公开(公告)号：US5365656A

公开(公告)日：1994-11-22

申请号：US61753

申请日：1993-05-14

申请人： Donald W. Dahringer ,  Alan M. Lyons

发明人： Donald W. Dahringer ,  Alan M. Lyons

IPC分类号： H05K3/32 ,  H01R4/04 ,  H05K3/30 ,  H05K13/04

CPC分类号： H05K3/303 ,  H01R4/04 ,  H05K13/0469 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2203/0173 ,  H05K2203/0278 ,  H05K2203/085 ,  H05K3/321 ,  H05K3/323 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49146

摘要： A process of batch assembly of sundry leaded or padded devices, encapsulated and non-encapsulated, onto a printed wiring board (PWB), which exhibit significant improvements in both manufacturability and reliability. A pressure frame assembly apparatus permits an application of uniformly distributed pressures to a variety of leaded packages and padded semiconductor chips during cure of conductive adhesives (AdCons), and leads to the reduction of variations in initial interconnection resistance, and thereby to the enhancement of the reliability of AdCon interconnections. The pressures are applied to the devices by an external application of a fluid under pressure to a flexible, resiliently stretchable membrane which conformably envelops outlines of the devices and adjacent areas of the PWB. Application of vacuum suction to within the cavity, formed by the pressure frame and the membrane, prior to the external application of the fluid pressure to the membrane, further improving the reliability of surface mounted assembly of packages on the interconnection board. The external application of pressure enhances thermal conductivity needed for curing the AdCon, increases the range of processing parameters usable for this technique and reduces assembly times. Assembly yields approaching 100% were observed for a variety of surface mounted packages indicating that the system will be highly reliable.

摘要翻译： 将印刷线路板（PWB）的封装和非封装的各种含铅或填充装置批量组装的过程，其显示出可制造性和可靠性的显着改进。 压力框架组装装置允许在导电粘合剂（AdCons）固化期间向各种引线封装和填充半导体芯片施加均匀分布的压力，并且导致初始互连电阻的变化的减小，从而增强 AdCon互连的可靠性。 通过将压力下的流体外部施加到柔性的可弹性拉伸膜上来施加压力，该膜顺应地包围装置的轮廓和PWB的相邻区域。 在将流体压力外部施加到膜之前，由压力框架和膜形成的空腔内的真空吸力的应用进一步提高了互连板上的表面安装组件的可靠性。 压力的外部应用提高了AdCon固化所需的热导率，增加了可用于该技术的加工参数的范围，并减少了装配时间。 对于各种表面贴装的封装观察到组装产量接近100％，表明系统将是高度可靠的。

公开(公告)号：US5257000A

公开(公告)日：1993-10-26

申请号：US835793

申请日：1992-02-14

申请人： Robert L. Billings ,  Donald W. Dahringer ,  Alan M. Lyons

发明人： Robert L. Billings ,  Donald W. Dahringer ,  Alan M. Lyons

IPC分类号： H01F17/06 ,  H01F17/00 ,  H01F41/04 ,  H01F5/00

CPC分类号： H01F41/046 ,  H01F17/0033 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49789

摘要： Magnetic circuit elements, e.g. for inclusion on circuit boards including one or more windings about a toroidal core are produced by joinder of mating sheets, one or both recessed to hold the core, and each containing partial windings. Joinder is by use of an anisotropically conducting adhesive layer. The layer is applied as an uncured thermosetting adhesive containing spherical conducting particles of such size and distribution as to statistically result in electrical completion of windings while avoiding turn-to-turn shorting.

公开(公告)号：US4979664A

公开(公告)日：1990-12-25

申请号：US436995

申请日：1989-11-15

申请人： Alan M. Lyons ,  Stephen G. Seger, Jr.

发明人： Alan M. Lyons ,  Stephen G. Seger, Jr.

IPC分类号： B23K1/00 ,  B23K1/012 ,  B23K3/00 ,  B23K101/42 ,  H05K3/34 ,  H05K13/04

CPC分类号： H05K13/0465 ,  B23K1/012 ,  H05K3/3421 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/082 ,  H05K2203/086 ,  H05K3/3494 ,  Y02P70/613

摘要： Disclosed is a method for making a solder joint without flux, in the presence of an inert gas. A pair of articles having solder-coated surfaces are heated to melt the solder, pressure is applied to the joint region, and the articles are cooled. During the heating step, inert gas is flowed over the articles.

