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公开(公告)号：US20170215278A1
公开(公告)日：2017-07-27
申请号：US15008137
申请日：2016-01-27
发明人： Padam Jain , Sarah Haney , Lea-Teng Lee
CPC分类号： H05K1/0353 , H05K3/4682 , H05K2201/0195
摘要： A coreless substrate of a printed circuit board is provided. The coreless substrate includes a first outer metal layer; a first primer layer formed on the first outer metal layer; a first layer of functional prepreg material formed on the first primer layer; a second primer layer formed over the first layer of functional prepreg material; and a second outer metal layer formed on the second primer layer. The first outer metal layer corresponds to a first outer most surface of the printed circuit board, and the second outer metal layer corresponds to a second outer most surface of the printed circuit board.
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公开(公告)号：US20170018501A1
公开(公告)日：2017-01-19
申请号：US14929309
申请日：2015-10-31
发明人： Marshall Maple , Ashish Alawani , Li Sun , Sarah Haney , Lea-Teng Lee , Wei Yao
IPC分类号： H01L23/528 , H01L29/778 , H01L29/20 , H01L29/737 , H01L23/522 , H01L21/768
CPC分类号： H01L23/5283 , H01L21/76804 , H01L21/76816 , H01L21/76877 , H01L23/3736 , H01L23/5226 , H01L29/20 , H01L29/737 , H01L29/7786
摘要： An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.
摘要翻译： 公开了一种装置，包括该装置的半导体封装和方法。 该装置包括基板，多个通孔设置在基板中。 通孔以六边形排列。
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公开(公告)号：US10271421B2
公开(公告)日：2019-04-23
申请号：US15499657
申请日：2017-04-27
发明人： Bernhard Gebauer , Oliver Wiedenmann , Sarah Haney , Lueder Elbrecht , Deog-Soon Choi , Aaron Lee
摘要： Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.
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公开(公告)号：US09997428B2
公开(公告)日：2018-06-12
申请号：US14799534
申请日：2015-07-14
发明人： Marshall Maple , Ashish Alawani , Li Sun , Sarah Haney
IPC分类号： H01L23/367 , H01L21/768 , H01L21/48 , H01L29/20 , H01L23/498 , H05K1/02 , H05K1/11 , H05K3/00 , H01L29/778 , H01L29/737 , H05K3/46 , H01L23/373
CPC分类号： H01L23/367 , H01L21/4857 , H01L21/486 , H01L21/76816 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49827 , H01L29/20 , H01L29/737 , H01L29/778 , H01L2224/16227 , H01L2224/16235 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1037 , H01L2924/13051 , H01L2924/13064 , H01L2924/13091 , H01L2924/1421 , H01L2924/15313 , H05K1/0206 , H05K1/0207 , H05K1/113 , H05K3/0026 , H05K3/4644 , H05K2201/09509
摘要： An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.
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公开(公告)号：US20180098417A1
公开(公告)日：2018-04-05
申请号：US15499657
申请日：2017-04-27
发明人： Bernhard Gebauer , Oliver Wiedenmann , Sarah Haney , Lueder Elbrecht , Deog-Soon Choi , Aaron Lee
CPC分类号： H05K1/0216 , H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/023 , H05K1/165 , H05K3/30 , H05K2201/09972 , H05K2201/10287 , H05K2201/1056
摘要： Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.
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6.发明申请PRINTED CIRCUIT BOARD COMPRISING CO-PLANAR SURFACE PADS AND INSULATING DIELECTRIC 审中-公开印制电路板，包括平面表面和绝缘介质公开(公告)号：US20150351229A1
公开(公告)日：2015-12-03
申请号：US14289098
申请日：2014-05-28
发明人： Lea-Teng Lee , Sarah Haney
CPC分类号： H05K1/0268 , H05K2201/09881 , H05K2201/09909 , H05K2203/0353 , H05K2203/0588
摘要： A printed circuit board (PCB) comprises a non-conductive base layer, a conductive interconnect disposed on the non-conductive base layer and comprising at least two surface pads separated by a trench, and a insulating dam disposed in the trench, wherein the insulating dam electrically isolates the at least two surface pads and has an upper surface that is substantially co-planar with respective upper surfaces of the at least two surface pads.
