公开(公告)号：US08759021B2

公开(公告)日：2014-06-24

申请号：US13698924

申请日：2010-05-20

申请人： Hyun Gyu Park ,  Min-Ah Woo ,  Moon Il Kim ,  Sang-Joon Hwang ,  Dae-Yeon Cho

发明人： Hyun Gyu Park ,  Min-Ah Woo ,  Moon Il Kim ,  Sang-Joon Hwang ,  Dae-Yeon Cho

IPC分类号： C12Q1/02 ,  C12Q1/04 ,  C12P1/00 ,  C12N1/00 ,  C12N1/12 ,  C12N1/20

CPC分类号： C12Q1/6897 ,  C12Q1/02 ,  G01N33/6815 ,  G01N2333/245

摘要： Provided are a microorganism for use in quantification of homocysteine and methionine and a method of quantifying homocysteine and methionine in a sample by using the microorganism.

摘要翻译： 提供用于定量同型半胱氨酸和甲硫氨酸的微生物以及通过使用微生物定量样品中同型半胱氨酸和甲硫氨酸的方法。

公开(公告)号：US07697301B2

公开(公告)日：2010-04-13

申请号：US11637664

申请日：2006-12-13

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US20090071705A1

公开(公告)日：2009-03-19

申请号：US12007688

申请日：2008-01-14

申请人： Moon-Il Kim ,  Young-Do Kweon

发明人： Moon-Il Kim ,  Young-Do Kweon

IPC分类号： H01R12/06 ,  H05K3/42

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/18162 ,  H05K2201/0367 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/83005

摘要： A PCB (printed circuit board) having embedded components and a method for manufacturing thereof are disclosed. The PCB may include a dielectric substrate having a cavity formed in one side, a first component inserted in the cavity such that an electrode of the first component faces the one side of the dielectric substrate, a second component mounted on one side of the first component such that an electrode of the second component faces the same direction as the electrode of the first component, a first dielectric layer formed on one side of the dielectric substrate such that the first dielectric layer covers the second component, and a second dielectric layer formed on the other side of the dielectric substrate such that the second dielectric layer covers the first component. In this PCB, multiple components of differing thickness can be mounted, and vias can be formed more easily.

摘要翻译： 公开了具有嵌入部件的PCB（印刷电路板）及其制造方法。 PCB可以包括具有在一侧形成的空腔的电介质基板，插入空腔中的第一部件，使得第一部件的电极面向电介质基板的一侧，第二部件安装在第一部件的一侧 使得第二部件的电极面向与第一部件的电极相同的方向，形成在电介质基板的一侧上的第一电介质层，使得第一电介质层覆盖第二部件，第二电介质层形成在 电介质基板的另一侧使得第二介电层覆盖第一部件。 在该PCB中，可以安装不同厚度的多个部件，并且可以更容易地形成通孔。

公开(公告)号：US20080115349A1

公开(公告)日：2008-05-22

申请号：US11984210

申请日：2007-11-14

申请人： Seung-Gu Kim ,  Je-Gwang Yoo ,  Doo-Hwan Lee ,  Moon-Il Kim

发明人： Seung-Gu Kim ,  Je-Gwang Yoo ,  Doo-Hwan Lee ,  Moon-Il Kim

IPC分类号： H05K3/30 ,  H05K3/36 ,  H05K3/20

CPC分类号： H05K1/185 ,  H01L21/52 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68309 ,  H01L2224/24227 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2203/0156 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165

摘要： A method of manufacturing a component-embedded printed circuit board component is disclosed. With a method of manufacturing a component-embedded printed circuit board that includes: perforating a through-hole in a core substrate, on a surface of which a circuit pattern is formed, attaching tape to one side of the core substrate and attaching a component onto the tape exposed in the through-hole, filling adhesive in a portion of the gap between the through-hole and the component to secure the component, removing the tape, and collectively stacking insulation on both sides of the core substrate to fill the remainder of the gap between the through-hole and the component with portions of the insulation, the component may be embedded using a minimal amount of heterogeneous materials, so that the warpage of the board may be prevented

摘要翻译： 公开了一种制造组件嵌入式印刷电路板部件的方法。 通过制造嵌入元件的印刷电路板的方法，该方法包括：对芯基板中的通孔进行穿孔，在其表面上形成电路图案，将带附着到芯基板的一侧并将元件附着到 胶带暴露在通孔中，将粘合剂填充在通孔和部件之间的间隙的一部分中以固定部件，去除胶带，并且在芯基板的两侧上共同堆叠绝缘体以填充其余部分 通孔和部件之间的间隙与部分绝缘体相同，部件可以使用极少量的异质材料进行嵌入，从而可以防止板的翘曲

公开(公告)号：US20070074900A1

公开(公告)日：2007-04-05

申请号：US11528322

申请日：2006-09-28

申请人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L23/13 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/053 ,  H05K3/4608 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/49156 ,  H01L2924/00

摘要： A printed circuit board and manufacturing method thereof are disclosed. By use of a method of manufacturing a printed circuit board, which uses a metal substrate as a core member and has an electronic component embedded in the metal substrate, mainly comprising: (a) anodizing at least one surface of the metal substrate to form at least one insulation layer, (b) forming an inner layer circuit on the at least one insulation layer, (d) placing chip bond adhesive in correspondence with a position where the electronic component is to be embedded and mounting the electronic component, and (e) forming an outer layer circuit in correspondence with a position where the inner layer circuit is formed and with positions of the electrodes of the electronic component, and which may further comprise an operation (c) of etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded between the operations (b) and (d), a metal substrate, such as that of aluminum, etc., is rendered electrically insulating by applying an anodizing process and is used as a core member in a printed circuit board, so that bending stiffness and heat-releasing property are improved; wet etching can be applied, so that manufacturing costs are reduced; and a chip bond adhesive, die attach film, or nonconductive paste, etc., that is high in thixotropy is used in embedding the electronic component, so that the degree of precision may be increased for the position and height of the electronic component when embedding the electronic component.

