公开(公告)号：US09768137B2

公开(公告)日：2017-09-19

申请号：US13460412

申请日：2012-04-30

Applicant: Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chih-Wei Lin ,  Cheng-Ting Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chih-Wei Lin ,  Cheng-Ting Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L24/14 ,  H01L21/4853 ,  H01L23/3677 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/3512 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the substrate, wherein each of the stud bump structures having a stud bump and a solder ball encapsulating the stud bump to enhance thermal dissipation and reduce high stress concentrations in the semiconductor package structure.

公开(公告)号：US09538582B2

公开(公告)日：2017-01-03

申请号：US13559318

申请日：2012-07-26

Applicant: Ming-Da Cheng ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Wei-Yu Chen ,  Chien-Wei Lee ,  Chung-Shi Liu

Inventor： Ming-Da Cheng ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Wei-Yu Chen ,  Chien-Wei Lee ,  Chung-Shi Liu

IPC: B23K31/02 ,  H01L21/00 ,  H05B3/02 ,  H01L21/677 ,  H01L21/683 ,  H01L23/00

CPC classification number: H05B3/02 ,  B23K3/087 ,  B23K2101/40 ,  H01L21/67721 ,  H01L21/6838 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75744 ,  H01L2224/7598 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/3511 ,  H01L2924/37001 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/014

Abstract: A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

Abstract translation: 一种方法包括将第一包装部件放置在真空舟皿上，其中真空舟皿包括孔，并且其中第一包装部件覆盖该孔。 第二包装部件放置在第一包装部件上，其中焊料区域设置在第一和第二包装部件之间。 该孔被抽真空，其中第一包装部件被压靠在真空舟皿上的压力，并且其中压力由孔中的真空产生。 当保持孔中的真空时，回流焊接区域以将第二包装部件结合到第一包装部件。

公开(公告)号：US08674496B2

公开(公告)日：2014-03-18

申请号：US13399437

申请日：2012-02-17

Applicant: Cheng-Chung Lin ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Cheng-Chung Lin ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L25/07

CPC classification number: H01L24/14 ,  H01L23/49816 ,  H01L23/5389 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A fine pitch package-on-package (PoP), and a method of forming, are provided. The PoP may be formed by placing connections, e.g., solder balls, on a first substrate having a semiconductor die attached thereto. A first reflow process is performed to elongate the solder balls. Thereafter, a second substrate having another semiconductor die attached thereto is connected to the solder balls. A second reflow process is performed to form an hourglass connection.

Abstract translation: 提供了一种精细节距封装（PoP）和一种形成方法。 PoP可以通过将连接例如焊球放置在具有附接到其上的半导体管芯的第一基板上而形成。 执行第一回流处理以延长焊球。 此后，具有安装有另一个半导体管芯的第二基板连接到焊球。 执行第二回流处理以形成沙漏连接。

公开(公告)号：US08571699B2

公开(公告)日：2013-10-29

申请号：US12879278

申请日：2010-09-10

Applicant: Chen-Fa Lu ,  Cheng-Ting Chen ,  James Hu ,  Chung-Shi Liu

Inventor： Chen-Fa Lu ,  Cheng-Ting Chen ,  James Hu ,  Chung-Shi Liu

IPC: G06F19/00

CPC classification number: G05B19/41875 ,  B24B37/005

Abstract: Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue.

Abstract translation: 通过传感器放置的系统和方法，减少了在后研磨之前处理半导体晶片期间产生的加工缺陷。 将一个或多个孔钻入用于接收半导体晶片的卡盘台，或者在卡盘台旁边的支撑台。 一个或多个传感器设置在孔中，用于在前置后研磨（PBG）过程期间监测参数。 控制箱转换从传感器接收的一组信号。 计算机实现的过程控制工具从控制箱接收转换的信号集，并确定PBG过程是否继续。

公开(公告)号：US20130214401A1

公开(公告)日：2013-08-22

申请号：US13399437

申请日：2012-02-17

Applicant: Cheng-Chung Lin ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Cheng-Chung Lin ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L25/07 ,  H01L21/50

CPC classification number: H01L24/14 ,  H01L23/49816 ,  H01L23/5389 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A fine pitch package-on-package (PoP), and a method of forming, are provided. The PoP may be formed by placing connections, e.g., solder balls, on a first substrate having a semiconductor die attached thereto. A first reflow process is performed to elongate the solder balls. Thereafter, a second substrate having another semiconductor die attached thereto is connected to the solder balls. A second reflow process is performed to form an hourglass connection.

