公开(公告)号：US20140027927A1

公开(公告)日：2014-01-30

申请号：US13923035

申请日：2013-06-20

申请人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

IPC分类号： H01L23/48 ,  H01L21/762

CPC分类号： H01L21/76224 ,  B81B7/007 ,  B81B2207/096 ,  B81C1/00095 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/05009 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83193 ,  H01L2224/83805 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  H01L2224/0231 ,  H01L2224/83 ,  H01L21/78 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/00

摘要： A method for manufacturing a component having an electrical through-connection is described. The method includes the following steps: providing a semiconductor substrate having a front side and a back side opposite from the front side, producing an insulating trench, which annularly surrounds a contact area, on the front side of the semiconductor substrate, filling the insulating trench with an insulating material, producing an electrical contact structure on the front side of the semiconductor substrate by depositing an electrically conductive material in the contact area, removing the semiconductor material remaining in the contact area on the back side of the semiconductor substrate in order to produce a contact hole which opens up the bottom side of the contact structure, and depositing a metallic material in the contact hole in order to electrically connect the electrical contact structure to the back side of the semiconductor substrate.

摘要翻译： 描述了一种用于制造具有电穿通连接的部件的方法。 该方法包括以下步骤：提供具有与前侧相反的前侧和后侧的半导体衬底，在半导体衬底的正面上产生环形地包围接触区域的绝缘沟槽，填充绝缘沟槽 具有绝缘材料，通过在接触区域中沉积导电材料，在半导体衬底的正面上产生电接触结构，去除残留在半导体衬底背面接触区域中的半导体材料，以便产生 接触孔，其向开放接触结构的底侧开口，并且在接触孔中沉积金属材料，以将电接触结构电连接到半导体衬底的背面。

公开(公告)号：US20150053001A1

公开(公告)日：2015-02-26

申请号：US14468214

申请日：2014-08-25

申请人： Jens FREY ,  Jochen REINMUTH

发明人： Jens FREY ,  Jochen REINMUTH

IPC分类号： B81B3/00 ,  G01P3/14 ,  G01P3/44

CPC分类号： B81B3/0027 ,  B81B3/0086 ,  B81B2203/04 ,  G01C19/574 ,  G01C19/5755 ,  G01P3/14 ,  G01P3/44

摘要： A micromechanical component is provided having a substrate having a main plane of extension, a first electrode extending mainly along a first plane in planar fashion, a second electrode extending mainly along a second plane in planar fashion, and a third electrode extending mainly along a third plane in planar fashion, the first, second, and third plane being oriented essentially parallel to the main plane of extension and being situated one over the other at a distance from one another along a normal direction that is essentially perpendicular to the main plane of extension, the micromechanical component having a deflectable mass element, the mass element being capable of being deflected both essentially parallel and also essentially perpendicular to the main plane of extension, the second electrode being connected immovably to the mass element, the second electrode having, in a rest position, a first region of overlap with the first electrode along a projection direction essentially parallel to the normal direction, and having a second region of overlap with the third electrode along a projection direction parallel to the projection direction, the mass element extending in planar fashion mainly along the third plane, the mass element having a recess that extends completely through the mass element, extending in planar fashion along the third plane and parallel to the normal direction, the third electrode being situated at least partly in the recess.

摘要翻译： 提供一种微机械部件，其具有主平面延伸的基板，主要以平面方式沿着第一平面延伸的第一电极，主要沿平面方向延伸的第二平面延伸的第二电极和主要沿第三平面延伸的第三电极 平面，平面的第一，第二和第三平面被定向成基本上平行于延伸的主平面，并且沿着基本垂直于延伸的主平面的法线方向彼此间隔一定距离 所述微机械部件具有可偏转的质量元件，所述质量元件能够基本上平行且基本上垂直于所述主平面延伸，所述第二电极不可移动地连接到所述质量元件，所述第二电极具有 静止位置，基本上沿着投影方向与第一电极重叠的第一区域 平行于法线方向，并且沿平行于投射方向的投影方向具有与第三电极重叠的第二区域，质量元件主要沿第三平面延伸，质量元件具有完全延伸穿过的凹部 所述质量元件沿着所述第三平面以平面方式延伸并且平行于所述法线方向，所述第三电极至少部分地位于所述凹部中。

公开(公告)号：US20140374853A1

公开(公告)日：2014-12-25

申请号：US14307662

申请日：2014-06-18

申请人： Heribert WEBER ,  Hartmut KUEPPERS ,  Jens FREY ,  Jochen REINMUTH ,  Neil DAVIES

发明人： Heribert WEBER ,  Hartmut KUEPPERS ,  Jens FREY ,  Jochen REINMUTH ,  Neil DAVIES

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81B7/0048 ,  H01L2224/16225

摘要： Measures are provided for stress decoupling between a semiconductor component and its mounting support, these measures being implementable very easily, inexpensively and in a space-saving manner, regardless of the substrate thickness of the component, and not being limited to soldered connections but instead also being usable in conjunction with other mounting and joining techniques. These measures relate to components, which include at least one electrical and/or micromechanical functionality and at least one wiring level, which is formed in a layer structure on a main surface of the component substrate, at least one mounting surface being implemented in the wiring level to establish a mechanical and/or electrical connection of the component to a support. The at least one mounting surface is spring mounted and is separated from the layer structure in at least some areas for this purpose.