摘要翻译： 公开了一种印刷电路板及其制造方法。 通过使用制造印刷电路板的方法，该印刷电路板使用金属基板作为核心部件并且具有嵌入金属基板中的电子部件，其主要包括：（a）阳极氧化金属基板的至少一个表面以形成 至少一个绝缘层，（b）在所述至少一个绝缘层上形成内层电路，（d）将芯片粘结粘合剂放置在与要嵌入电子元件的位置相对应并安装电子元件的位置 ）形成与形成内层电路的位置对应的外层电路和电子部件的电极的位置，并且还可以包括蚀刻金属基板以形成相应的空腔的操作（c） 具有将电子部件嵌入在操作（b）和（d）之间的位置，诸如铝等的金属基板通过ap被电绝缘 采用阳极氧化工艺，用作印刷电路板中的芯材，改善了弯曲刚度和散热性能; 可以应用湿蚀刻，从而降低制造成本; 并且在嵌入电子部件时使用具有高触变性的芯片接合粘合剂，芯片附着膜或非导电浆料等，使得当嵌入时电子部件的位置和高度的精度可以增加 电子元件。

公开(公告)号：US20120160549A1

公开(公告)日：2012-06-28

申请号：US13030837

申请日：2011-02-18

申请人： Moon Il Kim ,  Yul Kyo Chung ,  Jung Soo Byun

发明人： Moon Il Kim ,  Yul Kyo Chung ,  Jung Soo Byun

IPC分类号： H05K1/09 ,  H05K3/00 ,  H05K1/16

CPC分类号： H05K3/445 ,  H01L24/24 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/07811 ,  H05K1/185 ,  H05K2201/09745 ,  H05K2201/10015 ,  H05K2201/2009 ,  H05K2203/0323 ,  H05K2203/1469 ,  Y10T29/49124 ,  H01L2924/00

摘要： Disclosed is a printed circuit board having an embedded electronic component, including a metal substrate having a first cavity formed in a thickness direction and a support plate integrated with one side of the metal substrate and formed in the first cavity. Thereby, a method of manufacturing such a printed circuit board is also provided. When manufacturing the printed circuit board having an embedded electronic component, there is no need for an additional member including support tape to seat the electronic component, thus simplifying the manufacturing process and reducing lead time, thereby improving productivity.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板，包括具有在厚度方向上形成的第一空腔的金属基板和与该金属基板的一侧成一体并形成在第一空腔中的支撑板。 因此，还提供了制造这种印刷电路板的方法。 当制造具有嵌入式电子部件的印刷电路板时，不需要包括支撑带的附加构件来安置电子部件，从而简化了制造工艺并缩短了交货时间，从而提高了生产率。

公开(公告)号：US20090277673A1

公开(公告)日：2009-11-12

申请号：US12215414

申请日：2008-06-27

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/025 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

摘要： Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the internal layer circuits; and external layer circuits formed on the insulating layer and being electrically connected to the internal layer circuits.

摘要翻译： 本发明提供一种嵌入其中的电子部件的PCB，该PCB包括嵌入其中的电子部件的芯层和在其上形成的树脂层。 形成在树脂层上并与电子部件电连接的内层电路; 形成在所述内层电路上的绝缘层; 以及形成在绝缘层上并与内部层电路电连接的外部层电路。

公开(公告)号：US20070132536A1

公开(公告)日：2007-06-14

申请号：US11637664

申请日：2006-12-13

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H01F5/00

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US20060189351A1

公开(公告)日：2006-08-24

申请号：US11156152

申请日：2005-06-17

申请人： Seong-Taek Hwang ,  Jae-Hoon Lee ,  Moon-Il Kim ,  Ji-Chai Jeong ,  Jong-Kuck Son

发明人： Seong-Taek Hwang ,  Jae-Hoon Lee ,  Moon-Il Kim ,  Ji-Chai Jeong ,  Jong-Kuck Son

IPC分类号： H04B1/38 ,  H04M1/00

CPC分类号： H01P1/127 ,  H01P1/15

摘要： A radio frequency switch is disclosed. The switch includes a plurality of first substrates in which a ground surface is formed on each of the first substrates and a micro-strip line and a semiconductor on/off switch are disposed on a plane surface of the ground surface, a plurality of second substrates in which a ground surface is formed on each of the second substrates and a micro-strip line is disposed on a plan surface of the ground surface, the second substrates being combined with the first substrates so as to cross each other and being electrically connected to the first substrates, and combining means for combining the first and second substrates so as to cross each other.

摘要翻译： 公开了射频开关。 开关包括多个第一基板，其中在每个第一基板上形成接地表面，并且微带线和半导体开/关开关设置在地表面的平面上，多个第二基板 其中在所述第二基板的每一个上形成接地表面，并且在所述接地表面的平面表面上设置微带线，所述第二基板与所述第一基板结合以彼此交叉并且电连接到 第一基板和用于组合第一和第二基板以便彼此交叉的组合装置。

公开(公告)号：US08011086B2

公开(公告)日：2011-09-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/30 ,  H05K3/00 ,  H05K3/36 ,  H05K3/02 ,  H01R9/00

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。