摘要翻译： 印刷电路板（PCB）包括非导电基底层，布置在非导电基底层上的导电互连，并且包括由沟槽分隔开的至少两个表面焊盘和设置在沟槽中的绝缘堤坝，其中绝缘 坝至少两个表面焊盘电隔离，并且具有与至少两个表面焊盘的相应上表面基本共面的上表面。
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公开(公告)号：US09974181B2
公开(公告)日：2018-05-15
申请号：US15079070
申请日：2016-03-24
发明人： Sarah Haney , Deog Soon Choi , Hyun Mo Ku , Lea-Teng Lee , Nitesh Kumbhat , Ah Ron Lee
IPC分类号： H05K7/00 , H05K1/18 , H05K1/11 , H01L23/552 , H01L25/065
CPC分类号： H05K1/181 , H01L23/552 , H01L25/0655 , H01L2224/16225 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/15321 , H01L2924/15322 , H01L2924/15323 , H01L2924/3025 , H05K1/0218 , H05K1/111 , H05K3/0052 , H05K3/284 , H05K2201/0317 , H05K2201/0715 , H05K2201/09354 , H05K2201/09909 , H05K2201/10371 , H01L2224/45099
摘要： A module includes a printed circuit board (PCB) having a substrate, component pads on a top surface of the substrate, and contact pads formed on a bottom surface of the substrate. The module further includes a mold compound disposed over the PCB; an external shield disposed over a top surface of the mold compound and on side surfaces of the mold compound and the PCB, where the external shield is configured to provide shielding of at least one component connected to at least one component pad from electromagnetic radiation; and a back-spill barrier formed on the bottom of the substrate. The back-spill barrier surrounds the contact pads, and is configured to prevent the external shield from making contact with the contact pads.
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公开(公告)号：US20170280561A1
公开(公告)日：2017-09-28
申请号：US15079070
申请日：2016-03-24
发明人： Sarah Haney , Deog Soon Choi , Hyun Mo Ku , Lea-Teng Lee , Nitesh Kumbhat , Ah Ron Lee
IPC分类号： H05K1/18 , H05K1/11 , H01L23/31 , H05K1/09 , H01L23/00 , H01L25/065 , H01L25/16 , H01L23/498 , H01L23/552
CPC分类号： H05K1/181 , H01L23/552 , H01L25/0655 , H01L2224/16225 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/15321 , H01L2924/15322 , H01L2924/15323 , H01L2924/3025 , H05K1/0218 , H05K1/111 , H05K3/0052 , H05K3/284 , H05K2201/0317 , H05K2201/0715 , H05K2201/09354 , H05K2201/09909 , H05K2201/10371 , H01L2224/45099
摘要： A module includes a printed circuit board (PCB) having a substrate, component pads on a top surface of the substrate, and contact pads formed on a bottom surface of the substrate. The module further includes a mold compound disposed over the PCB; an external shield disposed over a top surface of the mold compound and on side surfaces of the mold compound and the PCB, where the external shield is configured to provide shielding of at least one component connected to at least one component pad from electromagnetic radiation; and a back-spill barrier formed on the bottom of the substrate. The back-spill barrier surrounds the contact pads, and is configured to prevent the external shield from making contact with the contact pads.
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9.发明申请公开(公告)号：US20170223839A1
公开(公告)日：2017-08-03
申请号：US15009532
申请日：2016-01-28
发明人： Padam Jain , Sarah Haney , Ashish Alawani
CPC分类号： H05K3/181 , H01L23/13 , H01L23/5383 , H01L23/552 , H01L24/16 , H01L24/48 , H01L25/0655 , H01L2224/16227 , H01L2224/48227 , H01L2924/15153 , H01L2924/15313 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K1/183 , H05K3/002 , H05K3/0023 , H05K3/0026 , H05K3/188 , H05K3/288 , H05K3/306 , H05K3/4697 , H05K2201/09981 , H05K2201/10674 , H05K2203/054 , H05K2203/308
摘要： A method is provided for fabricating an electromagnetic shield for an electronic component on a PCB. The method includes providing a patterned metal layer; laminating the patterned metal layer with a second dielectric layer; forming a cavity in the second dielectric layer; applying a dry film resist over the second dielectric layer and the cavity; stripping the dry film resist from the second dielectric layer and portions of the cavity adjacent the cavity side walls; depositing a seed layer and metal over the second dielectric layer and the dry film resist; etching the preplating layer and the seed layer from top surfaces of a remainder of the dry film resist and the second dielectric layer; and stripping the remainder of the dry film resist, thereby exposing the preplating layer on the side walls of the cavity to provide the electromagnetic shield.
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公开(公告)号：US20170018478A1
公开(公告)日：2017-01-19
申请号：US14799534
申请日：2015-07-14
发明人： Marshall Maple , Ashish Alawani , Li Sun , Sarah Haney
IPC分类号： H01L23/367 , H01L21/768 , H01L21/48 , H01L29/20 , H05K1/11 , H05K3/00 , H01L29/778 , H01L29/737 , H01L23/498 , H05K1/02
CPC分类号： H01L23/367 , H01L21/4857 , H01L21/486 , H01L21/76816 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49827 , H01L29/20 , H01L29/737 , H01L29/778 , H01L2224/16227 , H01L2224/16235 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1037 , H01L2924/13051 , H01L2924/13064 , H01L2924/13091 , H01L2924/1421 , H01L2924/15313 , H05K1/0206 , H05K1/0207 , H05K1/113 , H05K3/0026 , H05K3/4644 , H05K2201/09509
摘要： An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.
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