Abstract translation: 提供了一种精细节距封装（PoP）和一种形成方法。 PoP可以通过将连接例如焊球放置在具有附接到其上的半导体管芯的第一基板上而形成。 执行第一回流处理以延长焊球。 此后，具有安装有另一个半导体管芯的第二基板连接到焊球。 执行第二回流处理以形成沙漏连接。

公开(公告)号：US20130143364A1

公开(公告)日：2013-06-06

申请号：US13312395

申请日：2011-12-06

Applicant: Hsiu-Jen LIN ,  Chung-Shi LIU ,  Ming-Da CHENG ,  Chun-Cheng LIN ,  Yu-Peng TSAI ,  Cheng-Ting CHEN

Inventor： Hsiu-Jen LIN ,  Chung-Shi LIU ,  Ming-Da CHENG ,  Chun-Cheng LIN ,  Yu-Peng TSAI ,  Cheng-Ting CHEN

IPC: H01L21/58

Abstract: A method includes vacuum annealing on a substrate having at least one solder bump to reduce voids at an interface of the at least one solder bump. A die is mounted over the substrate.

Abstract translation: 一种方法包括在具有至少一个焊料凸块的衬底上进行真空退火以减少在至少一个焊料凸块的界面处的空隙。 模具安装在基板上。

公开(公告)号：US11517064B2

公开(公告)日：2022-12-06

申请号：US17039882

申请日：2020-09-30

Applicant: Cheng-Ting Chen

Inventor： Cheng-Ting Chen

IPC: A42B3/12 ,  A42B3/14

Abstract: The present invention provides a safety helmet inner lining adjustable for suitable wearing, consisting of: a covering body, which has an inner side surface that contacts a user's head and an outer side surface relative to the inner side surface; at least one interlayer pocket, which is disposed on the outer side surface of the covering body; and at least one cushiony pad, which is suitable for placement inside the interlayer pocket. A user is able to place the cushiony pads of suitable thickness into the interlayer pockets at preset positions according to the user's to head shape and dimensions. The inner lining is then put onto the head and a safety helmet put on top. The cushiony pads enable correcting the interspace between the user's head and the safety helmet, thereby allowing suitable and perfect fitting of the safety helmet that ensures safety of the wearer.

公开(公告)号：US10784221B2

公开(公告)日：2020-09-22

申请号：US13312395

申请日：2011-12-06

Applicant: Hsiu-Jen Lin ,  Chung-Shi Liu ,  Ming-Da Cheng ,  Chung-Cheng Lin ,  Yu-Peng Tsai ,  Cheng-Ting Chen

Inventor： Hsiu-Jen Lin ,  Chung-Shi Liu ,  Ming-Da Cheng ,  Chung-Cheng Lin ,  Yu-Peng Tsai ,  Cheng-Ting Chen

IPC: H01L21/58 ,  H01L23/00 ,  H05K3/34 ,  H05K3/28 ,  H01L21/48

Abstract: A method includes vacuum annealing on a substrate having at least one solder bump to reduce voids at an interface of the at least one solder bump. A die is mounted over the substrate.

公开(公告)号：US08878352B2

公开(公告)日：2014-11-04

申请号：US13357379

申请日：2012-01-24

Applicant: Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

Inventor： Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

IPC: H01L23/02

Abstract: A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.

公开(公告)号：US20140027431A1

公开(公告)日：2014-01-30

申请号：US13559318

申请日：2012-07-26

Applicant: Ming-Da Cheng ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Wei-Yu Chen ,  Chien-Wei Lee ,  Chung-Shi Liu

Inventor： Ming-Da Cheng ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Wei-Yu Chen ,  Chien-Wei Lee ,  Chung-Shi Liu

IPC: B23K31/02 ,  H05B1/00 ,  B25B11/00

CPC classification number: H05B3/02 ,  B23K3/087 ,  B23K2101/40 ,  H01L21/67721 ,  H01L21/6838 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75744 ,  H01L2224/7598 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/3511 ,  H01L2924/37001 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/014

Abstract: A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

Abstract translation: 一种方法包括将第一包装部件放置在真空舟皿上，其中真空舟皿包括孔，并且其中第一包装部件覆盖该孔。 第二包装部件放置在第一包装部件上，其中焊料区域设置在第一和第二包装部件之间。 该孔被抽真空，其中第一包装部件被压靠在真空舟皿上的压力，并且其中压力由孔中的真空产生。 当保持孔中的真空时，回流焊接区域以将第二包装部件结合到第一包装部件。