摘要翻译： 公开了一种在惰性气体存在下制备无助焊剂的焊点的方法。 将具有焊料涂覆表面的一对制品加热以熔化焊料，将压力施加到接合区域，并且制品被冷却。 在加热步骤期间，惰性气体流过物品。

公开(公告)号：US20090294117A1

公开(公告)日：2009-12-03

申请号：US12128478

申请日：2008-05-28

申请人： Marc S. Hodes ,  Alan M. Lyons

发明人： Marc S. Hodes ,  Alan M. Lyons

IPC分类号： F28D15/00 ,  G05D23/00

CPC分类号： H01L23/427 ,  F28D15/06 ,  H01L23/38 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus includes a body containing a vapor chamber and having first and opposing second major surfaces and a thermoelectric module having first and opposing second major surfaces. The second major surface of the body is in thermal contact with the first major surface of the thermoelectric module. A heat sink has a first major surface in thermal contact with the second major surface of the thermoelectric module. The thermoelectric module is configured to control a flow of heat between the body and the heat sink.

摘要翻译： 一种装置包括一个包含蒸汽室并具有第一和相对的第二主表面的主体和具有第一和相对的第二主表面的热电模块。 主体的第二主表面与热电模块的第一主表面热接触。 散热器具有与热电模块的第二主表面热接触的第一主表面。 热电模块被配置为控制主体和散热器之间的热量流动。

公开(公告)号：US20120000848A1

公开(公告)日：2012-01-05

申请号：US13231399

申请日：2011-09-13

申请人： Alan M. Lyons ,  John Mullins ,  Michael J. Schabel

发明人： Alan M. Lyons ,  John Mullins ,  Michael J. Schabel

IPC分类号： B01J19/32 ,  F15D1/00

CPC分类号： B81B1/008 ,  B08B17/06 ,  B33Y80/00 ,  Y10T137/0396 ,  Y10T428/24 ,  Y10T428/24132

摘要： Apparatus including a rigid fluid-permeable body, having a first non-planar fluid-permeable body surface, and having a second fluid-permeable body surface; a plurality of fluid-permeable cells in the fluid-permeable body; and a plurality of raised micro-scale features on the first fluid-permeable body surface. Apparatus including a fluid-permeable body having first and second fluid-permeable body surfaces; a plurality of fluid-permeable cells in the fluid-permeable body; a plurality of raised micro-scale features on the first fluid-permeable body surface; and a fluid containment body forming, together with the second fluid-permeable body surface, a second fluid containment structure. Methods, utilizing an apparatus, of treating a liquid with a fluid, and of maintaining a superhydrophobic surface.

摘要翻译： 一种装置，包括刚性流体可渗透体，具有第一非平面流体可渗透体表面，并具有第二流体可渗透体表面; 流体可渗透体中的多个流体可渗透细胞; 以及在所述第一流体可透过体表面上的多个凸起的微尺度特征。 包括具有第一和第二流体可渗透体表面的流体可渗透体的装置; 流体可渗透体中的多个流体可渗透细胞; 在第一流体可透过体表面上的多个凸起的微尺度特征; 以及与第二流体可渗透体表面一起形成第二流体容纳结构的流体容纳体。 方法，利用设备，用流体处理液体，并保持超疏水表面。

公开(公告)号：US5608262A

公开(公告)日：1997-03-04

申请号：US393628

申请日：1995-02-24

申请人： Yinon Degani ,  Thomas D. Dudderar ,  Byung J. Han ,  Alan M. Lyons ,  King L. Tai

发明人： Yinon Degani ,  Thomas D. Dudderar ,  Byung J. Han ,  Alan M. Lyons ,  King L. Tai

IPC分类号： H01L25/18 ,  H01L23/13 ,  H01L23/14 ,  H01L23/31 ,  H01L23/498 ,  H01L25/04 ,  H01L25/065 ,  H01L25/07 ,  H05K3/30 ,  H01L23/34

CPC分类号： H01L23/3107 ,  H01L23/13 ,  H01L23/147 ,  H01L23/4985 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/157 ,  H01L2924/16152 ,  H01L2924/19041

摘要： Described is a novel packaging of MCM tiles without wire-bond interconnections and in a total thickness which is reduced relative to conventional MCM packaging. The MCM tile includes a substrate with a plurality of peripheral metallizations and at least one chip flip-chip mounted on the substrate. The PWB is provided with an aperture which is smaller than the size of the silicon substrate but larger than the outside dimensions of the mounted chips. The substrate is positioned on the PWB so that its ends overlap areas of the PWB adjacent the aperture and the chips fit into the aperture. Peripheral metallizations on the substrate are interconnected to metallizations on the PWB by either solder reflow technology or conductive adhesive technology.

