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14 条记录 (耗时 0.021 秒)

    Connector structure for modules in electronic apparatus
    5.
    发明授权
    Connector structure for modules in electronic apparatus 失效
    电子设备模块的连接器结构

    公开(公告)号：US5355282A

    公开(公告)日：1994-10-11

    申请号：US39242

    申请日：1993-04-26

    申请人： Hitoshi Yokemura ,  Masao Hosogai ,  Yuko Tsujimura

    发明人： Hitoshi Yokemura ,  Masao Hosogai ,  Yuko Tsujimura

    IPC分类号： H01R4/48 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H05K7/10 ,  H05K7/02

    CPC分类号： H05K1/142 ,  H01R12/714 ,  H05K7/1061 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K3/325 ,  H05K3/368

    摘要： An object of the present invention is to provide a connector structure for achieving a signal connection between modules not by way of a motherboard. In an electronic apparatus in which a plurality of modules (3, 4) are mounted on a motherboard (1) in an orderly manner, while flatly positioned parallel to the latter, and electrical connections between the modules and between the respective module and the motherboard are achieved by a connector body (2) extending along a boundary between the adjacent modules (3, 4), contacts (6, 7) are provided in the peripheral regions of the respective module (3, 4). Both the contacts (6, 7) are electrically connected with each other by pressing a connector spring (8) fixed in the connector body (2) onto the contacts (6, 7) provided in the peripheral regions of the adjacent modules (3. 4).

    摘要翻译： 本发明的目的是提供一种连接器结构，用于实现不是通过母板的模块之间的信号连接。 在其中多个模块（3,4）以有序的方式安装在主板（1）上的平面定位的电子设备中，并且在模块之间以及相应模块和主板之间的电连接 通过沿相邻模块（3,4）之间的边界延伸的连接器主体（2）来实现，在相应模块（3,4）的周边区域中提供触点（6,7）。 通过将固定在连接器主体（2）中的连接器弹簧（8）压在设置在相邻模块（3）的周边区域中的触点（6,7）上，两个触点（6,7）彼此电连接。 4）。

    Circuit board packaging structure
    6.
    发明授权
    Circuit board packaging structure 失效
    电路板封装结构

    公开(公告)号：US06388879B1

    公开(公告)日：2002-05-14

    申请号：US08387046

    申请日：1995-02-09

    申请人： Hiroyuki Otaguro ,  Takayuki Ashida ,  Hitoshi Yokemura ,  Hidenao Nakajima ,  Yoshimi Watanabe ,  Shuuhei Fujita

    发明人： Hiroyuki Otaguro ,  Takayuki Ashida ,  Hitoshi Yokemura ,  Hidenao Nakajima ,  Yoshimi Watanabe ,  Shuuhei Fujita

    IPC分类号： H05K720

    CPC分类号： H05K7/1458 ,  G02B6/43

    摘要： A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.

    摘要翻译： 一种电路板封装结构，包括彼此并联设置的多个电路板，并且每个电路板与电路部件一起封装。 与多个电路基板中包含的电路部件相比，具有比放电量大的电路部件的电路板设置在多个电路基板的最外侧。 填充有显示较大放热量的电路部件的电路板的表面指向结构外部。

    ELECTRONIC COMPONENT AND REFLECTED-WAVE CANCELLING METHOD
    7.
    发明申请
    ELECTRONIC COMPONENT AND REFLECTED-WAVE CANCELLING METHOD 有权
    电子元件和反射波取消方法

    公开(公告)号：US20130049848A1

    公开(公告)日：2013-02-28

    申请号：US13535990

    申请日：2012-06-28

    申请人： Takeshi UEMURA ,  Masaki Tosaka ,  Hitoshi Yokemura

    发明人： Takeshi UEMURA ,  Masaki Tosaka ,  Hitoshi Yokemura

    IPC分类号： H04B1/10

    CPC分类号： H04L25/028

    摘要： An electronic component includes a driver that outputs a signal to a reception apparatus; a storage device storing therein reflection information related to a reflected wave that returns to the driver when the signal is reflected back by the reception apparatus; a reflected wave detector that based on the reflection information, determines a measurement period for measuring the reflected wave and that based on the measurement period, measures an arrival time and a peak amplitude of the reflected wave; and a controller that based on the arrival time and the peak amplitude, extracts reflected-wave cancelling information for inhibiting effects of the reflected wave from the reception apparatus and that sets the extracted reflected-wave cancelling information in the driver.