摘要翻译： 提供了用于半导体部件与其安装支撑件之间的应力解耦的措施，这些措施可以非常容易地，低成本地且以节省空间的方式实现，而不管部件的基板厚度如何，而不仅限于焊接连接，而且还包括 可与其他安装和连接技术结合使用。 这些措施涉及组件，其包括至少一个电和/或微机械功能和至少一个布线层，其形成在部件基板的主表面上的层结构中，至少一个安装表面被实施在布线 以建立部件与支撑件的机械和/或电连接。 为此，至少一个安装表面是弹簧安装的，并且在至少一些区域中与层结构分离。

公开(公告)号：US20130341738A1

公开(公告)日：2013-12-26

申请号：US13921419

申请日：2013-06-19

申请人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81C1/00134 ,  B81B3/0018 ,  B81B7/007 ,  B81B2207/095

摘要： A method for manufacturing a component having an electrical through-connection includes: providing a semiconductor substrate having a front side and a back side opposite from the front side; producing, on the front side of the semiconductor substrate, an insulating trench which annularly surrounds a contact area; introducing an insulating material into the insulating trench; producing a contact hole on the front side of the semiconductor substrate by removing the semiconductor material surrounded by the insulating trench in the contact area; and depositing a metallic material in the contact hole.

摘要翻译： 一种用于制造具有电穿通连接的部件的方法包括：提供具有前侧和与前侧相对的后侧的半导体衬底; 在所述半导体衬底的前侧产生环形地围绕接触区域的绝缘沟槽; 将绝缘材料引入绝缘沟槽中; 通过去除由接触区域中的绝缘沟槽围绕的半导体材料，在半导体衬底的正面上产生接触孔; 以及在所述接触孔中沉积金属材料。

公开(公告)号：US20150054101A1

公开(公告)日：2015-02-26

申请号：US14467726

申请日：2014-08-25

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0078 ,  B81B7/0016 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00825

摘要： A micromechanical component comprising a substrate having a main plane of extension, comprising a movable element, and comprising a spring arrangement assemblage is provided, the movable element being attached to the substrate by way of the spring arrangement assemblage, the movable element being deflectable out of a rest position into a deflection position, the movable element encompassing a first sub-element and a second sub-element connected to the first sub-element, the first sub-element extending mainly along the main plane of extension of the substrate, the second sub-element extending mainly along a functional plane, the functional plane being disposed substantially parallel to the main plane of extension of the substrate, the functional plane being spaced away from the main plane of extension.

摘要翻译： 一种微机械部件，包括具有主平面延伸部的基板，包括可移动元件，并且包括弹簧装置组合件，所述可移动元件通过所述弹簧装置组合件附接到所述基板，所述可移动元件可偏转 静止位置进入偏转位置，所述可移动元件包围第一子元件和连接到第一子元件的第二子元件，第一子元件主要沿着基板的延伸主平面延伸，第二子元件 子元件主要沿着功能平面延伸，功能平面设置成基本上平行于基板延伸的主平面，功能平面与主延伸平面间隔开。

公开(公告)号：US20130189483A1

公开(公告)日：2013-07-25

申请号：US13744611

申请日：2013-01-18

申请人： Jochen REINMUTH ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Yvonne BERGMANN

IPC分类号： H05K13/00

CPC分类号： H05K13/00 ,  B81B2201/0264 ,  B81B2207/095 ,  B81C1/00301 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/4076 ,  H05K3/421 ,  H05K2201/068 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2924/00

摘要： A method is described for manufacturing a component having a through-connection. The method includes providing a substrate; forming a trench structure in the substrate, a substrate area which is completely surrounded by the trench structure being produced; forming a closing layer for closing off the trench structure, a cavity girded by the closing layer being formed in the area of the trench structure; removing substrate material from the substrate area surrounded by the closed-off trench structure; and at least partially filling the substrate area surrounded by the closed-off trench structure with a metallic material. A component having a through-connection is also described.

摘要翻译： 描述了用于制造具有贯通连接的部件的方法。 该方法包括提供基板; 在衬底中形成沟槽结构，被正被制造的沟槽结构完全包围的衬底区域; 形成用于封闭所述沟槽结构的封闭层，由所述封闭层围绕的腔体形成在所述沟槽结构的区域中; 从由封闭沟槽结构包围的衬底区域中去除衬底材料; 并且用金属材料至少部分地填充由封闭沟槽结构包围的衬底区域。 还描述了具有贯通连接的部件。

公开(公告)号：US20120133003A1

公开(公告)日：2012-05-31

申请号：US13298753

申请日：2011-11-17

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： H01L29/84

CPC分类号： B81C1/00246 ,  B81B2201/0235 ,  B81B2203/053 ,  B81C2203/0735 ,  B81C2203/0742 ,  G01P15/0802 ,  G01P15/125

摘要： A micromechanical component includes: a substrate having a multitude of trench structures which separate a first and a second mass element of the substrate from a web element of the substrate, in such a way that the first and second mass elements enclose the web element along an extension direction of the main surface of the substrate and are disposed to allow movement relative to the substrate in the direction of a surface normal of the main surface; a first electrode layer applied on the main surface of the substrate and forms a first electrode on the web element between the first and second mass elements; and a second electrode layer applied on the first and second mass elements and forming a self-supporting second electrode above the first electrode in the area of the web element, the first and second electrode forming a capacitance.