摘要翻译： 描述了一种新颖的MCM瓦片封装，无需引线键合互连，并且相对于常规MCM封装而言，其总厚度减小。 MCM瓦片包括具有多个外围金属化的基板和安装在基板上的至少一个芯片倒装芯片。 PWB设置有小于硅基板的尺寸但大于安装的芯片的外部尺寸的孔径。 基板被定位在PWB上，使得其端部与邻近孔径的PWB的区域重叠，并且芯片装配到孔中。 衬底上的外围金属化通过焊料回流技术或导电粘合剂技术与PWB上的金属化相互连接。

公开(公告)号：US20080131653A1

公开(公告)日：2008-06-05

申请号：US11607134

申请日：2006-11-30

申请人： Alan M. Lyons ,  John Mullins ,  Michael J. Schabel

发明人： Alan M. Lyons ,  John Mullins ,  Michael J. Schabel

IPC分类号： B32B7/00

CPC分类号： B81B1/008 ,  B08B17/06 ,  B33Y80/00 ,  Y10T137/0396 ,  Y10T428/24 ,  Y10T428/24132

摘要： Apparatus including a rigid fluid-permeable body, having a first non-planar fluid-permeable body surface, and having a second fluid-permeable body surface; a plurality of fluid-permeable cells in the fluid-permeable body; and a plurality of raised micro-scale features on the first fluid-permeable body surface. Apparatus including a fluid-permeable body having first and second fluid-permeable body surfaces; a plurality of fluid-permeable cells in the fluid-permeable body; a plurality of raised micro-scale features on the first fluid-permeable body surface; and a fluid containment body forming, together with the second fluid-permeable body surface, a second fluid containment structure. Methods, utilizing an apparatus, of treating a liquid with a fluid, and of maintaining a superhydrophobic surface.

摘要翻译： 一种装置，包括刚性流体可渗透体，具有第一非平面流体可渗透体表面，并具有第二流体可渗透体表面; 流体可渗透体中的多个流体可渗透细胞; 以及在所述第一流体可透过体表面上的多个凸起的微尺度特征。 包括具有第一和第二流体可渗透体表面的流体可渗透体的装置; 流体可渗透体中的多个流体可渗透细胞; 在第一流体可透过体表面上的多个凸起的微尺度特征; 以及与第二流体可渗透体表面一起形成第二流体容纳结构的流体容纳体。 方法，利用设备，用流体处理液体，并保持超疏水表面。

公开(公告)号：US06225571B1

公开(公告)日：2001-05-01

申请号：US09252741

申请日：1999-02-19

申请人： Jeffrey L. Bream ,  Stephen A. Ferranti ,  Madhu Ganesa-Pillai ,  Leon Klafter ,  Alan M. Lyons ,  John Paul Mello ,  Steven J. Vargo

发明人： Jeffrey L. Bream ,  Stephen A. Ferranti ,  Madhu Ganesa-Pillai ,  Leon Klafter ,  Alan M. Lyons ,  John Paul Mello ,  Steven J. Vargo

IPC分类号： H05K118

CPC分类号： H05K3/341 ,  H01L23/36 ,  H01L23/3736 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/056 ,  H05K1/141 ,  H05K2201/066 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

摘要： The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m° C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.

摘要翻译： 本发明提供一种与发热电气部件一起使用的散热器。 散热器包括具有相对侧的脊柱，从脊部延伸的冷却片，以及粘附到至少一个相对侧的电介质层。 电介质层具有至少约1W / m℃的热导率。散热器还可以包括附着到电介质层的金属层。 金属层提供可以粘附电气部件的表面。 散热器还可以包括附着在金属层上的发热部件。 在另一方面，发热部件是用焊料粘附到金属层的表面安装电子部件。

公开(公告)号：US4691091A

公开(公告)日：1987-09-01

申请号：US814986

申请日：1985-12-31

申请人： Alan M. Lyons ,  Frederick T. Mendenhall, Jr. ,  Murray Robbins ,  Nathaniel R. Quick ,  Cletus W. Wilkins, Jr.

发明人： Alan M. Lyons ,  Frederick T. Mendenhall, Jr. ,  Murray Robbins ,  Nathaniel R. Quick ,  Cletus W. Wilkins, Jr.

IPC分类号： H01B1/04 ,  H01B13/00 ,  H05K3/10 ,  B23K26/00

CPC分类号： H05K3/105 ,  H05K2203/107 ,  H05K2203/1136

摘要： Electrically conductive paths are produced on a polymeric substrate by laser writing, i.e., by tracing desired paths on the substrate by a laser beam. The resulting paths comprise electrically conductive carbon as produced by thermal decomposition of substrate surface material; the paths can serve; e.g., as electrical interconnections akin to printed circuitry on a wiring board. Optionally, the conductivity of paths can be enhanced by electroplating a suitable conductor metal or alloy onto the paths.

摘要翻译： 导电路径通过激光写入在聚合物衬底上产生，即通过用激光束追踪衬底上所需的路径。 所得到的路径包括由基底表面材料的热分解产生的导电碳; 路径可以服务; 例如，作为类似于布线板上的印刷电路的电互连。 可选地，可以通过将合适的导体金属或合金电镀到路径上来增强路径的导电性。