    摘要翻译： 电子部件包括向接收装置输出信号的驱动器; 存储装置，其中存储与所述接收装置反射的所述信号相关的与反射波有关的反射信息，所述反射波返回所述驾驶员; 基于反射信息的反射波检测器确定用于测量反射波的测量周期，并且基于测量周期，测量反射波的到达时间和峰值振幅; 并且基于到达时间和峰值振幅的控制器提取用于抑制来自接收装置的反射波的效果的反射波消除信息，并且将所提取的反射波消除信息设置在驾驶员中。

    ELECTROMAGNETIC FIELD SIMULATION APPARATUS AND NEAR-FIELD MEASUREMENT DEVICE
    8.
    发明申请
    ELECTROMAGNETIC FIELD SIMULATION APPARATUS AND NEAR-FIELD MEASUREMENT DEVICE 失效
    电磁场仿真装置和近场测量装置

    公开(公告)号：US20100312539A1

    公开(公告)日：2010-12-09

    申请号：US12787610

    申请日：2010-05-26

    申请人： Takashi Yamagajo ,  Hitoshi Yokemura

    发明人： Takashi Yamagajo ,  Hitoshi Yokemura

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5018 ,  G06F2217/16

    摘要： An electromagnetic field simulation apparatus disclosed herein replaces a predetermined region in printed circuit board CAD data to be subjected to electromagnetic field simulation with measurement data measured by a near-field measurement device and generates new printed circuit board CAD data. Subsequently, regarding a measurement data portion in the new printed circuit board CAD data generated by the data generating unit, the electromagnetic field simulation apparatus generates analysis model data by setting, as a wave source, an electric field or a magnetic field measured by the near-field measurement device. Then, the electromagnetic field simulation apparatus executes electromagnetic field simulation with respect to the analysis model data having a set wave source.

    摘要翻译： 本文所公开的电磁场模拟装置将印刷电路板的CAD数据中的预定区域替换为由近场测量装置测量的测量数据进行电磁场模拟，并生成新的印刷电路板CAD数据。 随后，关于由数据生成单元生成的新的印刷电路板CAD数据中的测量数据部分，电磁场模拟装置通过将近场测量的电场或磁场设置为波源来生成分析模型数据 现场测量装置。 然后，电磁场模拟装置对具有设定波源的分析模型数据进行电磁场模拟。

    Automatically wiring circuit by setting and changing reference to design quality relating to electric characteristic
    9.
    发明授权
    Automatically wiring circuit by setting and changing reference to design quality relating to electric characteristic 失效
    通过设置和改变与电气特性相关的设计质量参考自动布线电路

    公开(公告)号：US08219955B2

    公开(公告)日：2012-07-10

    申请号：US12574084

    申请日：2009-10-06

    申请人： Daita Tsubamoto ,  Hitoshi Yokemura ,  Hidenobu Shiihara ,  Kazukiyo Ogawa ,  Hisashi Aoyama ,  Masaki Tosaka

    发明人： Daita Tsubamoto ,  Hitoshi Yokemura ,  Hidenobu Shiihara ,  Kazukiyo Ogawa ,  Hisashi Aoyama ,  Masaki Tosaka

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5077 ,  H05K1/0231 ,  H05K3/0005

    摘要： In order to make it possible to automatically execute a wiring process which satisfies not only a design condition but also design quality relating to an electric characteristic, according to the embodiment, an automatic wiring apparatus includes a design condition changing section for changing a design condition in accordance with priority information regarding the design condition where a wiring process which satisfies the design condition cannot be carried out by a first wiring processing section, a quality allowability decision section for deciding whether or not quality of a wiring region can be allowed where a wiring process which satisfies the design condition after the changing can be executed by a second wiring processing section and an outputting section for outputting a result of the wiring process of the wiring region by the second wiring processing section if it is decided that the quality of the wiring region can be allowed.

    摘要翻译： 为了能够自动执行不仅满足设计条件而且满足与电气特性相关的设计质量的布线处理，所以根据本实施例，自动布线装置包括设计条件改变部分，用于改变设计条件 根据关于设计条件的优先级信息，其中满足设计条件的布线处理不能由第一布线处理部进行，质量允许判定部，用于判定布线处理是否允许布线区域的质量 如果确定布线区域的质量，则可以通过第二布线处理部分和输出部分执行改变之后满足设计条件的第二布线处理部分用于输出布线区域的布线处理结果的输出部分 可以允许。