摘要翻译： 微机械部件包括：具有多个沟槽结构的衬底，其将衬底的第一和第二质量元件与衬底的腹板元件分开，使得第一和第二质量元件沿着 并且被设置为允许在主表面的法线方向上相对于基板的移动; 施加在所述基板的主表面上的第一电极层，并且在所述网状元件上在所述第一和第二质量元件之间形成第一电极; 以及施加在所述第一和第二质量元件上的第二电极层，并且在所述网状元件的区域中在所述第一电极的上方形成自支撑的第二电极，所述第一和第二电极形成电容。

公开(公告)号：US20100327883A1

公开(公告)日：2010-12-30

申请号：US12814160

申请日：2010-06-11

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： G01R27/26

CPC分类号： G01L9/0072

摘要： A measuring device has a sensor unit and an evaluation unit which is electrically isolated from the sensor unit by a partition wall. The sensor unit includes a first capacitive sensor which is electrically connected to a first coil to form a first oscillating circuit, and a reference capacitor which is electrically connected to a second coil to form a second oscillating circuit. The evaluation unit includes a third coil which is inductively coupled to the first coil and the second coil, and the evaluation unit is designed to determine and output a beat frequency of a beat signal which is inductively injected into the third coil by the first oscillating circuit and the second oscillating circuit.

摘要翻译： 测量装置具有传感器单元和评估单元，其通过分隔壁与传感器单元电隔离。 传感器单元包括电连接到第一线圈以形成第一振荡电路的第一电容传感器和电连接到第二线圈以形成第二振荡电路的参考电容器。 评估单元包括电感耦合到第一线圈和第二线圈的第三线圈，并且评估单元被设计为确定并输出由第一振荡电路感应注入到第三线圈中的差拍信号的拍频 和第二振荡电路。

公开(公告)号：US20130209672A1

公开(公告)日：2013-08-15

申请号：US13763223

申请日：2013-02-08

申请人： Jochen REINMUTH ,  Frank SCHNELL ,  Heribert WEBER ,  Erhard HIRTH ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Frank SCHNELL ,  Heribert WEBER ,  Erhard HIRTH ,  Yvonne BERGMANN

IPC分类号： H05K3/00

CPC分类号： H05K3/0094 ,  B81B2201/0235 ,  B81B2207/096 ,  B81C1/00301 ,  H01L21/743 ,  H01L21/76898 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2924/1461 ,  H05K3/4061 ,  H05K2201/09563 ,  H01L2924/00

摘要： A method for manufacturing a component having a through-connection. The method includes providing a semiconductor substrate, forming a recess in the semiconductor substrate, and introducing into the recess a pourable starting material which has a metal. The method furthermore includes carrying out a heating process, an electrically conductive structure forming the through-connection being developed from the pourable starting material.

摘要翻译： 一种用于制造具有通过连接的部件的方法。 该方法包括提供半导体衬底，在半导体衬底中形成凹陷，并将具有金属的可倾倒起始材料引入凹槽中。 该方法还包括进行加热过程，形成从可倾倒起始材料形成的贯通连接的导电结构。

公开(公告)号：US20120248931A1

公开(公告)日：2012-10-04

申请号：US13431613

申请日：2012-03-27

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： H02N1/00 ,  H02K15/00

CPC分类号： B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0264 ,  G01L9/0005 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0831 ,  Y10T29/49009

摘要： A micromechanical component is described having a substrate which has at least one stator electrode fixedly mounted with respect to the substrate, a movable mass having at least one actuator electrode fixedly mounted with respect to the movable mass, and at least one spring via which the movable mass is displaceable. The movable mass is structured from the substrate with the aid of at least one separating trench, at least one outer stator electrode spans at least one section of the at least one separating trench and/or of the movable mass, the at least one actuator electrode protrudes between the at least one outer stator electrode and the substrate, and at least one inner stator electrode protrudes between the at least one actuator electrode and the substrate. A related manufacturing method is also described for a micromechanical component.

摘要翻译： 描述了一种微机械部件，其具有相对于基板固定地安装有至少一个定子电极的基板，具有至少一个致动器电极相对于可移动质量块固定地安装的可移动质量块，以及至少一个弹簧， 质量是可移位的。 借助于至少一个分离沟槽，可移动质量体由衬底构成，至少一个外部定子电极跨越至少一个分离沟槽和/或可移动质量块的至少一个部分，至少一个致动器电极 突出在所述至少一个外部定子电极和所述基板之间，并且至少一个内部定子电极在所述至少一个致动器电极和所述基板之间突出。 还描述了用于微机械部件的相关制造方法。