摘要:
A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.
摘要:
A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.
摘要:
A method for fabricating a matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board is formed to include a board made of an insulating material, first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other, and through holes provided at cross points of the first and second wiring patterns. A connection pin inserted into at least one of the through holes, electrically connects at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side.
摘要:
A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.
摘要:
A wiring board structure includes a board made of a material which can be etched by a given solution, an electrically conductive portion, which is thermally conductive, having a portion which extends from the board and which can be etched by the given solution, and an insulating layer having a portion which is in contact with the board and only the side surface of the electrically conductive portion and which prevents the board from being etched when the electrically conductive layer is etched.
摘要:
An electronic component includes a driver that outputs a signal to a reception apparatus; a storage device storing therein reflection information related to a reflected wave that returns to the driver when the signal is reflected back by the reception apparatus; a reflected wave detector that based on the reflection information, determines a measurement period for measuring the reflected wave and that based on the measurement period, measures an arrival time and a peak amplitude of the reflected wave; and a controller that based on the arrival time and the peak amplitude, extracts reflected-wave cancelling information for inhibiting effects of the reflected wave from the reception apparatus and that sets the extracted reflected-wave cancelling information in the driver.
摘要:
An electromagnetic field simulation apparatus disclosed herein replaces a predetermined region in printed circuit board CAD data to be subjected to electromagnetic field simulation with measurement data measured by a near-field measurement device and generates new printed circuit board CAD data. Subsequently, regarding a measurement data portion in the new printed circuit board CAD data generated by the data generating unit, the electromagnetic field simulation apparatus generates analysis model data by setting, as a wave source, an electric field or a magnetic field measured by the near-field measurement device. Then, the electromagnetic field simulation apparatus executes electromagnetic field simulation with respect to the analysis model data having a set wave source.
摘要:
In order to make it possible to automatically execute a wiring process which satisfies not only a design condition but also design quality relating to an electric characteristic, according to the embodiment, an automatic wiring apparatus includes a design condition changing section for changing a design condition in accordance with priority information regarding the design condition where a wiring process which satisfies the design condition cannot be carried out by a first wiring processing section, a quality allowability decision section for deciding whether or not quality of a wiring region can be allowed where a wiring process which satisfies the design condition after the changing can be executed by a second wiring processing section and an outputting section for outputting a result of the wiring process of the wiring region by the second wiring processing section if it is decided that the quality of the wiring region can be allowed.
摘要:
An object of the present invention is to provide a connector structure for achieving a signal connection between modules not by way of a motherboard. In an electronic apparatus in which a plurality of modules (3, 4) are mounted on a motherboard (1) in an orderly manner, while flatly positioned parallel to the latter, and electrical connections between the modules and between the respective module and the motherboard are achieved by a connector body (2) extending along a boundary between the adjacent modules (3, 4), contacts (6, 7) are provided in the peripheral regions of the respective module (3, 4). Both the contacts (6, 7) are electrically connected with each other by pressing a connector spring (8) fixed in the connector body (2) onto the contacts (6, 7) provided in the peripheral regions of the adjacent modules (3. 4).
摘要:
A printed circuit board includes a through hole constituted by a hole penetrating through the front and rear surfaces of the printed circuit board. A fabrication method of the printed circuit board, includes applying conductive material plating to the inner wall surface of the hole to form a through hole electrically connecting the front and rear surfaces of the printed circuit board, and removing the conductive material plated on the hole inner wall surface at least at a portion between the front and rear surfaces of the printed circuit board is carried out to thereby fabricate a printed circuit board having a through hole electrically isolates the front surface of the printed circuit board from the rear surface thereof.