/12 ,  C25D7/123 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/43 ,  H01L24/45 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03848 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/11462 ,  H01L2224/11848 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01077 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01081 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2224/45015 ,  H01L2924/207

Abstract: 本発明は、熱処理を行った場合であっても、高硬度を維持できるめっき被膜を形成可能なノンシアン系電解金めっき液を提供する。本発明は、亜硫酸金アルカリ塩又は亜硫酸金アンモニウムからなる金源と、亜硫酸塩及び硫酸塩からなる伝導塩と、を含有するノンシアン系電解金めっき液において、イリジウム、ルテニウム、ロジウムのいずれか1種以上の塩を金属濃度として1〜3000mg/L含有することを特徴とする。さらに、結晶調整剤を含有することが好ましく、タリウムが特に好ましい。

Abstract translation: 本发明中，即使当经受热处理，以提供对镀敷膜的可成形的非青色电解金电镀液可以保持高的硬度。 本发明中，亚硫酸金碱或金源包括亚硫酸金铵和，导电盐包括亚硫酸盐和硫酸盐，在非青色电解金电镀液中的含铱，钌，铑中的任一项 它其特征在于它含有1至3000毫克/升或更多的盐作为金属的浓度。 此外，优选含有结晶改良剂，铊是特别优选的。

公开(公告)号：JP2011222875A

公开(公告)日：2011-11-04

申请号：JP2010092672

申请日：2010-04-13

Applicant: Sony Chemical & Information Device Corp ,  ソニーケミカル&インフォメーションデバイス株式会社

Inventor： NAMIKI HIDEJI ,  KANIZAWA MORIYUKI ,  UMAGOE HIDEAKI ,  ISHIGAMI AKIRA

IPC: H01L21/60 ,  C09J9/02 ,  C09J11/00 ,  C09J201/00 ,  H01L33/60 ,  H01L33/62

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K3/22 ,  C08K3/24 ,  C08K7/08 ,  C08K9/06 ,  C08K2003/0831 ,  C08K2003/2241 ,  C08K2003/2296 ,  C09J11/04 ,  H01L24/06 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/13339 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01081 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PROBLEM TO BE SOLVED: To provide a light-reflective, anisotropic and conductive adhesive capable of obtaining high conductive reliability by maintaining light-emission efficiency of a light-emitting element and preventing occurrence of cracks, and to provide a light-emitting device.SOLUTION: The light-reflective, anisotropic and conductive adhesive contains a thermosetting resin composition, conductive particles, and insulating particles each having a light-reflective needle-shape. This insulating particle having the light-reflective needle-shape is at least one kind of inorganic particles selected from the group consisting of titanium oxide, zinc oxide, and titanate.

Abstract translation: 要解决的问题：提供一种通过保持发光元件的发光效率并防止发生裂纹而获得高导电可靠性的光反射，各向异性和导电粘合剂，并提供发光 设备。 光反射性各向异性导电性粘合剂含有热固性树脂组合物，导电粒子和各自具有光反射针状的绝缘粒子。 具有光反射针形状的绝缘粒子是选自氧化钛，氧化锌，钛酸盐中的至少一种无机粒子。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP4719300B2

公开(公告)日：2011-07-06

申请号：JP2010073298

申请日：2010-03-26

Applicant: 新日鉄マテリアルズ株式会社 ,  株式会社日鉄マイクロメタル

Inventor： 智裕 宇野 ,  晋一 寺嶋 ,  隆 山田 ,  圭一 木村 ,  景仁 西林

IPC: H01L21/60

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

Abstract: It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition.. The outer layer is 0.021 to 0.12µm in thickness.

公开(公告)号：JP5627263B2

公开(公告)日：2014-11-19

申请号：JP2010073299

申请日：2010-03-26

Applicant: 新日鉄住金マテリアルズ株式会社 ,  日鉄住金マイクロメタル株式会社

Inventor： 宇野　智裕 ,  智裕 宇野 ,  木村　圭一 ,  圭一 木村 ,  寺嶋　晋一 ,  晋一 寺嶋 ,  山田　隆 ,  隆 山田 ,  景仁 西林 ,  景仁 西林

IPC: H01L21/60

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

公开(公告)号：JP5555038B2

公开(公告)日：2014-07-23

申请号：JP2010092672

申请日：2010-04-13

Applicant: デクセリアルズ株式会社

Inventor： 秀次 波木 ,  士行 蟹澤 ,  英明 馬越 ,  明 石神

IPC: H01L21/60 ,  C09J9/02 ,  C09J11/00 ,  C09J201/00 ,  H01L33/60 ,  H01L33/62

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K3/22 ,  C08K3/24 ,  C08K7/08 ,  C08K9/06 ,  C08K2003/0831 ,  C08K2003/2241 ,  C08K2003/2296 ,  C09J11/04 ,  H01L24/06 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/13339 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01081 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.

公开(公告)号：JPWO2009014168A1

公开(公告)日：2010-10-07

申请号：JP2009524506

申请日：2008-07-24

Applicant: 新日鉄マテリアルズ株式会社 ,  株式会社日鉄マイクロメタル

Inventor： 宇野　智裕 ,  智裕 宇野 ,  木村　圭一 ,  圭一 木村 ,  寺嶋　晋一 ,  晋一 寺嶋 ,  山田　隆 ,  隆 山田 ,  景仁 西林 ,  景仁 西林

IPC: H01L21/60 ,  H01B5/02

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

Abstract: 本発明は、材料費が安価で、ボール接合性、熱サイクル試験またはリフロー試験の信頼性に優れ、保管寿命も良好である、狭ピッチ用細線化にも適応する銅系ボンディングワイヤを提供することを目的とする。銅を主成分とする芯材と、前記芯材の上に設けられた、前記芯材と、成分及び組成のいずれか一方又は両方の異なる金属M及び銅を含有する外層を有するボンディングワイヤであって、前記外層の厚さが0.021〜0.12μmであることを特徴とする半導体装置用ボンディングワイヤである。

公开(公告)号：JP2010153918A

公开(公告)日：2010-07-08

申请号：JP2010073299

申请日：2010-03-26

Applicant: Nippon Steel Materials Co Ltd ,  Nittetsu Micro Metal:Kk ,  新日鉄マテリアルズ株式会社 ,  株式会社日鉄マイクロメタル

Inventor： UNO TOMOHIRO ,  KIMURA KEIICHI ,  TERAJIMA SHINICHI ,  YAMADA TAKASHI ,  NISHIBAYASHI KAGEHITO

IPC: H01L21/60

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

Abstract: PROBLEM TO BE SOLVED: To provide a copper-based semiconductor device bonding wire which has defects reduced in thermal cycle test in addition to having conventional basic performance. SOLUTION: The semiconductor device bonding wire is provided with a core material having copper as a main component, and an outer layer, which is arranged on the core material and contains Pd and copper. The semiconductor device bonding wire is characterized in that the outer layer is a part containing ≥50 mol% of Pd and the thickness of the outer layer is 0.021-0.12 μm. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供除具有常规基本性能之外还具有热循环试验中减少的缺陷的铜基半导体器件接合线。 解决方案：半导体器件接合线设置有以铜为主要成分的芯材，以及设置在芯材上并含有Pd和铜的外层。 半导体器件接合线的特征在于，外层为含有≥50摩尔％Pd的部分，外层的厚度为0.021-0.12μm。 版权所有（C）2010，JPO＆INPIT