公开(公告)号：US20090214780A1

公开(公告)日：2009-08-27

申请号：US12437263

申请日：2009-05-07

Applicant: Gareth Geoffrey Hougham ,  Xiao Hu Liu ,  S. Jay Chey ,  Joseph Zinter, JR. ,  Michael J. Rooks ,  Brian Richard Sundlof ,  Jon Alfred Casey

Inventor： Gareth Geoffrey Hougham ,  Xiao Hu Liu ,  S. Jay Chey ,  Joseph Zinter, JR. ,  Michael J. Rooks ,  Brian Richard Sundlof ,  Jon Alfred Casey

IPC: B22F9/00 ,  B05D3/02 ,  C23C16/00 ,  B22F1/00

CPC classification number: H01R13/2414 ,  B32B15/08 ,  H01R43/007 ,  H05K1/0271 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0218 ,  H05K2201/068 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/12535 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/31609

Abstract: A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.

Abstract translation: 负系数的热膨胀粒子包括具有第一双层内层和第一双层外层的第一双层和具有第二双层内层和第二双层外层的第二双层。 第一和第二双层分别沿着第一和第二双层外层以及第一和第二双层内层的周边连接在一起。 第一双层内层和第二双层内层由第一材料制成，第一双层外层和第二双层外层由第二材料制成。 第一种材料具有比第二种材料更大的热膨胀系数。

公开(公告)号：US20120083114A1

公开(公告)日：2012-04-05

申请号：US12897826

申请日：2010-10-05

Applicant: ERIC DANIEL PERFECTO ,  Harry David Cox ,  Timothy Harrison Daubenspeck ,  David L. Questad ,  Brian Richard Sundlof

Inventor： ERIC DANIEL PERFECTO ,  Harry David Cox ,  Timothy Harrison Daubenspeck ,  David L. Questad ,  Brian Richard Sundlof

IPC: H01L21/768

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/0219 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05562 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2924/01074 ,  H01L2924/06 ,  H01L2924/053 ,  H01L2924/01047 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method for reducing stress on under ball metallurgy (UBM) is disclosed. A collar is disposed around the ball to provide support, and prevent solder interaction in the undercut areas of the UBM. In one embodiment, the collar is comprised of photosensitive polyimide.

Abstract translation: 公开了一种减少球磨冶金（UBM）应力的方法。 围绕球设置套环以提供支撑，并且防止UBM的底切区域中的焊料相互作用。 在一个实施例中，套环由光敏聚酰亚胺组成。

公开(公告)号：US08338286B2

公开(公告)日：2012-12-25

申请号：US12897826

申请日：2010-10-05

Applicant: Eric David Perfecto ,  Harry David Cox ,  Timothy Harrison Daubenspeck ,  David L. Questad ,  Brian Richard Sundlof

Inventor： Eric David Perfecto ,  Harry David Cox ,  Timothy Harrison Daubenspeck ,  David L. Questad ,  Brian Richard Sundlof

IPC: H01L21/44

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/0219 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05562 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2924/01074 ,  H01L2924/06 ,  H01L2924/053 ,  H01L2924/01047 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method for reducing stress on under ball metallurgy (UBM) is disclosed. A collar is disposed around the ball to provide support, and prevent solder interaction in the undercut areas of the UBM. In one embodiment, the collar is comprised of photosensitive polyimide.

Abstract translation: 公开了一种减少球磨冶金（UBM）应力的方法。 围绕球设置套环以提供支撑，并且防止UBM的底切区域中的焊料相互作用。 在一个实施例中，套环由光敏聚酰亚胺组成。

公开(公告)号：US07579069B2

公开(公告)日：2009-08-25

申请号：US10702280

申请日：2003-11-06

Applicant: Gareth Geoffrey Hougham ,  Xiao Hu Liu ,  S. Jay Chey ,  James Patrick Doyle ,  Joseph Zinter, Jr. ,  Michael J. Rooks ,  Brian Richard Sundlof ,  Jon Alfred Casey

Inventor： Gareth Geoffrey Hougham ,  Xiao Hu Liu ,  S. Jay Chey ,  James Patrick Doyle ,  Joseph Zinter, Jr. ,  Michael J. Rooks ,  Brian Richard Sundlof ,  Jon Alfred Casey

IPC: B32B15/02

CPC classification number: H01R13/2414 ,  B32B15/08 ,  H01R43/007 ,  H05K1/0271 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0218 ,  H05K2201/068 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/12535 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/31609

Abstract: A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.

Abstract translation: 负系数的热膨胀粒子包括具有第一双层内层和第一双层外层的第一双层和具有第二双层内层和第二双层外层的第二双层。 第一和第二双层分别沿着第一和第二双层外层以及第一和第二双层内层的周边连接在一起。 第一双层内层和第二双层内层由第一材料制成，第一双层外层和第二双层外层由第二材料制成。 第一种材料具有比第二种材料更大的热膨胀系数。

公开(公告)号：US07276787B2

公开(公告)日：2007-10-02

申请号：US10729254

申请日：2003-12-05

Applicant: Daniel Charles Edelstein ,  Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Jon Alfred Casey ,  Sherif A. Goma ,  Raymond R. Horton ,  Gareth Geoffrey Hougham ,  Michael Wayne Lane ,  Xiao Hu Liu ,  Chirag Suryakant Patel ,  Edmund Juris Sprogis ,  Michelle Leigh Steen ,  Brian Richard Sundlof ,  Cornelia K. Tsang ,  George Frederick Walker

Inventor： Daniel Charles Edelstein ,  Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Jon Alfred Casey ,  Sherif A. Goma ,  Raymond R. Horton ,  Gareth Geoffrey Hougham ,  Michael Wayne Lane ,  Xiao Hu Liu ,  Chirag Suryakant Patel ,  Edmund Juris Sprogis ,  Michelle Leigh Steen ,  Brian Richard Sundlof ,  Cornelia K. Tsang ,  George Frederick Walker

IPC: H01L23/48 ,  H01L23/498 ,  H01L21/4763 ,  H01L29/40 ,  H01L23/52

CPC classification number: H01L23/49883 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.

Abstract translation: 一种载体结构和方法，用于制造具有通孔的载流子结构，每个导通孔具有导电结构，其有效热膨胀系数小于或接近于基板的热膨胀系数，并且具有小于或等于 或者与衬底的密切匹配。 导电结构可以包括同心的通孔填充区域，其具有同心设置的不同材料，由导电材料的环形环包围的衬底材料的芯，由导电材料的环形环包围的CTE匹配的非导电材料的芯， 具有低CTE的内部空隙的导电通孔，或已经烧结或熔合的诸如金属 - 陶瓷浆料的导电复合材料的完整填充物。